Loading...

STDD15-07P6

STMicroelectronics

STDD15-07P6 by STMicroelectronics

STDD15-07P6 by STMicroelectronics is a compact microwave mixer diode featuring a max reverse voltage of 15V and low capacitance of 1pF. Its dual-element design ensures efficient signal processing in RF applications. Ideal for surface mount technology, it enhances performance in communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,071

-

-

-

-

Anansix

USA . 2,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,618

-

-

-

-

Digiode

USA . 802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

802

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,150 parts In-Stock

1+ parts

$0.105

100+ parts

-

1k+ parts

$0.094

10k+ parts

-

2,150

$0.105

-

$0.094

-

MKK Technologies

India . 1,423 parts In-Stock

1+ parts

$0.197

100+ parts

-

1k+ parts

-

10k+ parts

-

1,423

$0.197

-

-

-

DigiPath Technology Company

USA . 1,423 parts In-Stock

1+ parts

$0.197

100+ parts

-

1k+ parts

-

10k+ parts

-

1,423

$0.197

-

-

-

Corphita

USA . 2,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,155

-

-

-

-

Parana Technologies

USA . 1,765 parts In-Stock

1+ parts

-

100+ parts

$0.125

1k+ parts

-

10k+ parts

-

1,765

-

$0.125

-

-

Overview

Unlock exceptional performance with the STDD15-07P6 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality microwave mixer and detector diode is designed for reliability and efficiency, making it perfect for advanced communication systems and signal processing applications. Its compact surface mount design ensures seamless integration into your projects, providing unmatched value and enabling superior functionality that meets modern demands. Elevate your designs with a trusted component that combines durability, precision, and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to moisture, making it ideal for various applications.

Config: SEPARATE, 2 ELEMENTS

A separate configuration with two elements allows for enhanced performance and flexibility in design, making it suitable for diverse circuit requirements.

Surface Mount: YES

Being surface mount compatible promotes ease of integration into modern compact electronic systems, facilitating efficient PCB designs.

Maximum Diode Capacitance: 1 pF

With a low maximum diode capacitance, this product offers high-frequency performance, which is critical in microwave applications.

Package Shape: RECTANGULAR

The rectangular shape allows for optimal space utilization on PCBs, enabling compact and efficient circuit layouts.

No. of Terminals: 6

Having six terminals provides versatile connection options, allowing for improved integration with various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space usage on the substrate, beneficial for space-constrained applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures reliable soldering and longevity, reducing the risk of oxidation and improving performance over time.

Terminal Position: DUAL

Dual terminal positioning allows for better layout flexibility and improved thermal management in the application.

Diode Type: MIXER DIODE

As a mixer diode, this product is specifically designed for frequency conversion, making it essential for communication applications.

Terminal Form: FLAT

The flat terminal form facilitates easy soldering and better connection reliability, essential for performance in microwave applications.

No. of Elements: 2

Two elements enhance the mixing capability, allowing for efficient signal processing in RF/microwave circuits.

Maximum Repetitive Peak Reverse Voltage: 15 V

With a maximum repetitive peak reverse voltage of 15 V, this diode can handle significant voltage levels, ensuring reliable operation in demanding environments.

Diode Element Material: SILICON

Silicon as the diode element material ensures good thermal conductivity and reliability, making it suitable for high-frequency and temperature-sensitive applications.

Technical Specifications

Microwave Mixer & Detector Diodes STDD15-07P6 attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from STMicroelectronics

Specs

Config:

SEPARATE, 2 ELEMENTS

Maximum Diode Capacitance:

1 pF

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

15 V

Sub-Category:

Varactors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

STDD15-07P6 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5