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STM32F050C4T6A

STMicroelectronics

STM32F050C4T6A by STMicroelectronics

STM32F050C4T6A microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 10 ADC channels. With industrial-grade temperature tolerance (-40 °C to 85 °C), it's ideal for embedded applications. Its compact design supports various connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,469 parts In-Stock

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4,469

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Digiode

USA . 4,206 parts In-Stock

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4,206

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ComSIT Distribution GmbH

Germany . 1,495 parts In-Stock

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1,495

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Anansix

USA . 599 parts In-Stock

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599

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,646 parts In-Stock

1+ parts

$2.830

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1,646

$2.830

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AZTECH Wire

Italy . 472 parts In-Stock

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$12.320

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472

$12.320

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IDEA Electronic Components Group

UK . 1,470 parts In-Stock

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$14.851

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-

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$13.366

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1,470

$14.851

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$13.366

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MKK Technologies

India . 1,628 parts In-Stock

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$27.926

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1,628

$27.926

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DigiPath Technology Company

USA . 1,628 parts In-Stock

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$27.926

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1,628

$27.926

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Component Stockers USA

USA . 310 parts In-Stock

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$99.990

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310

$99.990

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Lixinc

USA . 15,487 parts In-Stock

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15,487

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Microchip USA

USA . 4,074 parts In-Stock

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4,074

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Parana Technologies

USA . 2,265 parts In-Stock

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$17.756

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2,265

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$17.756

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Corphita

USA . 1,721 parts In-Stock

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Perfect Parts

USA . 813 parts In-Stock

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Overview

Elevate your projects with the STM32F050C4T6A microcontroller from STMicroelectronics—where quality meets innovation! Renowned for reliability and performance, this versatile 32-bit MCU is perfect for a wide range of applications, from industrial automation to smart devices. Experience seamless connectivity and robust features that enhance efficiency and empower creativity. With STMicroelectronics’ commitment to excellence, you can trust that your designs will thrive in any environment!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliable performance and protection from environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design, reducing PCB space and improving manufacturing efficiency.

Maximum Supply Voltage: 3.6 V

This maximum voltage level is ideal for low-power applications, ensuring energy efficiency.

Package Shape: SQUARE

The square package shape helps in better thermal performance and easier alignment on PCBs.

Bit Size: 32

The 32-bit architecture provides significant computational capabilities, facilitating complex algorithms and data processing.

Power Supplies (V): 2.5/3.3

Supports a range of supply voltages, making it versatile for different circuits and applications.

No. of Terminals: 48

The 48 terminals allow for extensive connectivity and interfacing possibilities for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design enables closer placement on PCBs, optimizing space and allowing for more compact devices.

Minimum Supply Voltage: 2 V

The minimum voltage guarantee enhances compatibility with various battery-operated systems, extending their usage.

Maximum Operating Temperature: 85 °C

This high temperature tolerance ensures reliable operation in demanding environments, enhancing durability.

CPU Family: CORTEX-M0

The ARM Cortex-M0 offers excellent performance-per-watt, facilitating efficient execution of tasks.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes it suitable for industrial and outdoor applications.

ADC Channels: YES

Integrated ADC channels provide easy data acquisition from analog sensors, enhancing versatility.

DMA Channels: YES

Direct Memory Access (DMA) enhances data transfer efficiency, freeing up CPU time for other tasks.

Terminal Position: QUAD

Quad terminal positioning allows for better pin accessibility and simplifies routing on PCBs.

ROM Words: 16384

With 16K of ROM, it offers ample space for program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

The low seated height ensures compatibility with low-profile electronics design requirements.

Width: 7 mm

Compact width makes it suited for space-constrained applications, facilitating miniaturization.

Peripherals: CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Rich set of built-in peripherals reduces additional components, simplifying circuit design.

Maximum Clock Frequency: 32 MHz

With a high clock frequency, it can handle real-time processing and control tasks effectively.

Length: 7 mm

Small length contributes to the overall compactness of the device, enabling tight layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontrollers based on RISC architecture offer efficient performance and low power consumption.

RAM Bytes: 4096

4KB of RAM provides a good balance for data storage and processing needs in embedded applications.

Technology: CMOS

CMOS technology enhances power efficiency, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing structure offers reliable soldering and ease of assembly on PCBs.

Analog To Digital Converters: 10-Ch 12-Bit

The included high-resolution ADCs enable precise conversion of analog signals to digital form.

Maximum Supply Current: 23.2 mA

Moderate supply current ensures prolonged device life, especially in battery-operated applications.

Nominal Supply Voltage: 3.3 V

Standard nominal voltage allows for compatibility with commonly used power sources in electronics.

PWM Channels: YES

Presence of PWM channels allows for efficient control of motors and other actuators.

Connectivity: I2C, I2S, IRDA, LIN, SPI, USART

Versatile connectivity options ensure integration with a wide range of devices and communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications in firmware, enhancing device longevity.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for more I/O connections in a compact footprint, facilitating complex designs.

Speed: 48 rpm

Operating at this speed can ensure efficient handling of applications that require rotational movement.

On Chip Program ROM Width: 8

8-bit width for program ROM improves compatibility with various data handling needs for embedded systems.

No. of I/O Lines: 39

39 I/O lines provide ample interfacing capabilities, allowing for integration with multiple peripherals.

Technical Specifications

Microcontrollers STM32F050C4T6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

INTERNAL 3-CH ADC IS ALSO AVAILABLE

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

39

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

23.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, IRDA, LIN, SPI, USART

Peripherals:

CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F050C4T6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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