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STA529

STMicroelectronics

STA529 by STMicroelectronics

STA529 by STMicroelectronics is a compact audio amplifier designed for industrial applications, featuring a 1.2 W output power and operating b/w -40 °C to 85°C. It supports supply voltages from 1.8 V to 3.6 V with a thin profile grid array package. Ideal for surface mount designs, it offers dual-channel performance in a space-efficient format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,102 parts In-Stock

1+ parts

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1,102

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Digiode

USA . 845 parts In-Stock

1+ parts

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1k+ parts

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845

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Vyrian

USA . 79 parts In-Stock

1+ parts

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79

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Elcom Components

USA . 20 parts In-Stock

1+ parts

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 721 parts In-Stock

1+ parts

$0.775

100+ parts

-

1k+ parts

$0.697

10k+ parts

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721

$0.775

-

$0.697

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MKK Technologies

India . 362 parts In-Stock

1+ parts

$1.457

100+ parts

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362

$1.457

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DigiPath Technology Company

USA . 362 parts In-Stock

1+ parts

$1.457

100+ parts

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362

$1.457

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Parana Technologies

USA . 1,319 parts In-Stock

1+ parts

-

100+ parts

$0.926

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1,319

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$0.926

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Corphita

USA . 1,144 parts In-Stock

1+ parts

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1,144

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Overview

Elevate your audio experience with the STA529 from STMicroelectronics, a leader in innovative semiconductor solutions. This compact audio amplifier delivers crystal-clear sound while thriving in challenging environments, thanks to its wide temperature range. With superior build quality and energy efficiency, the STA529 is perfect for a variety of applications—from consumer electronics to industrial systems—ensuring your projects stand out with exceptional performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of circuit board space.

Package Shape: SQUARE

A square shape offers uniformity in design and facilitates easy integration into existing systems.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this product is specifically designed to enhance audio performance.

Power Supplies (V): 1.8, 3.3

Supports multiple voltage levels, making it versatile and compatible with a variety of systems.

No. of Terminals: 48

With 48 terminals, the product allows for extensive connectivity and flexibility in circuit design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The fine pitch and thin-profile grid array enhance space efficiency and ease of assembly.

Maximum Operating Temperature: 85 °C

Able to operate at high temperatures ensures reliability in demanding environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for rugged use in extreme conditions, suitable for industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning aids in effective thermal management and is advantageous for PCB layouts.

Nominal Output Power: 1.2 W

Delivers a solid output power, making it effective for a range of audio applications.

Maximum Seated Height: 1.2 mm

A low profile ensures it fits well in compact spaces while maintaining performance.

Width: 5 mm

A width of 5 mm ensures compatibility with standard PCB designs and layouts.

Minimum Supply Voltage (Vsup): 1.8 V

Supports low-voltage operation, improving energy efficiency and battery life in portable applications.

Length: 5 mm

The compact length makes it ideal for devices where space is at a premium.

Temperature Grade: INDUSTRIAL

Designed for industrial use, ensuring robustness and reliability in challenging conditions.

No. of Channels: 2

Dual-channel capability allows for stereo audio output, enhancing user experience in audio applications.

Technology: CMOS

CMOS technology is known for its low power consumption and high performance, making it ideal for modern audio devices.

Terminal Form: BALL

Ball terminals enhance soldering reliability and improve connection integrity.

Terminal Pitch: 0.5 mm

A tight terminal pitch allows for more compact designs while providing high-density connectivity.

Maximum Supply Voltage (Vsup): 3.6 V

Supports higher voltage operation, ensuring versatility and adaptability to various applications.

Technical Specifications

Audio & Video Amplifiers STA529 attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 1.55V TO 1.95V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B48

Length:

5 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.2 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

STA529 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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