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STD100N03LT4

STMicroelectronics

STD100N03LT4 by STMicroelectronics

STD100N03LT4 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for high-performance power management in compact designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,804 parts In-Stock

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Digiode

USA . 791 parts In-Stock

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Anansix

USA . 556 parts In-Stock

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IDEA Electronic Components Group

UK . 1,034 parts In-Stock

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$1.472

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$1.325

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MKK Technologies

India . 1,249 parts In-Stock

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$2.768

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$2.768

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DigiPath Technology Company

USA . 1,249 parts In-Stock

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$2.768

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$2.768

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AZTECH Wire

Italy . 710 parts In-Stock

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$14.900

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710

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Kepictronics

USA . 5,050 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,736 parts In-Stock

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Corphita

USA . 3,476 parts In-Stock

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Parana Technologies

USA . 1,915 parts In-Stock

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Overview

Unlock exceptional performance with the STD100N03LT4 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET is engineered for efficiency and reliability, perfect for demanding applications like switching and power management. With its robust design and superior thermal performance, this transistor minimizes energy loss while maximizing output. Elevate your projects with a trusted component that blends quality, durability, and cutting-edge technology from a manufacturer known for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a lightweight and durable package, ensuring reliability in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency, making them suitable for high-current applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current, enhancing the safety and usability of the device in applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is efficient and effective in rapidly turning circuits on and off.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern circuit designs, saving space on PCBs.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures that the transistor can operate safely under higher voltage applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes the layout for electronic circuits and heat dissipation.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical stability in surface mount applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower standby power consumption, making it energy-efficient.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capability ensures the transistor can handle spikes in current without damage.

Avalanche Energy Rating (EAS): 500 mJ

The high avalanche energy rating offers solid protection against over-voltage conditions, improving reliability.

Maximum Drain Current (Abs) (ID): 70 A

This high maximum drain current rating allows for flexible use in demanding applications without risk of failure.

No. of Terminals: 2

With only two terminals, this FET simplifies design and reduces potential points of failure within the circuit.

Maximum Power Dissipation (Abs): 110 W

The ability to dissipate high power makes the FET suitable for applications that require robust performance under load.

Package Style (Meter): SMALL OUTLINE

The small outline form factor allows for compact designs, making it ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation and minimizes power loss, which is crucial for efficient designs.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows the FET to be utilized in demanding environments without failure.

Transistor Element Material: SILICON

Silicon's excellent electrical characteristics contribute to the overall performance and reliability of the FET.

Terminal Finish: Matte Tin (Sn)

Matte tin finish ensures good corrosion resistance and improves solderability during assembly.

Maximum Drain Current (ID): 80 A

The higher maximum drain current rating allows for effective use in high-power applications, ensuring robust performance.

Maximum Drain-Source On Resistance: 0.0055 ohm

The low on-resistance minimizes power loss and heat generation, improving the efficiency of the FET in operation.

Terminal Position: SINGLE

With a single terminal position, this design simplifies connections and integration within circuit boards.

Case Connection: DRAIN

The drain case connection allows for easy and effective heat management, extending the lifespan of the device.

Technical Specifications

Power Field Effect Transistors (FET) STD100N03LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD100N03LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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