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STGIB10CH60TS-X

STMicroelectronics

STGIB10CH60TS-X by STMicroelectronics

STGIB10CH60TS-X by STMicroelectronics is a hybrid AC motor controller designed for automotive applications. It operates b/w 13.5V and 18V, with a max output current of 30A and can withstand temperatures from -40 °C to 125 °C. Its compact design features a rectangular package with 26 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,485 parts In-Stock

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6,485

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Digiode

USA . 3,150 parts In-Stock

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3,150

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Anansix

USA . 1,606 parts In-Stock

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1,606

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,647 parts In-Stock

1+ parts

$4.829

100+ parts

-

1k+ parts

$4.346

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1,647

$4.829

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$4.346

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MKK Technologies

India . 892 parts In-Stock

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$9.081

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892

$9.081

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DigiPath Technology Company

USA . 892 parts In-Stock

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$9.081

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892

$9.081

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AZTECH Wire

Italy . 403 parts In-Stock

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$20.500

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403

$20.500

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Microchip USA

USA . 4,688 parts In-Stock

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4,688

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QUARKTWIN TECHNOLOGY LTD

USA . 3,379 parts In-Stock

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3,379

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,186 parts In-Stock

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2,186

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Parana Technologies

USA . 2,077 parts In-Stock

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$5.774

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2,077

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$5.774

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Overview

Elevate your motion control projects with the STGIB10CH60TS-X from STMicroelectronics, a trusted leader in innovative technology. Designed for automotive applications, this robust AC motor controller guarantees exceptional performance under extreme conditions, ensuring reliability from -40 °C to 125 °C. Its compact dual-terminal design offers versatility, making it an ideal choice for various motion control systems. Experience unmatched quality and efficiency that drives your success forward!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 15 V

A nominal supply voltage of 15 V ensures compatibility with a wide range of applications without the risk of under-voltage conditions.

Number of Terminals: 26

The high terminal count facilitates various functionalities and connections, enabling more sophisticated control and integration.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style supports advanced manufacturing processes, making it ideal for modern electronic applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability and operational stability in high-temperature environments.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C allows this product to function in extreme cold conditions, making it suitable for automotive and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning enhances the versatility of connections, providing designers with more layout options.

Maximum Seated Height: 6 mm

A low seated height of 6 mm allows for better integration into compact designs without compromising performance.

Width: 24 mm

The 24 mm width is ideal for fitting into a variety of enclosures, ensuring compatibility with different systems.

Other IC Type: AC MOTOR CONTROLLER

Being an AC motor controller makes this IC highly suitable for applications requiring precise motor control and efficiency.

Minimum Supply Voltage (Vsup): 13.5 V

With a minimum supply voltage of 13.5 V, the IC can maintain function even under varying supply conditions.

Length: 38 mm

The length of 38 mm balances size with functionality, making it practical for various design setups.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates it meets stringent automotive standards, ensuring durability and reliability in vehicles.

Maximum Supply Current (Isup): 10 mA

With a maximum supply current of only 10 mA, this unit is energy-efficient, helpful for battery-powered applications.

Maximum Output Current: 30 A

A high output current capability of 30 A is crucial for driving powerful motors, ensuring effective operation in demanding applications.

Technology: HYBRID

The hybrid technology combines the advantages of both analog and digital functionalities, enhancing performance and flexibility.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, improving reliability in applications subject to vibration or shock.

Maximum Supply Voltage (Vsup): 18 V

The ability to handle a maximum supply voltage of 18 V expands its usability in diverse power supply scenarios.

Technical Specifications

Motion Control ICs STGIB10CH60TS-X attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T26

Length:

38 mm

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

30 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

24 mm

Trade Compliance

STGIB10CH60TS-X Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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