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ST3232EBD

STMicroelectronics

ST3232EBD by STMicroelectronics

ST3232EBD by STMicroelectronics is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features Schmitt Trigger input characteristics and supports EIA-232, TIA-232, V.24, V.28 standards. Ideal for industrial applications requiring reliable data transmission in harsh environments with a temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 19,000 parts In-Stock

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Vyrian

USA . 8,030 parts In-Stock

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8,030

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Digiode

USA . 863 parts In-Stock

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863

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Anansix

USA . 440 parts In-Stock

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440

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J2 Sourcing AB

Sweden . 96 parts In-Stock

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96

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Goldney Electronics S.L.

Spain . 88 parts In-Stock

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88

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Nova Conductors

Japan . 74 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 400 parts In-Stock

1+ parts

$0.500

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400

$0.500

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Microchip USA

USA . 282 parts In-Stock

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$3.187

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282

$3.187

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IDEA Electronic Components Group

UK . 825 parts In-Stock

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$6.201

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$5.581

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825

$6.201

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$5.581

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AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$6.382

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$6.382

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MKK Technologies

India . 2,031 parts In-Stock

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$11.660

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$11.660

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DigiPath Technology Company

USA . 2,031 parts In-Stock

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$11.660

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RC Electronics

USA . 25,200 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Vigor

Singapore . 1,525 parts In-Stock

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Corphita

USA . 997 parts In-Stock

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Parana Technologies

USA . 752 parts In-Stock

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$7.414

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752

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$7.414

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Overview

Experience seamless communication with the ST3232EBD by STMicroelectronics. Manufactured with top-quality materials and cutting-edge technology, this line driver & receiver ensures reliable data transmission in various applications. From industrial settings to consumer electronics, this product offers unparalleled value with its high performance and efficiency. Stay connected effortlessly with the ST3232EBD and enjoy the benefits of superior quality and reliability in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the components inside the package, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and providing a neat and compact design.

Maximum Supply Voltage: 5.5 V

Support for a higher supply voltage allows for compatibility with a wide range of systems and applications.

No. of Functions: 2

Having multiple functions in a single device can provide cost-effectiveness and reduce the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape is a common and convenient form factor for easy installation and placement on circuit boards.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages gives flexibility in different operating environments or configurations.

No. of Terminals: 16

Having a higher number of terminals allows for more connection options, enhancing the versatility of the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the circuit board and can be suitable for compact electronic devices.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirement reduces power consumption and heat generation, making the product more efficient.

Minimum Supply Voltage: 3 V

Support for a low minimum supply voltage ensures compatibility with a wide range of systems while saving power.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions and applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments, making the product suitable for industrial applications.

Technical Specifications

Line Drivers & Receivers ST3232EBD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

ST3232EBD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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