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STE10/100

STMicroelectronics

STE10/100 by STMicroelectronics

STE10/100 by STMicroelectronics is a CMOS serial communication controller with a max data rate of 12.5 MBps and operates b/w 4.75V to 5.25V. It features a 32-bit address bus and supports PCI bus compatibility, ideal for LAN applications. Its compact flatpack design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,087 parts In-Stock

1+ parts

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3,087

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Anansix

USA . 2,607 parts In-Stock

1+ parts

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2,607

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Vyrian

USA . 2,136 parts In-Stock

1+ parts

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2,136

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Carlin Systems, Inc.

USA . 183 parts In-Stock

1+ parts

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183

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,296 parts In-Stock

1+ parts

$32.400

100+ parts

-

1k+ parts

$29.160

10k+ parts

-

2,296

$32.400

-

$29.160

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MKK Technologies

India . 1,379 parts In-Stock

1+ parts

$60.925

100+ parts

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1,379

$60.925

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DigiPath Technology Company

USA . 1,379 parts In-Stock

1+ parts

$60.925

100+ parts

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1,379

$60.925

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Corphita

USA . 4,173 parts In-Stock

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4,173

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Parana Technologies

USA . 626 parts In-Stock

1+ parts

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100+ parts

$38.739

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626

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$38.739

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Overview

Unlock seamless connectivity with the STE10/100 from STMicroelectronics, a leader in innovation and reliability. This advanced Serial Communication Controller ensures high-speed data transfer while maintaining low power consumption, making it ideal for commercial applications. Its compact design and robust performance enhance system efficiency, providing customers with unparalleled quality and value. Elevate your projects today with STMicroelectronics' trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern circuitry, optimizing space on PCBs.

Maximum Supply Voltage: 5.25 V

With a maximum supply voltage of 5.25V, this controller offers flexibility in power supply design without the risk of damage from over-voltage.

Address Bus Width: 32

A 32-bit address bus allows for efficient handling of larger memory addresses, suitable for high-performance applications.

Package Shape: RECTANGULAR

The rectangular package shape is standard and widely used, facilitating easier mounting and compatibility with existing designs.

Power Supplies (V): 5

Operating at a nominal voltage of 5V ensures compatibility with many common electronic devices and simplifies integration.

No. of Terminals: 128

Having 128 terminals provides ample connections for peripheral devices, enabling complex functionalities in communication systems.

Package Style (Meter): FLATPACK, FINE PITCH

The flatpack, fine pitch design allows for better signal integrity and improved performance in high-speed applications.

Minimum Supply Voltage: 4.75 V

A minimum supply voltage of 4.75V ensures reliable operation even in lower voltage scenarios, enhancing versatility.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70 °C allows this product to function effectively in warmer environments, making it suitable for industrial use.

Maximum Data Transfer Rate: 12.5 MBps

A high data transfer rate of 12.5 MBps ensures rapid communication between devices, which is essential for performance-driven applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this device can be utilized in standard indoor environments without performance issues.

Terminal Finish: TIN LEAD

Tin-lead terminal finishes facilitate better solderability and higher reliability in connections, important for long-term performance.

Terminal Position: QUAD

Quad terminal positioning provides improved layout options on PCBs, enhancing design flexibility and reducing manufacturing complexity.

Maximum Seated Height: 3.4 mm

A low seated height of 3.4 mm allows for a compact design profile, making it easier to fit in space-constrained applications.

Width: 14 mm

A width of 14 mm enables efficient space utilization on PCBs while still providing adequate power and signal connections.

Data Encoding or Decoding Method: BIPH-LEVEL(MANCHESTER)

Using Manchester encoding/decoding ensures robust data transfer, reducing errors in high-noise environments.

External Data Bus Width: 32

32-bit external data bus width enhances data handling capabilities, allowing for more complex data operations.

Maximum Clock Frequency: 33.33 MHz

A maximum clock frequency of 33.33 MHz supports high-speed processing, essential in applications requiring quick response times.

Length: 20 mm

With a length of 20 mm, this component strikes a balance between compactness and functionality, fitting well in modern designs.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates suitability for a range of typical operating environments, making it ideal for consumer electronics.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

As a specialized communication controller, it is optimized for handling serial ports, improving interoperability with LAN devices.

Technology: CMOS

CMOS technology ensures lower power consumption and improved performance, ideal for battery-powered and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and allow for easier visual inspection during manufacturing.

Nominal Supply Voltage: 5 V

A nominal voltage of 5V provides compatibility with a wide range of systems, ensuring ease of integration.

Bus Compatibility: PCI

PCI bus compatibility enables seamless integration into legacy systems, providing versatility for upgrading existing designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density layouts, essential for compact designs in modern electronics.

Low Power Mode: YES

The low power mode feature extends battery life in portable devices, making this product suitable for energy-sensitive applications.

Technical Specifications

Serial Communication Controllers STE10/100 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

33.33 MHz

Data Encoding or Decoding Method:

BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

32

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e0

Length:

20 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.67X.93,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.4 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STE10/100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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