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STA559BWQS

STMicroelectronics

STA559BWQS by STMicroelectronics

STA559BWQS by STMicroelectronics is a consumer IC designed for surface mount applications. It operates within a voltage range of 5-16V and features a compact size with 36 terminals in a rectangular package. Ideal for various electronic devices, it withstands temperatures from -20 °C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,829

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-

-

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Digiode

USA . 3,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,580

-

-

-

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Anansix

USA . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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481

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,463 parts In-Stock

1+ parts

$2.820

100+ parts

-

1k+ parts

$2.538

10k+ parts

-

1,463

$2.820

-

$2.538

-

MKK Technologies

India . 848 parts In-Stock

1+ parts

$5.302

100+ parts

-

1k+ parts

-

10k+ parts

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848

$5.302

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-

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DigiPath Technology Company

USA . 848 parts In-Stock

1+ parts

$5.302

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$5.302

-

-

-

Corphita

USA . 3,576 parts In-Stock

1+ parts

-

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3,576

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-

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Parana Technologies

USA . 2,047 parts In-Stock

1+ parts

-

100+ parts

$3.372

1k+ parts

-

10k+ parts

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2,047

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$3.372

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-

Overview

Elevate your designs with the STA559BWQS from STMicroelectronics—a trusted leader in innovative consumer ICs. This versatile chip marries exceptional quality with robust performance, ensuring your applications run smoothly across various environments. With its compact design and reliability, it’s ideal for everything from audio devices to smart home systems. Choose STA559BWQS for superior efficiency, seamless integration, and a proven edge in today’s competitive market!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, protecting the component from environmental stress.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and higher assembly speeds, making it a cost-effective choice for modern applications.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and allow for better thermal management, ideal for consumer electronics.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and optimal performance in everyday use.

Power Supplies (V): 5/16, 3.3

Versatility in power supply options allows for a range of designs and applications without the need for significant redesign.

No. of Terminals: 36

With 36 terminals, this IC enables complex functionalities and connections, supporting advanced features in consumer electronics.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline and heat sink design improves thermal performance and minimizes space, making it ideal for compact designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures stable performance in a variety of environments, suitable for consumer electronics.

Minimum Operating Temperature: -20 °C

The ability to operate at -20 °C allows the IC to function reliably in colder climates, increasing its applicability.

Terminal Position: DUAL

Dual terminal positioning enhances connection options and flexibility in circuit design, aiding in better integration.

Maximum Seated Height: 2.47 mm

A low seated height provides a compact form factor, which is crucial for space-constrained PCB layouts.

Width: 7.5 mm

Narrow width allows for high-density circuit designs, saving energy and reducing component footprint.

Minimum Supply Voltage (Vsup): 5 V

A minimum supply voltage of 5 V provides compatibility with various systems, allowing for greater design flexibility.

Length: 10.3 mm

Compact length supports tighter arrangements on PCBs, beneficial for portable consumer devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide robust mechanical strength, improving reliability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for higher pin density, supporting advanced engineering in compact devices.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage enables operation in a variety of applications, accommodating more power-hungry devices.

Technical Specifications

Other Function Consumer ICs STA559BWQS attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/16,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

STA559BWQS General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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