Loading...

ST2S06A33PQR

STMicroelectronics

ST2S06A33PQR by STMicroelectronics

ST2S06A33PQR by STMicroelectronics is a dual switching controller with a max output current of 1.2 A and operates at a peak frequency of 1800 kHz. It features a compact 4x4 mm square package, ideal for space-constrained applications. This device utilizes current-mode control for efficient power management in various electronic devices.

Median Price

$1.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,500 parts In-Stock

1+ parts

$1.610

100+ parts

$1.525

1k+ parts

$1.505

10k+ parts

$1.100

4,500

$1.610

$1.525

$1.505

$1.100

Arrow

USA . 995 parts In-Stock

1+ parts

$1.971

100+ parts

$1.570

1k+ parts

$1.467

10k+ parts

-

995

$1.971

$1.570

$1.467

-

Verical

USA . 995 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.467

10k+ parts

-

995

-

$1.570

$1.467

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,778 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

4,778

$1.530

-

-

-

Vyrian

USA . 5,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,132

-

-

-

-

Linux4Media Gmbh

Germany . 2,008 parts In-Stock

1+ parts

-

100+ parts

$0.960

1k+ parts

$0.800

10k+ parts

-

2,008

-

$0.960

$0.800

-

Anansix

USA . 1,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,087

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,762 parts In-Stock

1+ parts

$1.449

100+ parts

-

1k+ parts

-

10k+ parts

-

2,762

$1.449

-

-

-

Microchip USA

USA . 6,343 parts In-Stock

1+ parts

$8.548

100+ parts

-

1k+ parts

-

10k+ parts

-

6,343

$8.548

-

-

-

IDEA Electronic Components Group

UK . 1,226 parts In-Stock

1+ parts

$13.834

100+ parts

-

1k+ parts

$12.451

10k+ parts

-

1,226

$13.834

-

$12.451

-

AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$18.240

100+ parts

-

1k+ parts

-

10k+ parts

-

591

$18.240

-

-

-

MKK Technologies

India . 935 parts In-Stock

1+ parts

$26.014

100+ parts

-

1k+ parts

-

10k+ parts

-

935

$26.014

-

-

-

DigiPath Technology Company

USA . 935 parts In-Stock

1+ parts

$26.014

100+ parts

-

1k+ parts

-

10k+ parts

-

935

$26.014

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,290

-

-

-

-

Perfect Parts

USA . 7,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,390

-

-

-

-

Parana Technologies

USA . 2,282 parts In-Stock

1+ parts

-

100+ parts

$16.541

1k+ parts

-

10k+ parts

-

2,282

-

$16.541

-

-

A-Z Elektronik GmbH

Germany . 1,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,503

-

-

-

-

Overview

Elevate your designs with the ST2S06A33PQR from STMicroelectronics, a dual switching controller that combines high efficiency with remarkable performance. Crafted by a leader in semiconductor innovation, this surface-mount regulator ensures reliability across various applications like power management and consumer electronics. Its compact design and advanced control mode make integration a breeze, delivering exceptional value and reducing system costs while enhancing product longevity. Unlock new possibilities today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for compact assembly and efficient PCB layout, making it suitable for space-constrained applications.

No. of Functions: 2

The dual-function capability enhances versatility, enabling it to cater to multiple applications without needing additional components.

Package Shape: SQUARE

The square package shape simplifies PCB placement and optimizes space utilization in the design.

No. of Terminals: 12

With 12 terminals, it provides ample connectivity options, allowing for sophisticated circuit designs and reduced layout complexity.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This packaging style aids in thermal management and is ideal for thin-profile applications, providing better heat dissipation.

Control Mode: CURRENT-MODE

Current-mode control ensures stable output and improved transient response, ideal for demanding applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability, reducing assembly defects and enhancing reliability.

Terminal Position: QUAD

Quad terminal positioning allows for a compact layout, facilitating easier routing in PCB designs.

Maximum Seated Height: 1 mm

The low profile of 1 mm supports designs requiring slim components, perfect for portable and embedded solutions.

Width (mm): 4 mm

A width of 4 mm enables integration into tight spaces, advantageous for miniaturized devices.

Other IC type: DUAL SWITCHING CONTROLLER

Being a dual switching controller expands its functionality, allowing for dual output applications, minimizing board space usage.

Nominal Input Voltage: 5 V

The 5 V nominal input voltage is standard for many digital circuits, simplifying voltage regulation in power supply designs.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum time of 40 seconds at peak reflow ensures compatibility with common soldering processes, aiding manufacturing efficiency.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature tolerance allows for flexibility in SMT processes, accommodating various solder types.

Length: 4 mm

A compact length of 4 mm supports space-sensitive designs, maintaining performance without compromising on size.

Maximum Switching Frequency: 1800 kHz

A maximum switching frequency of 1800 kHz enhances efficiency in power conversion, reducing energy loss during operation.

Maximum Output Current: 1.2 A

The capability to deliver up to 1.2 A output current makes it suitable for a variety of load requirements in compact designs.

Terminal Form: NO LEAD

The no-lead design minimizes board space requirements and simplifies PCB assembly, which can improve reliability.

Control Technique: PULSE WIDTH MODULATION

The use of pulse width modulation (PWM) offers efficient control of the output voltage, ensuring precise power delivery.

Switcher Config: PUSH-PULL

A push-pull configuration enhances output power efficiency, making it suitable for various applications needing robust performance.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch facilitates compact layouts and is compatible with current PCB manufacturing technologies.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for a variety of environments while maintaining performance reliability.

Minimum Input Voltage: 4 V

A minimum input voltage of 4 V provides design flexibility, ensuring consistent operation across a range of input power conditions.

Maximum Input Voltage: 5.5 V

The maximum input voltage of 5.5 V protects against over-voltage conditions, enhancing reliability in variable power environments.

Technical Specifications

Switching Regulators & Controllers ST2S06A33PQR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-XQCC-N12

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

12

Maximum Output Current:

1.2 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC12,.16SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1800 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4 mm

Trade Compliance

ST2S06A33PQR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5