Loading...

STE10/100E

STMicroelectronics

STE10/100E by STMicroelectronics

STE10/100E by STMicroelectronics is a CMOS serial communication controller with a max data rate of 12.5 MBps and operates b/w -40 °C to 85 °C. It features a 32-bit address bus and supports PCI bus compatibility. Ideal for industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,247

-

-

-

-

Vyrian

USA . 3,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,006

-

-

-

-

Anansix

USA . 2,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,582

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,495 parts In-Stock

1+ parts

$54.612

100+ parts

-

1k+ parts

$49.151

10k+ parts

-

1,495

$54.612

-

$49.151

-

MKK Technologies

India . 1,964 parts In-Stock

1+ parts

$102.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,964

$102.695

-

-

-

DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

$102.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,964

$102.695

-

-

-

Corphita

USA . 2,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,257

-

-

-

-

Parana Technologies

USA . 37 parts In-Stock

1+ parts

-

100+ parts

$65.297

1k+ parts

-

10k+ parts

-

37

-

$65.297

-

-

Overview

Unlock seamless connectivity with the STMicroelectronics STE10/100E, a top-tier Serial Communication Controller designed for industrial applications. Renowned for its reliability and performance, STMicroelectronics empowers your projects with advanced features that ensure efficient data transfer at speeds up to 12.5 MBps. Operating flawlessly in challenging environments, the STE10/100E delivers unmatched value, making it the perfect choice for cutting-edge technology solutions. Elevate your designs with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, enabling more compact designs.

Maximum Supply Voltage: 3.46 V

The maximum supply voltage of 3.46 V provides flexibility in power supply options while ensuring reliable operation.

Address Bus Width: 32

A 32-bit address bus width enhances the ability to manage large data sets efficiently, improving performance in data-intensive applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various circuit layouts, ensuring versatility in design.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3 V optimizes power consumption and compatibility with most modern electronic systems.

No. of Terminals: 128

A high number of terminals allows for extensive connectivity options, supporting multiple functionalities in a single device.

Package Style (Meter): FLATPACK, FINE PITCH

The fine pitch flatpack style allows for high-density mounting on PCBs, making it ideal for compact and complex designs.

Minimum Supply Voltage: 3.14 V

The minimum supply voltage ensures stable operation across a range of conditions, enhancing reliability.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this product suitable for industrial applications in harsh environments.

Maximum Data Transfer Rate: 12.5 MBps

A data transfer rate of 12.5 MBps allows for quick and efficient data handling, suitable for high-speed applications.

Minimum Operating Temperature: -40 °C

Operating effectively in extreme cold conditions ensures reliability in various environmental settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances corrosion resistance and improves signal integrity, leading to better performance.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity options and simplifies assembly in multi-layer boards.

Maximum Seated Height: 3.4 mm

A low seated height allows for a sleek design, reducing the overall profile of devices.

Width: 14 mm

A compact width makes it easier to fit into various electronic products, maximizing design flexibility.

Data Encoding or Decoding Method: NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

Support for multiple encoding methods enhances compatibility with different communication protocols and systems.

External Data Bus Width: 32

A 32-bit external data bus allows for efficient data integration with other components, enhancing system performance.

Maximum Clock Frequency: 25 MHz

A high clock frequency of 25 MHz supports fast operation, suitable for real-time applications.

Length: 20 mm

The compact length saves space on PCBs, allowing for more compact designs or additional components.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees operation in demanding environments, ensuring longevity and reliability.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

As a serial IO/communication controller, this IC facilitates efficient communication in networks, enhancing device interconnectivity.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify surface mounting and improve solderability, enhancing assembly efficiency.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V optimizes performance while minimizing power consumption, making it energy-efficient.

Bus Compatibility: PCI

PCI bus compatibility ensures ease of integration with widely-used computer architectures and peripherals.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density connections, maximizing space utilization on PCBs.

Low Power Mode: YES

The presence of a low power mode helps conserve energy during periods of inactivity, extending device battery life.

Technical Specifications

Serial Communication Controllers STE10/100E attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

25 MHz

Data Encoding or Decoding Method:

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

32

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.67X.93,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.4 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.46 V

Minimum Supply Voltage:

3.14 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STE10/100E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2