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STM1404CTNJQ6F

STMicroelectronics

STM1404CTNJQ6F by STMicroelectronics

STM1404CTNJQ6F by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 2.2V to 3.6V and features a max temp of 85 °C. With its 16 terminals and very thin profile, it ensures efficient power support in space-constrained designs.

Median Price

$3.157

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 235 parts In-Stock

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$3.157

235

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$3.157

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Vyrian

USA . 3,847 parts In-Stock

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Anansix

USA . 1,186 parts In-Stock

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Digiode

USA . 1,079 parts In-Stock

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IDEA Electronic Components Group

UK . 1,109 parts In-Stock

1+ parts

$1.613

100+ parts

-

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$1.451

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1,109

$1.613

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$1.451

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MKK Technologies

India . 640 parts In-Stock

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$3.033

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640

$3.033

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DigiPath Technology Company

USA . 640 parts In-Stock

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$3.033

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640

$3.033

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QUARKTWIN TECHNOLOGY LTD

USA . 9,166 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Microchip USA

USA . 4,965 parts In-Stock

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Corphita

USA . 1,985 parts In-Stock

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Parana Technologies

USA . 563 parts In-Stock

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$1.928

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Perfect Parts

USA . 280 parts In-Stock

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Overview

Elevate your designs with the STM1404CTNJQ6F from STMicroelectronics, a leader in innovative power management solutions. This compact and efficient IC offers remarkable performance across industrial applications, ensuring reliability from -40 °C to 85 °C. With its robust design and low power consumption, it enhances your devices' efficiency while simplifying integration. Trust in STMicroelectronics for quality that drives success, empowering your projects with unmatched value and benefits.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for high-density board layouts, making it suitable for compact electronic applications.

Package Shape: SQUARE

The square package shape ensures efficient heat dissipation and facilitates easier integration into various PCB designs.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3 V is ideal for a wide range of low-voltage applications, enhancing compatibility with modern electronics.

Power Supplies (V): 2.5/3.3

Compatibility with 2.5V and 3.3V power supplies ensures versatility for different circuit configurations and standards.

No. of Terminals: 16

With 16 terminals, this IC provides sufficient connections for complex functionality while maintaining a compact footprint.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile package style is suitable for space-constrained applications, enhancing thermal management with added heat sink capabilities.

Maximum Operating Temperature: 85 °C

The ability to operate up to 85 °C makes this IC suitable for industrial applications where higher temperatures are common.

Minimum Operating Temperature: -40 °C

Supporting operation down to -40 °C ensures reliability in extreme environments, ideal for industrial and automotive applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish enhances solderability and provides good protection against oxidation, ensuring reliable connections.

Terminal Position: QUAD

The quad terminal positioning allows for flexible layout options on PCBs, optimizing space utilization.

Maximum Seated Height: 1 mm

A maximum seated height of 1 mm allows for exceedingly low-profile designs, crucial for applications requiring slim profiles.

Width: 3 mm

A width of 3 mm contributes to the compact form factor, making the IC suitable for miniaturized electronics.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is designed to efficiently manage and stabilize power supply systems.

Minimum Supply Voltage (Vsup): 2.2 V

A minimum supply voltage of 2.2 V expands its usability in low-power applications, increasing its versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing up to 30 seconds at peak reflow temperature simplifies manufacturing processes by accommodating standard soldering practices.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C satisfies high-temperature soldering requirements, enhancing compatibility with modern manufacturing.

Length: 3 mm

A length of 3 mm promotes compactness, making it a suitable choice for space-restricted designs.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC is built to withstand harsh environments, assuring durability and reliability.

Maximum Supply Current (Isup): 0.065 mA

The low maximum supply current indicates power efficiency, crucial for battery-operated devices and energy-saving designs.

Terminal Form: NO LEAD

The no lead design minimizes the footprint, allowing for closer placement of components which improves performance in compact designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for more terminals in a compact area, enhancing functionality without increasing size.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6 V provides flexibility for a variety of applications, accommodating higher voltage levels when needed.

Technical Specifications

Power Management ICs STM1404CTNJQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.065 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM1404CTNJQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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