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SRI512-SBN18/XXX

STMicroelectronics

SRI512-SBN18/XXX by STMicroelectronics

SRI512-SBN18/XXX by STMicroelectronics is a 512-bit EEPROM with 32x16 organization, operating at 3V. It features asynchronous mode, serial interface, and -20 to 85 °C temperature range. Ideal for applications requiring non-volatile memory storage in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,103

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-

-

-

Vyrian

USA . 2,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,670

-

-

-

-

Anansix

USA . 1,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,528

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,705 parts In-Stock

1+ parts

$5.030

100+ parts

-

1k+ parts

$4.527

10k+ parts

-

1,705

$5.030

-

$4.527

-

MKK Technologies

India . 230 parts In-Stock

1+ parts

$9.458

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$9.458

-

-

-

DigiPath Technology Company

USA . 230 parts In-Stock

1+ parts

$9.458

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$9.458

-

-

-

Corphita

USA . 4,652 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,652

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-

-

-

Parana Technologies

USA . 870 parts In-Stock

1+ parts

-

100+ parts

$6.014

1k+ parts

-

10k+ parts

-

870

-

$6.014

-

-

Overview

Unlock the power of reliable data storage with the SRI512-SBN18/XXX by STMicroelectronics. This high-quality EEPROM offers seamless integration into a variety of applications thanks to its surface mount design and asynchronous operating mode. With a nominal supply voltage of 3V and a wide operating temperature range, this chip provides unmatched performance and versatility. Trust in the expertise of STMicroelectronics to deliver a product that exceeds expectations, offering customers value, efficiency, and peace of mind.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and reducing overall product size.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables independent and parallel access to memory locations, increasing efficiency in data retrieval and storage.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal voltage of 3V ensures compatibility with a wide range of electronic devices and power sources.

Package Style (Meter): UNCASED CHIP

The unencased chip design offers flexibility in mounting options and simplifies the overall assembly process.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can withstand harsh environmental conditions and extended use.

Organization: 32X16

The 32x16 organization provides a balance between memory capacity and access speed, ideal for various applications.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures reliable performance even in cold environments or during startup.

Terminal Position: UPPER

The upper terminal position facilitates easy connection and integration with other electronic components in a circuit layout.

Minimum Supply Voltage (Vsup): 2.5 V

With a low minimum supply voltage, this EEPROM can operate efficiently even with limited power sources or voltage fluctuations.

Programming Voltage (V): 3

A programming voltage of 3V allows for reliable and accurate data programming, ensuring data integrity and stability.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of electronic systems.

Parallel or Serial: SERIAL

Serial communication enables efficient data transfer and control, making it suitable for applications requiring sequential data access.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and assembly processes, reducing the risk of damage during installation.

No. of Words: 32 words

With 32 words of memory capacity, this EEPROM offers sufficient storage for storing critical data or configuration settings.

Memory Width: 16

A memory width of 16 bits provides a balance between data precision and storage efficiency, suitable for various data types and applications.

Memory Density: 512 bit

The 512-bit memory density offers a compact storage solution for small-scale applications or system configurations.

Memory IC Type: EEPROM

Being an EEPROM, this memory IC type offers non-volatile data storage, allowing for data retention even when power is disconnected.

Technical Specifications

EEPROM SRI512-SBN18/XXX attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

512 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Words:

32 words

No. of Words Code:

32

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

32X16

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

SRI512-SBN18/XXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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