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ST232EAN

STMicroelectronics

ST232EAN by STMicroelectronics

ST232EAN by STMicroelectronics is a dual line transceiver designed for EIA-232-E interfaces, operating b/w -40 °C to 125°C. It supports a max supply voltage of 5.5V and features a max transmit delay of 2000 ns. Ideal for automotive applications, it ensures reliable data communication with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,033

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-

-

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Digiode

USA . 3,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,411

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Anansix

USA . 1,553 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,553

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 105 parts In-Stock

1+ parts

$6.210

100+ parts

-

1k+ parts

$5.589

10k+ parts

-

105

$6.210

-

$5.589

-

Microchip USA

USA . 331 parts In-Stock

1+ parts

$7.459

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$7.459

-

-

-

AZTECH Wire

Italy . 149 parts In-Stock

1+ parts

$10.030

100+ parts

-

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-

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-

149

$10.030

-

-

-

MKK Technologies

India . 1,569 parts In-Stock

1+ parts

$11.678

100+ parts

-

1k+ parts

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10k+ parts

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1,569

$11.678

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-

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DigiPath Technology Company

USA . 1,569 parts In-Stock

1+ parts

$11.678

100+ parts

-

1k+ parts

-

10k+ parts

-

1,569

$11.678

-

-

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Component Stockers USA

USA . 382 parts In-Stock

1+ parts

$99.990

100+ parts

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10k+ parts

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382

$99.990

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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-

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Parana Technologies

USA . 1,192 parts In-Stock

1+ parts

-

100+ parts

$7.425

1k+ parts

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1,192

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$7.425

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Corphita

USA . 78 parts In-Stock

1+ parts

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78

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Overview

Elevate your communication systems with the ST232EAN from STMicroelectronics—a trusted leader in innovation. This robust line driver and receiver excels in automotive applications, delivering reliability under extreme conditions. With its compact dual interface design and exceptional performance, it ensures seamless data transmission while minimizing power consumption. Experience enhanced efficiency, unmatched quality, and the peace of mind that comes with STMicroelectronics' renowned engineering excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy as the package body material ensures robustness and resilience, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for design, accommodating a range of power supply conditions.

No. of Functions: 2

With two functions integrated, this product enhances design efficiency and saves board space by minimizing component count.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy alignment and accommodation on standard PCB layouts.

Maximum Transmit Delay: 2000 ns

The low maximum transmit delay of 2000 ns enables fast data transmission, reducing latency in critical applications.

Power Supplies (V): 5

Operating at a standard 5 V supply makes it compatible with many common digital systems, improving integration.

No. of Terminals: 16

The 16 terminals offer multiple connection options, facilitating versatile configurations in various applications.

Package Style (Meter): IN-LINE

The in-line package style is ideal for board mount applications, allowing for easier routing of signals.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V supports a wide range of operating environments, ensuring reliability in diverse conditions.

Maximum Operating Temperature: 125 °C

The capability to operate at high temperatures up to 125 °C makes it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures the product functions effectively in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and improves reliability in electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in design and placement on the PCB, accommodating various layouts.

Maximum Seated Height: 5.1 mm

With a maximum seated height of 5.1 mm, this product is suitable for compact designs without compromising performance.

Width: 7.62 mm

The width of 7.62 mm allows for compact PCB designs while providing sufficient spacing for signal integrity.

Maximum Output Low Current: 3.2 Amp

A maximum output low current of 3.2 Amp supports applications that require significant drive strength for robust signaling.

Receiver No. of Bits: 2

The 2-bit receiver capability allows for straightforward data communication while maintaining simplicity in design.

Minimum Out Swing: 10 V

A minimum out swing of 10 V enhances signal integrity over longer distances, crucial for maintaining data accuracy.

Temperature Grade: AUTOMOTIVE

Being temperature graded for automotive use indicates reliability and durability in harsh environments, ideal for vehicle applications.

Maximum Receive Delay: 10000 ns

The maximum receive delay of 10000 ns ensures that the device can handle slower communication instances, providing versatility.

Terminal Form: THROUGH-HOLE

Through-hole terminals allow for stronger mechanical connections and are ideal for prototyping and high-reliability applications.

Interface Standard: EIA-232-E; TIA-232-E; V.28

Support for EIA-232-E, TIA-232-E, and V.28 standards facilitates compatibility with a wide range of communication systems.

Maximum Supply Current: 10 mA

A maximum supply current of 10 mA ensures low power consumption, making it efficient for battery-powered applications.

Input Characteristics: SCHMITT TRIGGER

Incorporating Schmitt trigger input characteristics provides improved noise immunity and cleaner signal transitions.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many logic applications, simplifying power supply requirements.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is an industry-standard spacing, allowing for easy PCB design and assembly.

Driver No. of Bits: 2

The 2-bit driver capability allows for efficient data transmission while keeping the design straightforward.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed for reliable communication over serial lines, ensuring effective data transfer.

Technical Specifications

Line Drivers & Receivers ST232EAN attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E; V.28

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

10000 ns

Receiver No. of Bits:

2

Maximum Seated Height:

5.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

2000 ns

Width:

7.62 mm

Trade Compliance

ST232EAN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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