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STD30PF03LT4

STMicroelectronics

STD30PF03LT4 by STMicroelectronics

STD30PF03LT4 by STMicroelectronics is a P-channel MOSFET designed for efficient switching applications. It features a max drain current of 24 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for compact power management in surface mount designs.

Median Price

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Lifecycle Status

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13

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Chip Stock

USA . 20,410 parts In-Stock

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Vyrian

USA . 5,481 parts In-Stock

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Prism Electronics

USA . 3,355 parts In-Stock

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Technoshack Inc.

Canada . 2,500 parts In-Stock

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2,500

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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Anansix

USA . 1,560 parts In-Stock

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Digiode

USA . 627 parts In-Stock

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Lantek

USA . 137 parts In-Stock

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ComSIT Distribution GmbH

Germany . 132 parts In-Stock

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Microfarads

USA . 106 parts In-Stock

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Bristol Electronics

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Classic Components Corporation

USA . 31 parts In-Stock

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Semtec, LLC

USA . 15 parts In-Stock

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IDEA Electronic Components Group

UK . 1,392 parts In-Stock

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$0.962

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$0.866

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MKK Technologies

India . 2,139 parts In-Stock

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$1.810

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DigiPath Technology Company

USA . 2,139 parts In-Stock

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AZTECH Wire

Italy . 1,090 parts In-Stock

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Component Stockers USA

USA . 283 parts In-Stock

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Perfect Parts

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Kepictronics

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Alle Elektronik GmbH

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Epart123

USA . 2,500 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Parana Technologies

USA . 1,260 parts In-Stock

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Corphita

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iodParts Technologies Inc.

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Overview

Unlock exceptional performance with the STD30PF03LT4 from STMicroelectronics, a leader in semiconductor innovation. This high-quality P-channel power FET is designed for efficient switching applications, offering robust reliability and impressive energy ratings. With its compact surface mount design and built-in diode, it seamlessly integrates into diverse applications—from power management to automotive systems—delivering unmatched value and reliability for your projects. Choose STMicroelectronics and elevate your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are excellent for high-side switching applications, making them versatile for various circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved performance and reliability in applications requiring reverse current protection.

Transistor Application: SWITCHING

Ideal for high-speed switching applications, providing efficient operation in power management scenarios.

Surface Mount: YES

Surface mount technology allows for compact designs and is suitable for high-density circuits.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V assures higher reliability in various circuit conditions.

Package Shape: RECTANGULAR

Rectangular packaging enhances placement efficiency on printed circuit boards (PCBs).

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering, improving assembly efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables this FET to provide better performance in switching applications.

Maximum Pulsed Drain Current (IDM): 96 A

A high pulsed drain current rating allows for handling large current spikes without failure.

Avalanche Energy Rating (EAS): 850 mJ

High avalanche energy rating signifies robustness against energy spikes, providing added operational safety.

Maximum Drain Current (Abs) (ID): 24 A

A maximum drain current of 24A supports demanding high-power applications.

No. of Terminals: 2

A simple 2-terminal design simplifies connection and integration into circuits.

Maximum Power Dissipation (Abs): 70 W

Ability to dissipate up to 70W ensures safe operation under heavy load conditions.

Package Style (Meter): SMALL OUTLINE

Small outline packaging aids in reducing PCB space, suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high efficiency, making this FET an energy-effective choice for power management.

Maximum Operating Temperature: 175 °C

High operating temperature limits extend application potential in harsh environments.

Transistor Element Material: SILICON

Silicon material ensures stability and reliability in a range of temperatures and conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish enhances solderability and ensures a reliable electrical connection.

Maximum Drain Current (ID): 24 A

This repeated specification reinforces the FET's capability to handle substantial continuous current.

Maximum Drain-Source On Resistance: 0.04 ohm

Low on-resistance minimizes energy loss and heat generation during operation, enhancing efficiency.

Terminal Position: SINGLE

Single terminal positioning supports straightforward integration into circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for compatibility with modern soldering techniques, ensuring easy assembly in manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature indicates compatibility with lead-free soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) STD30PF03LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD30PF03LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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