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ST232EATR

STMicroelectronics

ST232EATR by STMicroelectronics

ST232EATR by STMicroelectronics is a dual line transceiver designed for EIA-232-E interfaces, operating b/w -40 °C to 125°C. It supports a max supply voltage of 5.5V and features a compact SOIC package with a 1.2mm height. Ideal for automotive applications, it ensures reliable data transmission with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,807 parts In-Stock

1+ parts

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8,807

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Digiode

USA . 4,187 parts In-Stock

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4,187

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Anansix

USA . 2,732 parts In-Stock

1+ parts

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2,732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$1.954

100+ parts

-

1k+ parts

$1.759

10k+ parts

-

1,206

$1.954

-

$1.759

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MKK Technologies

India . 1,862 parts In-Stock

1+ parts

$3.675

100+ parts

-

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-

10k+ parts

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1,862

$3.675

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DigiPath Technology Company

USA . 1,862 parts In-Stock

1+ parts

$3.675

100+ parts

-

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-

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1,862

$3.675

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AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$16.960

100+ parts

-

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545

$16.960

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Microchip USA

USA . 6,760 parts In-Stock

1+ parts

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6,760

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QUARKTWIN TECHNOLOGY LTD

USA . 6,439 parts In-Stock

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6,439

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A-Z Elektronik GmbH

Germany . 5,835 parts In-Stock

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5,835

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Metaverse IC Inc.

Canada . 4,180 parts In-Stock

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4,180

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Corphita

USA . 3,063 parts In-Stock

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3,063

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Assy Fe

Spain . 2,500 parts In-Stock

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2,500

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Vigor

Singapore . 1,111 parts In-Stock

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1,111

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Authorized Procurement Solutions

USA . 1,054 parts In-Stock

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1,054

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Parana Technologies

USA . 718 parts In-Stock

1+ parts

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$2.336

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718

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$2.336

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Overview

Unlock seamless communication with the ST232EATR from STMicroelectronics, a standout in line drivers and receivers. Renowned for exceptional quality, STMicroelectronics ensures reliability and performance across diverse applications, from automotive systems to industrial controls. With its compact design and robust temperature range, this device guarantees efficient operation even in tough environments. Elevate your projects with a trusted solution that simplifies connectivity while maximizing value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for space-efficient designs and easier assembly on printed circuit boards.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V allows for compatibility with a wide range of digital circuits.

No. of Functions: 2

Having two functions in one package enhances versatility and simplifies circuit design.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact footprint, making it suitable for applications with space constraints.

Maximum Transmit Delay: 2000 ns

A maximum transmit delay of 2000 ns ensures timely data transmission, vital for high-speed applications.

Power Supplies (V): 5

Operating at a 5 V supply voltage makes the product compatible with standard digital systems.

No. of Terminals: 16

With 16 terminals, this product allows for robust connections and flexible circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it ideal for modern compact electronics.

Minimum Supply Voltage: 4.5 V

This range of supply voltage accommodates various power sources, enhancing design flexibility.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability even in demanding thermal environments.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures makes this product suitable for automotive and outdoor applications.

Terminal Position: DUAL

Dual terminal position provides versatility in layout design on PCBs.

Maximum Seated Height: 1.2 mm

A low seated height allows for slimmer designs and better integration into compact assemblies.

Width: 4.4 mm

A narrow width is beneficial for designs requiring minimal space without compromising functionality.

Maximum Output Low Current: 3.2 Amp

Supports higher load capacities, making it well-suited for driving multiple devices.

Receiver No. of Bits: 2

Two bits allow for the transmission of small data packets efficiently.

Length: 5 mm

The compact length makes it ideal for applications with limited board space.

Minimum Out Swing: 10 V

A minimum output swing of 10 V ensures clear signal integrity over longer distances.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this component meets stringent reliability and performance standards.

Maximum Receive Delay: 10000 ns

An extended receive delay supports slower signal processing, accommodating varied data rates.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and connection stability during assembly.

Interface Standard: EIA-232-E; TIA-232-E; V.28

Compatibility with standard interface protocols ensures seamless integration into existing systems.

Maximum Supply Current: 10 mA

Low supply current consumption maximizes efficiency and prolongs battery life in portable applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input provides noise immunity and stability in digital signal processing.

Nominal Supply Voltage: 5 V

The nominal supply voltage aligns with common logic levels used in modern electronics, ensuring broad compatibility.

Terminal Pitch: 0.65 mm

The terminal pitch is optimized for high-density PCB layouts, allowing for more compact designs.

Driver No. of Bits: 2

Having a two-bit driver enhances the capability to transmit a small amount of data quickly and efficiently.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed to transmit and receive data over communication lines, making it an ideal choice for serial communication applications.

Technical Specifications

Line Drivers & Receivers ST232EATR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E; V.28

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

10000 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2000 ns

Width:

4.4 mm

Trade Compliance

ST232EATR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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