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STH250N55F3-6

STMicroelectronics

STH250N55F3-6 by STMicroelectronics

STH250N55F3-6 by STMicroelectronics is a high-performance N-channel FET designed for efficient switching applications. It features a max drain current of 180 A, a breakdown voltage of 55 V, and operates at up to 175 °C. Ideal for power management in compact designs, it ensures reliable performance with minimal resistance.

Median Price

$2.878

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,980 parts In-Stock

1+ parts

$2.391

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-

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1,980

$2.391

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Chip1Stop

Japan . 1,980 parts In-Stock

1+ parts

$3.800

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1,980

$3.800

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Verical

USA . 1,980 parts In-Stock

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1,980

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DigiKey

USA . 980 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.878

10k+ parts

$2.710

980

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-

$2.878

$2.710

Distributors (In-Stock)

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Digiode

USA . 1,888 parts In-Stock

1+ parts

$2.271

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1,888

$2.271

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Vyrian

USA . 3,252 parts In-Stock

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$2.391

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3,252

$2.391

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R&J Components

USA . 980 parts In-Stock

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980

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Anansix

USA . 203 parts In-Stock

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203

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

1+ parts

$0.916

100+ parts

-

1k+ parts

$0.825

10k+ parts

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1,952

$0.916

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$0.825

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MKK Technologies

India . 1,848 parts In-Stock

1+ parts

$1.723

100+ parts

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1,848

$1.723

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DigiPath Technology Company

USA . 1,848 parts In-Stock

1+ parts

$1.723

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1,848

$1.723

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Corphita

USA . 469 parts In-Stock

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$2.152

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469

$2.152

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QUARKTWIN TECHNOLOGY LTD

USA . 14,357 parts In-Stock

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14,357

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 2,218 parts In-Stock

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2,218

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Parana Technologies

USA . 1,181 parts In-Stock

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$1.096

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1,181

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$1.096

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Alle Elektronik GmbH

Germany . 980 parts In-Stock

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980

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Overview

Elevate your designs with the STH250N55F3-6 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-channel Power FET ensures reliable switching in demanding applications, boasting exceptional efficiency and robust thermal performance. With its compact size and integrated diode, it simplifies your circuit design while maximizing power handling capabilities. Trust in STMicroelectronics for quality and innovation that empower your projects to achieve greater success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides good insulation, durability, and cost-effectiveness, making this FET reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically faster and have better performance characteristics in switching applications, offering improved efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against voltage spikes, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring high efficiency and fast operation in circuit designs.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, reducing manufacturing costs.

Minimum DS Breakdown Voltage: 55 V

A minimum breakdown voltage of 55V ensures safe operation in various voltage environments, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular package shape offers efficient space utilization on PCBs, allowing for denser designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and robust connections, enhancing reliability in electronic assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and reduced power consumption, ideal for modern electronic applications.

Maximum Pulsed Drain Current (IDM): 720 A

High pulsed drain current capability makes this FET suitable for demanding applications that require quick bursts of power.

Avalanche Energy Rating (EAS): 1000 mJ

A high avalanche energy rating means better handling of transient conditions, adding to the longevity and reliability of the device.

Maximum Drain Current (Abs) (ID): 180 A

With a maximum drain current of 180A, this FET can handle significant loads, making it suitable for high-power applications.

No. of Terminals: 6

Six terminals allow for versatile connections in circuits, providing flexibility in design.

Maximum Power Dissipation (Abs): 300 W

A high power dissipation rating enables the FET to operate efficiently in high-power scenarios without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style is ideal for space-constrained designs, allowing for increased density on circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high switching speeds, making this FET suitable for modern applications.

Maximum Operating Temperature: 175 °C

Operating at high temperatures allows this FET to perform reliably in harsh environments, expanding its application range.

Transistor Element Material: SILICON

Silicon provides excellent electrical properties and stability, contributing to the reliability and efficiency of the FET.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and corrosion resistance, leading to better long-term performance.

Maximum Drain Current (ID): 180 A

Reiterated maximum drain current ensures consistency in performance, reinforcing suitability for demanding applications.

Maximum Drain-Source On Resistance: 0.0026 ohm

Low on-resistance enhances efficiency by reducing power loss when the FET is in the 'on' state, leading to better overall performance.

Terminal Position: SINGLE

Single terminal position simplifies design integration and routing on PCB layouts.

Case Connection: DRAIN

Drain connection simplifies circuit design, allowing for more straightforward layout and integration.

Maximum Time At Peak Reflow Temperature (s): 30

Quick reflow time aids in efficient manufacturing processes without risking damage to components.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance ensures compatibility with various soldering processes, enhancing assembly reliability.

Technical Specifications

Power Field Effect Transistors (FET) STH250N55F3-6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

180 A

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

720 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STH250N55F3-6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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