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STA550

STMicroelectronics

STA550 by STMicroelectronics

STA550 by STMicroelectronics is a 2-channel audio amplifier with a nominal output power of 70 W and operates within a supply voltage range of ±3/±17 V to 20/30 V. It features low harmonic distortion at 10% and supports temperatures from 0 °C to 70 °C. Ideal for high-quality audio applications, its compact design fits various setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,903 parts In-Stock

1+ parts

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3,903

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Digiode

USA . 1,000 parts In-Stock

1+ parts

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-

1k+ parts

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1,000

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Anansix

USA . 294 parts In-Stock

1+ parts

-

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294

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 487 parts In-Stock

1+ parts

$0.905

100+ parts

-

1k+ parts

$0.815

10k+ parts

-

487

$0.905

-

$0.815

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MKK Technologies

India . 1,559 parts In-Stock

1+ parts

$1.702

100+ parts

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1,559

$1.702

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DigiPath Technology Company

USA . 1,559 parts In-Stock

1+ parts

$1.702

100+ parts

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1,559

$1.702

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Microchip USA

USA . 323 parts In-Stock

1+ parts

$7.420

100+ parts

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323

$7.420

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AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$18.200

100+ parts

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478

$18.200

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Corphita

USA . 3,977 parts In-Stock

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3,977

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Vigor

Singapore . 3,432 parts In-Stock

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3,432

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Parana Technologies

USA . 572 parts In-Stock

1+ parts

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100+ parts

$1.082

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572

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$1.082

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Overview

Elevate your audio experience with the STA550 from STMicroelectronics, a trusted name in innovation and quality. This robust audio amplifier delivers powerful sound with remarkable clarity, making it perfect for diverse applications—from home theater systems to professional audio setups. With ST's commitment to excellence, enjoy enhanced performance, reliability, and efficiency, ensuring every note resonates beautifully. Choose STA550 for unmatched audio brilliance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and lightweight design, making installation easier and enhancing reliability.

Package Shape: RECTANGULAR

The rectangular shape is optimized for compact designs, allowing for efficient use of space in audio and video setups.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio applications, this amplifier provides high-quality sound reproduction, making it ideal for enhancing audio experiences.

Harmonic Distortion: 10%

With a reasonable harmonic distortion of 10%, this amplifier ensures clear and undistorted audio output for a better listening experience.

Power Supplies (V): +-3/+-17, -10/-22, 20/30

Flexible power supply options allow compatibility with a wide range of devices and systems, enhancing the versatility of this amplifier.

No. of Terminals: 27

A high number of terminals provide numerous connection possibilities, making it suitable for complex audio setups.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style minimizes space requirements on PCBs, facilitating compact design in audio systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this amplifier can function reliably in warmer environments, ensuring consistent performance.

Minimum Operating Temperature: 0 °C

Operates from a minimum temperature of 0 °C, suitable for a variety of environments, ensuring reliability in diverse conditions.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, enhancing the longevity and performance of the amplifier.

Terminal Position: ZIG-ZAG

The zig-zag terminal position enhances the mechanical stability of the connections, reducing the risk of damage during installation or use.

Nominal Output Power: 70 W

With a nominal output power of 70W, this amplifier delivers sufficient power for moderate to high volume levels in audio systems.

Maximum Seated Height: 19.37 mm

The compact height allows for easy integration into various audio applications, where space might be a constraint.

Width: 4.5 mm

A narrow width enhances flexibility in installation, allowing for integration into tighter spaces and PCB layouts.

Minimum Supply Voltage (Vsup): 20 V

The minimum supply voltage ensures compatibility with many audio components, providing a stable operating range for this amplifier.

Length: 29.23 mm

The length contributes to the overall compact design, making it suitable for portable and space-efficient audio solutions.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, this amplifier is suitable for various applications, ensuring reliability and performance in everyday conditions.

No. of Channels: 2

The dual-channel design allows for stereo sound output, enhancing the audio experience for users who require high-fidelity sound.

Nominal Bandwidth: 0.02 kHz

With a nominal bandwidth of 0.02 kHz, this amplifier is capable of handling a wide range of audio frequencies, ensuring good sound quality.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust mechanical support which is ideal for applications requiring soldering to PCBs.

Terminal Pitch: 1 mm

The 1 mm terminal pitch allows for high-density layouts, catering to modern compact circuit designs and improving space efficiency.

Maximum Supply Voltage (Vsup): 30 V

Supporting up to 30 V ensures high performance and adaptability, permitting use with various high-powered audio equipment.

Technical Specifications

Audio & Video Amplifiers STA550 attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PZIP-T27

JESD-609 Code:

e3

Length:

29.23 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

27

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

70 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

ZIP27,.16,.16,40

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

+-3/+-17,-10/-22,20/30

Qualification:

Not Qualified

Maximum Seated Height:

19.37 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

20 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Width:

4.5 mm

Trade Compliance

STA550 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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