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ST2S06APQR

STMicroelectronics

ST2S06APQR by STMicroelectronics

ST2S06APQR from STMicroelectronics is a dual switching controller with a compact 4x4 mm size and a max output current of 1.2 A. It operates at a nominal input voltage of 5 V, utilizing pulse width modulation for efficient power management. Ideal for space-constrained applications, it features a high switching frequency of 1800 kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,947 parts In-Stock

1+ parts

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1,947

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Vyrian

USA . 1,218 parts In-Stock

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1,218

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Anansix

USA . 723 parts In-Stock

1+ parts

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723

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,519 parts In-Stock

1+ parts

$9.443

100+ parts

-

1k+ parts

$8.499

10k+ parts

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1,519

$9.443

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$8.499

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MKK Technologies

India . 991 parts In-Stock

1+ parts

$17.757

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991

$17.757

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DigiPath Technology Company

USA . 991 parts In-Stock

1+ parts

$17.757

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991

$17.757

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Parana Technologies

USA . 1,412 parts In-Stock

1+ parts

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100+ parts

$11.290

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1,412

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$11.290

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Corphita

USA . 489 parts In-Stock

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489

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Overview

Elevate your designs with the ST2S06APQR from STMicroelectronics, a pinnacle of reliability and performance in the world of switching regulators. With a sleek, space-saving design and dual functionality, this compact solution ensures efficient power management while enhancing system durability. Ideal for a variety of applications, it helps you achieve optimal efficiency and improved thermal performance, providing exceptional value that keeps your projects ahead of the curve.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easier integration into compact circuit layouts, making it ideal for space-constrained applications.

No. of Functions: 2

Having dual functionality can simplify board design and reduce component count, leading to lower overall costs.

Package Shape: SQUARE

The square package shape offers efficient space utilization on printed circuit boards, appealing for modern compact designs.

No. of Terminals: 12

A higher number of terminals provides flexibility in design and better connectivity options for various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style helps in effective thermal management and ensures that the product can operate reliably in high-performance applications.

Control Mode: CURRENT-MODE

Current-mode control provides improved transient response and better stability in feedback loops, enhancing overall performance.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout and routing options on the PCB, facilitating easier design implementation.

Maximum Seated Height: 1 mm

With a low maximum seated height, this regulator can be easily accommodated in thin-profile applications, providing design versatility.

Width: 4 mm

A compact width aids in fitting designs where space is limited, making it suitable for portable and handheld devices.

Other IC type: DUAL SWITCHING CONTROLLER

Dual switching capability allows for efficient power management in systems requiring multiple voltage outputs from a single device.

Nominal Input Voltage: 5 V

Operating at a nominal input voltage of 5 V makes it compatible with many standard power supplies, ensuring ease of integration.

Length: 4 mm

This small length helps achieve compact PCB designs while maintaining high performance, suitable for miniaturized electronics.

Maximum Switching Frequency: 1800 kHz

High switching frequency allows for smaller external components, leading to reduced board space and lower overall system costs.

Maximum Output Current: 1.2 A

With a maximum output current of 1.2 A, this regulator can support a variety of applications, from consumer electronics to industrial devices.

Terminal Form: NO LEAD

No lead design enhances thermal performance and reliability, providing an efficient solution for modern electronic designs.

Control Technique: PULSE WIDTH MODULATION

PWM control technique enables precise voltage regulation and efficient energy use, essential for high-performance applications.

Switcher Config: PUSH-PULL

The push-pull configuration enhances efficiency and reduces power losses, making it suitable for demanding applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for more compact layouts and high-density designs, catering to modern miniaturization trends.

Minimum Input Voltage: 2.5 V

A low minimum input voltage enhances the device's flexibility for various application requirements, increasing its usability.

Maximum Input Voltage: 5.5 V

The wide input voltage range allows compatibility with a variety of power sources, making it suited for diverse operational environments.

Technical Specifications

Switching Regulators & Controllers ST2S06APQR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-XQCC-N12

Length:

4 mm

No. of Functions:

2

No. of Terminals:

12

Maximum Output Current:

1.2 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC12,.16SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1800 kHz

Terminal Form:

NO LEAD

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

ST2S06APQR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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