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STFU15NM65N

STMicroelectronics

STFU15NM65N by STMicroelectronics

STFU15NM65N by STMicroelectronics is a N-CHANNEL FET with 650V DS breakdown voltage, 48A IDM, and 0.38 ohm max RDS(on). Ideal for switching applications in enhancement mode operation. Package body material PLASTIC/EPOXY, RECTANGULAR shape with THROUGH-HOLE terminals.

Median Price

$4.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 183 parts In-Stock

1+ parts

$4.390

100+ parts

$2.990

1k+ parts

$2.260

10k+ parts

$2.130

183

$4.390

$2.990

$2.260

$2.130

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,468 parts In-Stock

1+ parts

$4.170

100+ parts

-

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1,468

$4.170

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Vyrian

USA . 5,275 parts In-Stock

1+ parts

-

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5,275

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Anansix

USA . 170 parts In-Stock

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170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 82 parts In-Stock

1+ parts

$0.793

100+ parts

$0.722

1k+ parts

$0.650

10k+ parts

-

82

$0.793

$0.722

$0.650

-

IDEA Electronic Components Group

UK . 1,397 parts In-Stock

1+ parts

$0.847

100+ parts

-

1k+ parts

$0.763

10k+ parts

-

1,397

$0.847

-

$0.763

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MKK Technologies

India . 838 parts In-Stock

1+ parts

$1.593

100+ parts

-

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838

$1.593

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DigiPath Technology Company

USA . 838 parts In-Stock

1+ parts

$1.593

100+ parts

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838

$1.593

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Corphita

USA . 3,344 parts In-Stock

1+ parts

$3.951

100+ parts

-

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3,344

$3.951

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Microchip USA

USA . 9,047 parts In-Stock

1+ parts

$29.640

100+ parts

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9,047

$29.640

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Parana Technologies

USA . 1,047 parts In-Stock

1+ parts

-

100+ parts

$1.013

1k+ parts

-

10k+ parts

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1,047

-

$1.013

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Alle Elektronik GmbH

Germany . 750 parts In-Stock

1+ parts

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750

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Kepictronics

USA . 154 parts In-Stock

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154

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Overview

Unleash the power of innovation with the STFU15NM65N by STMicroelectronics, a top-quality Power Field Effect Transistor that guarantees unmatched performance and reliability. Designed with cutting-edge technology, this N-CHANNEL FET is perfect for various switching applications, offering a breakthrough in efficiency and functionality. With a built-in diode and a high DS breakdown voltage of 650V, this transistor ensures seamless operation and superior protection. Trust in STMicroelectronics for excellence in semiconductor solutions and experience the ultimate in power management with the STFU15NM65N. Elevate your projects to new heights with this exceptional component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher conductivity compared to P-channel FETs, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage of 650 V, this FET can handle high voltage applications with ease, ensuring reliable performance and safety.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation, making it ideal for power management in various electronic devices.

Maximum Pulsed Drain Current (IDM): 48 A

The high pulsed drain current rating of 48 A allows this FET to handle large surge currents, making it suitable for applications where high power handling is required.

Avalanche Energy Rating (EAS): 187 mJ

The high avalanche energy rating of 187 mJ ensures that this FET can withstand voltage spikes and transient events without damage, increasing the overall reliability of the device.

Maximum Drain Current (ID): 12 A

With a maximum drain current of 12 A, this FET can handle high continuous currents, making it suitable for applications where efficient power management is essential.

Maximum Drain-Source On Resistance: 0.38 ohm

The low drain-source on resistance of 0.38 ohm reduces power loss and improves efficiency in switching applications, making this FET an ideal choice for high-performance systems.

Technical Specifications

Power Field Effect Transistors (FET) STFU15NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

187 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

48 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STFU15NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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