Loading...

STEF05LJR

STMicroelectronics

STEF05LJR by STMicroelectronics

STEF05LJR by STMicroelectronics is a power management IC designed for automotive applications, operating b/w -40 °C and 125 °C. It features a very thin profile grid array package with 9 terminals and supports supply voltages from 4.5V to 8V. Ideal for compact designs, it ensures efficient power supply support in demanding environments.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,949 parts In-Stock

1+ parts

$1.260

100+ parts

$0.880

1k+ parts

$0.574

10k+ parts

$0.489

4,949

$1.260

$0.880

$0.574

$0.489

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,542 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

2,542

$1.197

-

-

-

Vyrian

USA . 789 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

-

10k+ parts

-

789

$1.260

-

-

-

Anansix

USA . 2,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,066

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,357 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

2,357

$0.520

-

-

-

Corphita

USA . 2,122 parts In-Stock

1+ parts

$1.134

100+ parts

-

1k+ parts

-

10k+ parts

-

2,122

$1.134

-

-

-

Microchip USA

USA . 6,541 parts In-Stock

1+ parts

$3.691

100+ parts

-

1k+ parts

-

10k+ parts

-

6,541

$3.691

-

-

-

IDEA Electronic Components Group

UK . 921 parts In-Stock

1+ parts

$17.178

100+ parts

-

1k+ parts

$15.460

10k+ parts

-

921

$17.178

-

$15.460

-

MKK Technologies

India . 433 parts In-Stock

1+ parts

$32.303

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$32.303

-

-

-

DigiPath Technology Company

USA . 433 parts In-Stock

1+ parts

$32.303

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$32.303

-

-

-

Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Parana Technologies

USA . 608 parts In-Stock

1+ parts

-

100+ parts

$20.539

1k+ parts

-

10k+ parts

-

608

-

$20.539

-

-

Overview

Unlock unparalleled performance with the STEF05LJR from STMicroelectronics, a cutting-edge Power Management IC designed for automotive applications. Its ultra-thin profile and robust temperature range make it ideal for demanding environments, ensuring reliability and efficiency. Leverage STMicroelectronics' reputation for quality and innovation to enhance your designs, delivering exceptional value and long-lasting benefits that drive success in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material choice ensures longevity and stability in performance, making it ideal for various applications.

Surface Mount: YES

Enables compact design and efficient use of space on the PCB, which is essential for modern electronics.

Package Shape: SQUARE

Square shape allows for easier integration into complex circuit designs and effective thermal management.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage level ensures compatibility with a wide range of devices and applications.

No. of Terminals: 9

Nine terminals provide ample connection points, facilitating various power management functions.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE

Very thin profile is perfect for space-constrained applications while maintaining performance.

Maximum Operating Temperature: 125 °C

High operating temperature rating ensures reliability in demanding environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Wide temperature range guarantees performance under extreme conditions, making it ideal for outdoor or harsh environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and integration, promoting efficient design practices.

Maximum Seated Height: 0.6 mm

Low profile design minimizes height on the PCB, contributing to the overall thickness reduction of electronic devices.

Width: 1.19 mm

Compact width enhances layout flexibility and increases design options for engineers.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Focus on power supply support makes it valuable for energy-efficient designs, crucial in modern electronics.

Minimum Supply Voltage (Vsup): 4.5 V

Allows operation at lower voltage levels, improving energy efficiency and expanding application possibilities.

Length: 1.19 mm

Short length promotes space-efficient designs that are especially important in compact electronic systems.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures compliance with rigorous standards, providing reliability and performance in vehicle applications.

Terminal Form: BALL

Ball terminal design enhances electrical connectivity and robustness, reducing the risk of failure.

Terminal Pitch: 0.4 mm

Narrow terminal pitch allows for denser packing of components, maximizing available board space.

Maximum Supply Voltage (Vsup): 8 V

Versatile supply voltage range can accommodate various applications, enhancing design flexibility.

Technical Specifications

Power Management ICs STEF05LJR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

JUNCTION TEMPERATURE CONSIDERED

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B9

Length:

1.19 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.19 mm

Trade Compliance

STEF05LJR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 18