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STM1061N36WX6F

STMicroelectronics

STM1061N36WX6F by STMicroelectronics

STM1061N36WX6F by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 0.7V to 6V, with a nominal threshold of +3.6V and supports temperatures from -40 °C to 85 °C. Its small outline package ensures efficient space utilization in electronic designs.

Median Price

$0.341

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,980 parts In-Stock

1+ parts

-

100+ parts

$0.341

1k+ parts

$0.283

10k+ parts

$0.252

2,980

-

$0.341

$0.283

$0.252

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,583 parts In-Stock

1+ parts

$0.364

100+ parts

-

1k+ parts

-

10k+ parts

-

2,583

$0.364

-

-

-

Vyrian

USA . 8,259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,259

-

-

-

-

Anansix

USA . 407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

407

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,325 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

-

6,325

$0.200

-

-

-

Corphita

USA . 2,169 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

-

10k+ parts

-

2,169

$0.345

-

-

-

Microchip USA

USA . 4,353 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

4,353

$2.907

-

-

-

IDEA Electronic Components Group

UK . 1,213 parts In-Stock

1+ parts

$4.380

100+ parts

-

1k+ parts

$3.942

10k+ parts

-

1,213

$4.380

-

$3.942

-

MKK Technologies

India . 620 parts In-Stock

1+ parts

$8.237

100+ parts

-

1k+ parts

-

10k+ parts

-

620

$8.237

-

-

-

DigiPath Technology Company

USA . 620 parts In-Stock

1+ parts

$8.237

100+ parts

-

1k+ parts

-

10k+ parts

-

620

$8.237

-

-

-

AZTECH Wire

Italy . 458 parts In-Stock

1+ parts

$14.060

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$14.060

-

-

-

Parana Technologies

USA . 1,993 parts In-Stock

1+ parts

-

100+ parts

$5.237

1k+ parts

-

10k+ parts

-

1,993

-

$5.237

-

-

Overview

Elevate your designs with the STM1061N36WX6F from STMicroelectronics—your trusted partner in innovative power management solutions. This compact and efficient IC enhances performance while ensuring reliability in various applications, from industrial automation to consumer electronics. With a wide operating temperature range and robust build quality, this product guarantees durability and optimal efficiency, empowering you to create smarter, more reliable devices that stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the IC suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic circuits, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient use of PCB space, offering flexibility in layout design for compact devices.

Power Supplies (V): 1/5

This versatile range makes the IC applicable in low-power applications as well as systems requiring higher voltages.

No. of Terminals: 3

The three-terminal setup simplifies circuit design, making it easier to integrate into various applications without excessive complexity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save valuable board space and enable high-density routing, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature supports reliability in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function in extremely low temperatures increases applicability in harsh environments and outdoor applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish ensures good solderability and enhances moisture resistance, improving the longevity and reliability of the IC.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout and design options, accommodating various configurations.

Maximum Seated Height: 1.12 mm

Low seated height aids in low-profile assembly, making it suitable for slim and compact devices.

Width: 1.3 mm

A narrow width promotes space-saving designs, perfect for miniaturized electronic applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit effectively meets the needs of various power management tasks, adding versatility to design.

Minimum Supply Voltage (Vsup): 0.7 V

The low minimum supply voltage expands the potential applications, particularly for battery-powered devices.

Length: 2.92 mm

Short length contributes to overall compactness, which is advantageous for small form factor electronic devices.

Nominal Threshold Voltage (V): +3.6V

A nominal threshold voltage ensures optimal performance for a wide range of electronic applications needing precise regulation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliability and stability in harsh operational environments, making it suitable for various industrial uses.

Maximum Supply Current (Isup): 0.0036 mA

Extremely low supply current enhances energy efficiency, crucial for battery-operated and low-power applications.

Terminal Form: GULL WING

Gull wing terminals provide effective solder joints and maximize surface area for reliable connections, improving overall performance.

Terminal Pitch: 0.96 mm

The terminal pitch is designed for compatibility with modern PCB layouts, providing ease of integration and assembly.

Maximum Supply Voltage (Vsup): 6 V

Supports a relatively high maximum supply voltage, making the IC versatile for various demanding applications.

Technical Specifications

Power Management ICs STM1061N36WX6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

THRESHOLDS IN 0.1V INCREMENTS FROM 1.6V TO 5.5V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1/5

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0036 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.96 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.6V

Width (mm):

1.3 mm

Trade Compliance

STM1061N36WX6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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