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STM32F050K4U6A

STMicroelectronics

STM32F050K4U6A by STMicroelectronics

STM32F050K4U6A by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 32 MHz. It features 10-Ch 12-Bit ADC channels and offers connectivity options like I2C, SPI, USART. With a wide temperature range from -40 to 85 °C, it is ideal for industrial applications requiring high-speed processing and multiple PWM channels.

Median Price

$0.984

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$0.984

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Vyrian

USA . 5,896 parts In-Stock

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Digiode

USA . 3,221 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 441 parts In-Stock

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Bristol Electronics

USA . 441 parts In-Stock

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Dan-Mar Components

USA . 441 parts In-Stock

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Anansix

USA . 440 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 392 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 138 parts In-Stock

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$0.984

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138

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Argo Parts USA

USA . 2,817 parts In-Stock

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$0.984

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Netroflash

USA . 1,000 parts In-Stock

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$0.984

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$0.935

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$0.915

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$0.984

-

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$0.915

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.014

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$0.963

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$0.963

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$1.014

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$0.963

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Semicontronic

India . 1,170 parts In-Stock

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$7.000

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$6.825

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$6.790

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Microchip USA

USA . 348 parts In-Stock

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$7.458

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AZTECH Wire

Italy . 807 parts In-Stock

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$9.039

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Aztec Data Supply Inc.

USA . 147 parts In-Stock

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$32.030

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Ampacity Inc.

Singapore . 1,043 parts In-Stock

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$33.000

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$33.000

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IDEA Electronic Components Group

UK . 1,710 parts In-Stock

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$35.789

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$32.210

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MKK Technologies

India . 105 parts In-Stock

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$67.299

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DigiPath Technology Company

USA . 105 parts In-Stock

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$67.299

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Lixinc

USA . 12,888 parts In-Stock

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Vigor

Singapore . 4,501 parts In-Stock

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RC Electronics

USA . 3,240 parts In-Stock

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Parana Technologies

USA . 1,269 parts In-Stock

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$42.791

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Corphita

USA . 851 parts In-Stock

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Perfect Parts

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Assy Fe

Spain . 11 parts In-Stock

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Overview

Unlock the power of innovation with the STM32F050K4U6A microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products that exceed expectations. Ideal for a wide range of applications, this microcontroller offers unmatched performance and reliability. With advanced features like ADC and DMA channels, as well as connectivity options like I2C and SPI, customers can create cutting-edge solutions with ease. Experience the value and benefits of the STM32F050K4U6A and take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes it easy to integrate into PCB designs and saves space.

Maximum Supply Voltage: 3.6 V

Can operate at a relatively high supply voltage, increasing robustness and flexibility in power supply design.

Package Shape: SQUARE

Square package shape allows for easy and compact placement on PCBs.

Bit Size: 32

32-bit architecture provides high performance and processing capabilities.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, offering flexibility in design and compatibility.

No. of Terminals: 32

Sufficient number of terminals for connecting various external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles available for different application requirements and thermal management needs.

Minimum Supply Voltage: 2 V

Can operate at low supply voltages, saving power and enabling battery-powered applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

CPU Family: CORTEX-M0

Part of the energy-efficient and cost-effective ARM Cortex-M0 family of processors.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, suitable for a wide range of environments.

ADC Channels: YES

Built-in analog-to-digital converters for sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and handling.

Terminal Position: QUAD

Quad terminal position for easy PCB layout and connection.

ROM Words: 16384

Large ROM size for storing code and data.

Maximum Seated Height: 0.6 mm

Low profile package design for space-constrained applications.

Width: 5 mm

Compact width for easy integration and placement on PCBs.

Technical Specifications

Microcontrollers STM32F050K4U6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

INTERNAL 3-CH ADC IS ALSO AVAILABLE

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

27

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

23.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, IRDA, LIN, SPI, USART

Peripherals:

CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F050K4U6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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