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STA529B

STMicroelectronics

STA529B by STMicroelectronics

STA529B by STMicroelectronics is a compact audio amplifier designed for surface mount applications. It operates on supply voltages of 1.5-1.95V, delivers 0.1W output power, and features a thin profile with a 48-terminal grid array. Ideal for commercial audio systems, it ensures reliable performance within 0 °C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,443

-

-

-

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Digiode

USA . 2,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,090

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Anansix

USA . 1,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,331

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,945 parts In-Stock

1+ parts

$2.661

100+ parts

-

1k+ parts

$2.395

10k+ parts

-

1,945

$2.661

-

$2.395

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MKK Technologies

India . 992 parts In-Stock

1+ parts

$5.003

100+ parts

-

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-

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-

992

$5.003

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DigiPath Technology Company

USA . 992 parts In-Stock

1+ parts

$5.003

100+ parts

-

1k+ parts

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10k+ parts

-

992

$5.003

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-

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Parana Technologies

USA . 2,142 parts In-Stock

1+ parts

-

100+ parts

$3.181

1k+ parts

-

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2,142

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$3.181

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Corphita

USA . 297 parts In-Stock

1+ parts

-

100+ parts

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297

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Overview

Elevate your audio experience with the STA529B from STMicroelectronics, a trusted leader in innovative technology. This compact, high-quality audio amplifier delivers exceptional performance and efficiency, making it perfect for a wide range of applications—from portable devices to home entertainment systems. With its sleek design and reliable operation, the STA529B ensures crystal-clear sound while maximizing power savings, providing unparalleled value that enhances every listening moment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and heat resistance, ensuring reliability in various conditions.

Surface Mount: YES

Surface mount technology allows for compact designs, making it ideal for modern electronic applications where space is a premium.

Package Shape: SQUARE

A square package shape enhances space efficiency on PCBs and facilitates better thermal management.

General IC Type: AUDIO AMPLIFIER

Designed specifically as an audio amplifier, it ensures optimal performance for audio applications.

Power Supplies (V): 1.8, 3.3

Multiple power supply options (1.8V and 3.3V) make it versatile and compatible with various electronic systems.

No. of Terminals: 48

With 48 terminals, this amplifier can support complex configurations and multiple connections for enhanced functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array design and thin profile allow for high-density layout on PCBs, making it suitable for space-constrained environments.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in warmer environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the amplifier functions effectively in cooler conditions.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient and effective soldering, optimizing the assembly process.

Nominal Output Power: 0.1 W

The nominal output power of 0.1W is suitable for various low-power audio applications, ensuring efficient operation.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm allows for low-profile designs, essential for portable audio devices.

Width: 5 mm

The compact width of 5 mm helps in designing space-efficient electronic devices.

Minimum Supply Voltage (Vsup): 1.5 V

The low minimum supply voltage allows the amplifier to operate in battery-powered devices, enhancing energy efficiency.

Length: 5 mm

A length of 5 mm further contributes to the compactness of the design, allowing for integration into smaller devices.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures compatibility with standard environments, making it suitable for a variety of applications.

No. of Channels: 2

Having two channels enables stereo output, improving the audio experience for end-users.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, crucial for modern audio applications.

Terminal Form: BALL

Ball terminal form enhances reliability and ease of connection in assemblies, ensuring better performance.

Terminal Pitch: 0.5 mm

A fine pitch of 0.5 mm supports high-density designs, which are essential in compact electronics.

Maximum Supply Voltage (Vsup): 1.95 V

The maximum supply voltage of 1.95V ensures broad compatibility with various low-voltage systems.

Technical Specifications

Audio & Video Amplifiers STA529B attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B48

Length:

5 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

.1 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

STA529B General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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