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STL110NS3LLH7

STMicroelectronics

STL110NS3LLH7 by STMicroelectronics

STL110NS3LLH7 by STMicroelectronics is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 480A IDM, 0.005 ohm RDS(on), and -55 °C Min Operating Temp. Its SINGLE configuration with BUILT-IN DIODE and DUAL Terminal Position make it suitable for various power management needs.

Median Price

$0.487

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 36 parts In-Stock

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-

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$0.487

36

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$0.487

Distributors (In-Stock)

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Digiode

USA . 530 parts In-Stock

1+ parts

$1.805

100+ parts

-

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530

$1.805

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ComSIT Distribution GmbH

Germany . 82,627 parts In-Stock

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82,627

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Vyrian

USA . 5,755 parts In-Stock

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5,755

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Anansix

USA . 229 parts In-Stock

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229

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IDEA Electronic Components Group

UK . 2,346 parts In-Stock

1+ parts

$1.378

100+ parts

-

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$1.240

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-

2,346

$1.378

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$1.240

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Corphita

USA . 3,315 parts In-Stock

1+ parts

$1.710

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3,315

$1.710

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.262

100+ parts

$2.058

1k+ parts

$1.855

10k+ parts

-

3,000

$2.262

$2.058

$1.855

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MKK Technologies

India . 625 parts In-Stock

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$2.592

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625

$2.592

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DigiPath Technology Company

USA . 625 parts In-Stock

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$2.592

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625

$2.592

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RC Electronics

USA . 9,000 parts In-Stock

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Epart123

USA . 9,000 parts In-Stock

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$1.090

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$1.090

9,000

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$1.090

$1.090

Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Kepictronics

USA . 5,786 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 3,138 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,417 parts In-Stock

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Parana Technologies

USA . 1,960 parts In-Stock

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$1.648

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1,960

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$1.648

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Overview

Elevate your power management capabilities with the STL110NS3LLH7 by STMicroelectronics. Crafted with precision and expertise, this N-channel Power FET offers exceptional performance in switching applications. With a unique single configuration including a built-in diode, this transistor provides unparalleled value and efficiency. Whether you're designing industrial equipment or automotive systems, this product delivers reliable operation and enhanced functionality. Trust STMicroelectronics to provide cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material helps in providing insulation and protection to the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient and efficient switching operations within the circuit, reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs and offers a compact footprint for space-saving layouts.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high current and voltage levels efficiently, making it ideal for power control circuits.

Maximum Pulsed Drain Current (IDM): 480 A

With a high maximum pulsed drain current rating, this FET can handle short-duration high-current loads without the risk of damage, ensuring robust performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low power consumption, high input impedance, and fast switching characteristics, making this FET suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) STL110NS3LLH7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

480 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL110NS3LLH7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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