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STM32F042C6U6TR

STMicroelectronics

STM32F042C6U6TR by STMicroelectronics

STM32F042C6U6TR by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features 10 ADC channels, 7 timers, and 6144 bytes of RAM. Ideal for industrial applications requiring CAN, I2C, SPI connectivity and a max supply voltage of 3.6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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J2 Sourcing AB

Sweden . 63,200 parts In-Stock

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63,200

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Vyrian

USA . 7,161 parts In-Stock

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7,161

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Digiode

USA . 3,849 parts In-Stock

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3,849

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Anansix

USA . 971 parts In-Stock

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971

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Vigor

Singapore . 4,924 parts In-Stock

1+ parts

$1.780

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4,924

$1.780

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Microchip USA

USA . 4,306 parts In-Stock

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$13.639

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4,306

$13.639

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AZTECH Wire

Italy . 581 parts In-Stock

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$16.340

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581

$16.340

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IDEA Electronic Components Group

UK . 1,907 parts In-Stock

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$49.666

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$44.700

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1,907

$49.666

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$44.700

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MKK Technologies

India . 317 parts In-Stock

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$93.394

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317

$93.394

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DigiPath Technology Company

USA . 317 parts In-Stock

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$93.394

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317

$93.394

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Lixinc

USA . 2,870 parts In-Stock

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2,870

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Parana Technologies

USA . 1,272 parts In-Stock

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$59.384

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1,272

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Corphita

USA . 101 parts In-Stock

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Overview

Discover the STM32F042C6U6TR by STMicroelectronics, a top-quality microcontroller perfect for industrial applications. With a maximum clock frequency of 32 MHz and a wide range of peripherals including PWM and DMA channels, this chip provides unparalleled performance and flexibility. STMicroelectronics, a trusted manufacturer known for innovation and reliability, ensures that this product delivers value and benefits to customers looking for advanced solutions. From temperature sensing to data processing, this microcontroller offers cutting-edge technology in a compact package, making it an essential component for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this microcontroller suitable for mass production.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power supply options for different applications.

Package Shape: SQUARE

Square package shape facilitates easier layout and routing on PCBs, optimizing space usage.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance for demanding applications.

No. of Terminals: 48

Sufficient number of terminals for connecting to various external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers different package styles to suit different design requirements and heat dissipation needs.

Minimum Supply Voltage: 2 V

Can operate at lower supply voltages, improving efficiency and reducing power consumption in low-power applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments with elevated temperatures.

CPU Family: CORTEX-M0

Belongs to the efficient and popular ARM Cortex-M0 CPU family known for its low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

Integrated Analog-to-Digital Converters enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and offload CPU tasks, improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, reducing the risk of disconnections or signal interference.

ROM Words: 32768

Sufficient ROM capacity for storing program instructions and data, enabling complex applications to be executed smoothly.

Maximum Seated Height: 0.65 mm

Low seated height allows for compact and slim device designs, suitable for space-constrained applications.

Width: 7 mm

Compact width enables easy integration into small form factor devices without compromising functionality.

Peripherals: CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Rich set of peripherals offer versatile connectivity and functionality enhancements for diverse applications.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast and responsive operations, suitable for real-time processing tasks.

Length: 7 mm

Compact length complements the width for an overall small footprint, ideal for portable and space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and streamlined instruction processing, enhancing overall system performance.

No. of Timers: 7

Multiple timers provide precise timing control for various functions and enable the microcontroller to manage multiple tasks concurrently.

RAM Bytes: 6144

Sufficient RAM capacity to store and process data efficiently, supporting multitasking and complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and industry standards, ensuring product safety and sustainability.

Analog To Digital Convertors: 10-Ch 12-Bit

Multiple high-resolution ADC channels enable precise analog signal conversion, essential for accurate sensor readings and data acquisition.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage simplifies power supply design and compatibility with common voltage sources.

PWM Channels: YES

Pulse Width Modulation channels support precise control of output signals, essential for applications like motor control and power management.

Connectivity: CAN, CEC, I2C, I2S, IRDA, LIN, SPI(2), USART(2), USB

Diverse connectivity options enable seamless integration with different communication protocols and interfaces, expanding the versatility of the microcontroller.

ROM Programmability: FLASH

Flash ROM technology allows for reprogrammability, facilitating firmware updates and customization without the need for external memory components.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs, optimizing board space usage and allowing for more compact designs.

Speed: 48 rpm

High speed capability ensures rapid data processing and execution of commands, essential for efficient system performance.

On Chip Program ROM Width: 8

Wide on-chip program ROM width allows for storing larger code segments, accommodating complex algorithms and applications.

No. of I/O Lines: 38

Abundance of I/O lines provides ample interfacing options for connecting to external devices and peripherals, enhancing system flexibility and scalability.

Technical Specifications

Microcontrollers STM32F042C6U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

INTERNAL 3-CH ADC IS ALSO AVAILABLE

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of DMA Channels:

0

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

7

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, CEC, I2C, I2S, IRDA, LIN, SPI(2), USART(2), USB

Peripherals:

CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F042C6U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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