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STEF05LAPUR

STMicroelectronics

STEF05LAPUR by STMicroelectronics

STEF05LAPUR from STMicroelectronics is a compact power management IC designed for automotive applications. It operates within a supply voltage range of 4.5V to 8V and withstands temperatures from -40 °C to 125 °C. Its small outline, no-lead design ensures efficient space utilization in modern electronics.

Median Price

$1.140

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,032 parts In-Stock

1+ parts

$1.140

100+ parts

-

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-

10k+ parts

-

3,032

$1.140

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-

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Vyrian

USA . 3,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,758

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-

-

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Anansix

USA . 817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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817

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,068 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

-

10k+ parts

-

2,068

$1.080

-

-

-

IDEA Electronic Components Group

UK . 1,760 parts In-Stock

1+ parts

$14.540

100+ parts

-

1k+ parts

$13.086

10k+ parts

-

1,760

$14.540

-

$13.086

-

MKK Technologies

India . 591 parts In-Stock

1+ parts

$27.341

100+ parts

-

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591

$27.341

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-

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DigiPath Technology Company

USA . 591 parts In-Stock

1+ parts

$27.341

100+ parts

-

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10k+ parts

-

591

$27.341

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 25,806 parts In-Stock

1+ parts

-

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1k+ parts

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25,806

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-

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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-

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Microchip USA

USA . 6,755 parts In-Stock

1+ parts

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6,755

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

1+ parts

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2,250

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-

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Parana Technologies

USA . 1,829 parts In-Stock

1+ parts

-

100+ parts

$17.384

1k+ parts

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1,829

-

$17.384

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-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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500

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Overview

Elevate your designs with the STEF05LAPUR from STMicroelectronics—a top-tier power management IC built for excellence. Renowned for quality and reliability, STMicroelectronics delivers cutting-edge technology that ensures optimal efficiency in automotive applications. Enjoy superior performance from a compact, heat-resistant package designed to thrive in extreme temperatures. Experience stability, longevity, and peace of mind in every project with this essential solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers durability and protection against environmental factors, making it suitable for diverse applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and better performance in automated assembly processes.

Package Shape: SQUARE

The square package shape enables efficient use of circuit board space, facilitating compact design and layout.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is standard for many applications, ensuring compatibility with a wide range of systems.

No. of Terminals: 10

Ten terminals allow for multiple connections, enhancing the functionality and integration of the IC in complex circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile design are ideal for space-constrained applications, optimizing layout without sacrificing performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this IC is suited for high-temperature environments, ideal for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this IC reliable for extreme conditions, particularly in automotive and outdoor electronics.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layouts and better thermal management in complex designs.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm allows for ultra-thin designs, making it highly adaptable for modern electronic devices.

Width: 3 mm

A width of 3 mm contributes to the compact form factor which is crucial in today's miniaturized electronic applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is highly relevant for managing power effectively in electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V ensures compatibility with a range of low-voltage systems, enhancing its versatility.

Length: 3 mm

The 3 mm length further complements its compact design, making integration into small layouts straightforward.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets stringent reliability and performance standards required in vehicles.

Terminal Form: NO LEAD

No lead terminal form helps in reducing space on the PCB and allows for efficient thermal performance.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is conducive for high-density designs, lending itself to advanced miniaturization techniques.

Maximum Supply Voltage (Vsup): 8 V

The ability to handle a maximum supply voltage of 8 V provides flexibility for various applications, ensuring widespread compatibility.

Technical Specifications

Power Management ICs STEF05LAPUR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

JUNCTION TEMPERATURE CONSIDERED

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

STEF05LAPUR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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