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STM32F100ZET6BTR

STMicroelectronics

STM32F100ZET6BTR by STMicroelectronics

STM32F100ZET6BTR by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 24 MHz. It features 16 ADC channels and 12 DMA channels, suitable for industrial applications requiring high-speed data processing and connectivity via I2C, SPI, UART interfaces.

Median Price

$11.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 370 parts In-Stock

1+ parts

$11.990

100+ parts

$7.720

1k+ parts

$5.890

10k+ parts

-

370

$11.990

$7.720

$5.890

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,603 parts In-Stock

1+ parts

$10.098

100+ parts

-

1k+ parts

-

10k+ parts

-

2,603

$10.098

-

-

-

Vyrian

USA . 7,188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,188

-

-

-

-

Anansix

USA . 2,832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,832

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,500 parts In-Stock

1+ parts

$5.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

$5.770

-

-

-

Corphita

USA . 2,389 parts In-Stock

1+ parts

$9.567

100+ parts

-

1k+ parts

-

10k+ parts

-

2,389

$9.567

-

-

-

IDEA Electronic Components Group

UK . 164 parts In-Stock

1+ parts

$77.341

100+ parts

-

1k+ parts

$69.607

10k+ parts

-

164

$77.341

-

$69.607

-

MKK Technologies

India . 926 parts In-Stock

1+ parts

$145.434

100+ parts

-

1k+ parts

-

10k+ parts

-

926

$145.434

-

-

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DigiPath Technology Company

USA . 926 parts In-Stock

1+ parts

$145.434

100+ parts

-

1k+ parts

-

10k+ parts

-

926

$145.434

-

-

-

Parana Technologies

USA . 907 parts In-Stock

1+ parts

-

100+ parts

$92.473

1k+ parts

-

10k+ parts

-

907

-

$92.473

-

-

Overview

Unlock endless possibilities with the STM32F100ZET6BTR microcontroller by STMicroelectronics. This powerful device boasts a 32-bit architecture, extensive peripherals, and industrial-grade reliability. Perfect for a wide range of applications, from smart home devices to industrial automation systems. With its low profile and fine pitch package, this microcontroller offers high performance in a compact design. Experience the seamless integration, efficiency, and innovation that only STMicroelectronics can deliver. Elevate your projects with the STM32F100ZET6BTR and see your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various voltage requirements in different systems.

Bit Size: 32

A 32-bit architecture enables this microcontroller to process data and perform tasks efficiently, making it suitable for complex applications that require high performance.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its energy efficiency and high performance, making it a reliable choice for demanding applications that require fast processing speeds.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows the microcontroller to interface with analog sensors and devices, expanding its functionality in applications that require analog inputs.

DMA Channels: YES

Direct Memory Access channels enable fast and efficient data transfer between peripherals and memory, improving overall system performance and responsiveness.

ROM Words: 524288

With a large ROM capacity of 524288 words, this microcontroller can store a significant amount of program code and data, making it suitable for applications that require extensive program storage.

RAM Bytes: 32768

The 32768 bytes of RAM provide ample memory for data storage and manipulation, facilitating efficient operation of the microcontroller in a wide range of applications.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency of 24 MHz allows the microcontroller to execute instructions quickly, making it suitable for applications that require fast processing speeds.

Connectivity: HDMI-CEC, I2C(2), IRDA, LIN, SPI(3), UART(2), USART(3)

A wide range of connectivity options including I2C, SPI, UART, and USART interfaces enable seamless communication with other devices and peripherals, enhancing the versatility of the microcontroller in various applications.

Technical Specifications

Microcontrollers STM32F100ZET6BTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of DMA Channels:

12

No. of I/O Lines:

112

No. of Terminals:

144

No. of Timers:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

19.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C(2), IRDA, LIN, SPI(3), UART(2), USART(3)

Peripherals:

DMA(12), POR, RTC, TIMER(16)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F100ZET6BTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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