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ST26C31BD

STMicroelectronics

ST26C31BD by STMicroelectronics

ST26C31BD by STMicroelectronics is a CMOS line driver with a max supply voltage of 5.5V and operates in temperatures from -40 °C to 85°C. It features 4 functions, 16 terminals, and delivers differential output with minimal transmit delay of 11ns. Ideal for EIA-422 applications, it ensures reliable data transmission in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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R&J Components

USA . 10,666 parts In-Stock

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Vyrian

USA . 3,014 parts In-Stock

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Digiode

USA . 2,391 parts In-Stock

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Anansix

USA . 1,712 parts In-Stock

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Semi Source

USA . 34 parts In-Stock

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Sogenti Electronics

Canada . 3 parts In-Stock

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IDEA Electronic Components Group

UK . 1,604 parts In-Stock

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$10.034

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$9.031

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MKK Technologies

India . 557 parts In-Stock

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$18.869

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DigiPath Technology Company

USA . 557 parts In-Stock

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$18.869

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$18.869

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 2,089 parts In-Stock

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Parana Technologies

USA . 1,581 parts In-Stock

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$11.998

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Overview

Elevate your designs with the ST26C31BD from STMicroelectronics, a leading name in high-quality semiconductor solutions. This versatile line driver and receiver excels in industrial applications, ensuring reliable data transmission with low power consumption and exceptional speed. Its robust design, featuring nickel palladium gold terminals, guarantees durability, while the compact package allows for efficient use of space. Trust in STMicroelectronics to deliver performance that drives innovation and enhances your project’s value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability under various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V offers flexibility in powering the device while ensuring compatibility with various systems.

No. of Functions: 4

With four functions, this device can efficiently handle multiple tasks, enhancing performance and versatility.

Package Shape: RECTANGULAR

The rectangular shape is standard for many applications, providing ease of integration into existing designs.

Maximum Transmit Delay: 11 ns

A low maximum transmit delay of 11 ns ensures fast data transmission, making it suitable for high-speed communication.

Power Supplies (V): 5

Standard 5V power supply makes it easily integrable with commonly used electronic devices.

No. of Terminals: 16

The 16 terminals facilitate connection to multiple lines, allowing for expanded functionality and connectivity.

Package Style (Meter): SMALL OUTLINE

Small outline packaging reduces PCB footprint, making it ideal for space-constrained applications.

Maximum High Level Input Current: 0.000001 Amp

Minimal input current draws less power, leading to improved efficiency in battery-operated devices.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V supports a wide range of input voltages, ensuring compatibility with various power sources.

Maximum Operating Temperature: 85 °C

The device operates efficiently at high temperatures, making it suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output supports multiple devices on the same line, facilitating communication in complex systems.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme conditions, ideal for outdoor and industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and better solderability, enhancing durability.

Terminal Position: DUAL

Dual terminal position simplifies mounting and ensures stable connections within various circuit designs.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a compact design, supporting sleek, low-profile device formats.

Width: 3.9 mm

Narrow width allows for efficient layout on PCBs and enhances design flexibility.

Differential Output: YES

Differential output reduces noise susceptibility, ensuring signal integrity over long distances.

Length: 9.9 mm

Short length aids in minimizing overall circuit size while supporting dense configurations.

Minimum Out Swing: 2 V

A minimum output swing of 2V ensures robust signaling and compatibility with various input devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this device withstands harsh conditions and ensures long-term reliability.

Maximum Receive Delay: 0 ns

Zero maximum receive delay ensures immediate signal processing, which is critical in time-sensitive applications.

Technology: CMOS

CMOS technology enhances power efficiency, making it suitable for battery-operated devices and low-power applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring robust connections on PCBs.

Interface Standard: EIA-422

Compliance with EIA-422 ensures compatibility with a wide range of communication protocols and devices.

Input Characteristics: STANDARD

Standard input characteristics facilitate integration with common input types, enhancing versatility.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V aligns with industry standards, simplifying design and usage in various applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with existing PCB designs, simplifying integration.

Driver No. of Bits: 4

A 4-bit driver allows for effective data handling, making it suitable for various digital communication needs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates suitable handling and storage conditions, promoting durability in manufacturing environments.

Interface IC Type: LINE DRIVER

As a line driver IC, it ensures efficient transmission of data over long distances, ideal for networked systems.

Technical Specifications

Line Drivers & Receivers ST26C31BD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

11 ns

Width:

3.9 mm

Trade Compliance

ST26C31BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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