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STM32F078CBY6TR

STMicroelectronics

STM32F078CBY6TR by STMicroelectronics

STM32F078CBY6TR by STMicroelectronics is a 32-bit microcontroller with 36 I/O lines, 32 MHz clock frequency, and ADC/DMA channels. It features a rectangular package style with a grid array and very thin profile. Ideal for applications requiring high-speed processing and precise analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,758 parts In-Stock

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Anansix

USA . 2,402 parts In-Stock

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Digiode

USA . 2,258 parts In-Stock

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SPM Sales

USA . 175 parts In-Stock

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175

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Distributors (Availability)

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AZTECH Wire

Italy . 381 parts In-Stock

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$18.670

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381

$18.670

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IDEA Electronic Components Group

UK . 662 parts In-Stock

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$53.189

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$47.870

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662

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$47.870

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MKK Technologies

India . 1,687 parts In-Stock

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$100.018

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DigiPath Technology Company

USA . 1,687 parts In-Stock

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$100.018

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Vigor

Singapore . 3,270 parts In-Stock

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Corphita

USA . 2,556 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 405 parts In-Stock

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$63.595

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Component Stockers USA

USA . 396 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32F078CBY6TR microcontroller by STMicroelectronics. Known for their high-quality components, STMicroelectronics delivers reliable performance and cutting-edge technology. Ideal for a wide range of applications, this microcontroller offers unmatched value and versatility. From IoT devices to consumer electronics, the STM32F078CBY6TR provides seamless integration, efficient power management, and superior processing capabilities. Experience the benefits of advanced features like ADC and DMA channels, PWM channels, and more, all in a compact package that is easy to integrate. Elevate your designs with the STM32F078CBY6TR today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.944 V

Efficient power management with a low maximum supply voltage.

Package Shape: RECTANGULAR

Standard package shape for easy integration into designs.

Bit Size: 32

High bit size allows for complex data processing and calculations.

No. of Terminals: 49

Sufficient terminals for connectivity and interfacing with other components.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact package style for dense PCB layouts and high performance.

Minimum Supply Voltage: 1.656 V

Low minimum supply voltage for energy-efficient operation.

ADC Channels: YES

Analog-to-digital converter channels for accurate sensor data readings.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal position for easy soldering and connection.

Width: 3.151 mm

Narrow width for compact designs and space optimization.

Maximum Clock Frequency: 32 MHz

High clock frequency for rapid data processing and responsiveness.

Length: 3.417 mm

Short length for small form factor applications and board space savings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient instruction execution and performance.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for easy soldering and robust connection.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent operation.

PWM Channels: YES

Pulse-width modulation channels for precise control of output signals.

Terminal Pitch: 0.4 mm

Fine terminal pitch for high-density mounting and connectivity.

Speed: 48 rpm

Operational speed of 48 rpm for precise timing and control applications.

No. of I/O Lines: 36

Sufficient input/output lines for versatile connectivity and interfacing.

Technical Specifications

Microcontrollers STM32F078CBY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

3.417 mm

No. of I/O Lines:

36

No. of Terminals:

49

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

48 rpm

Maximum Supply Voltage:

1.944 V

Minimum Supply Voltage:

1.656 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.151 mm

Peripheral IC Type:

Trade Compliance

STM32F078CBY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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