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STH185N10F3-2

STMicroelectronics

STH185N10F3-2 by STMicroelectronics

STH185N10F3-2 by STMicroelectronics is a powerful N-channel MOSFET designed for high-efficiency applications. It supports a max drain current of 180 A, power dissipation of 315 W, and operates up to 175 °C. Ideal for power management in industrial systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Anansix

USA . 2,191 parts In-Stock

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Vyrian

USA . 2,176 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,980 parts In-Stock

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Digiode

USA . 1,317 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$0.490

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$0.446

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$0.402

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500

$0.490

$0.446

$0.402

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IDEA Electronic Components Group

UK . 1,462 parts In-Stock

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$1.082

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$0.974

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$1.082

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MKK Technologies

India . 1,014 parts In-Stock

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$2.034

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$2.034

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DigiPath Technology Company

USA . 1,014 parts In-Stock

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$2.034

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$2.034

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AZTECH Wire

Italy . 228 parts In-Stock

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$10.970

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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RC Electronics

USA . 26,700 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,278 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,643 parts In-Stock

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Corphita

USA . 3,035 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Parana Technologies

USA . 2,206 parts In-Stock

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$1.294

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2,206

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$1.294

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Authorized Procurement Solutions

USA . 91 parts In-Stock

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91

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Overview

Unlock exceptional performance with the STH185N10F3-2 N-channel Power FET from STMicroelectronics, a leader in semiconductor innovation. Designed for demanding applications, this robust component ensures reliability and efficiency, delivering up to 180 A of drain current. Its advanced MOS technology excels in high-temperature environments, making it ideal for power management in automotive, industrial, and consumer electronics. Experience quality and value that elevate your projects!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for easier control of current flow, making it suitable for high-speed switching applications.

Configuration: SINGLE

A single configuration enables simplified circuit design, which leads to lower costs and increased reliability.

Surface Mount: YES

Surface mount capability allows for compact designs and facilitates automated assembly processes in modern electronics.

Maximum Drain Current (Abs) (ID): 180 A

The high maximum drain current rating ensures the device can handle large load currents, making it ideal for demanding applications.

Maximum Power Dissipation (Abs): 315 W

With a maximum power dissipation of 315 W, this FET can manage thermal challenges effectively, improving reliability in high-power circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology is known for low power consumption and high input impedance, enhancing efficiency in various applications.

Maximum Operating Temperature: 175 °C

The high operating temperature rating allows the device to function reliably in extreme environments, extending its application range.

Maximum Drain Current (ID): 180 A

The redundancy of this specification emphasizes the robustness of the FET, especially for high-demand uses, ensuring consistent performance.

Technical Specifications

Power Field Effect Transistors (FET) STH185N10F3-2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

180 A

Maximum Drain Current (ID):

180 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STH185N10F3-2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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