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SGT120R65AL

STMicroelectronics

SGT120R65AL by STMicroelectronics

SGT120R65AL by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage and 36A IDM. It is used for SWITCHING applications, operating in ENHANCEMENT MODE with a max power dissipation of 192W. This transistor features GALLIUM NITRIDE material and can handle up to 15A drain current.

Median Price

$4.647

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 260 parts In-Stock

1+ parts

-

100+ parts

$4.647

1k+ parts

$4.463

10k+ parts

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260

-

$4.647

$4.463

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$2.865

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150

$2.865

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Vyrian

USA . 7,729 parts In-Stock

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7,729

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Anansix

USA . 1,948 parts In-Stock

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Digiode

USA . 1,416 parts In-Stock

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1,416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,120 parts In-Stock

1+ parts

$1.834

100+ parts

-

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$1.651

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-

1,120

$1.834

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$1.651

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Continental Prestige Electronics

USA . 6,583 parts In-Stock

1+ parts

$2.865

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-

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$2.808

6,583

$2.865

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$2.808

Argo Parts USA

USA . 2,042 parts In-Stock

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$2.865

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2,042

$2.865

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Netroflash

USA . 50 parts In-Stock

1+ parts

$2.865

100+ parts

-

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$2.722

10k+ parts

$2.664

50

$2.865

-

$2.722

$2.664

MKK Technologies

India . 660 parts In-Stock

1+ parts

$3.450

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660

$3.450

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DigiPath Technology Company

USA . 660 parts In-Stock

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$3.450

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660

$3.450

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Ampacity Inc.

Singapore . 12 parts In-Stock

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$3.950

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12

$3.950

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AZTECH Wire

Italy . 631 parts In-Stock

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$16.243

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631

$16.243

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Microchip USA

USA . 397 parts In-Stock

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$16.793

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397

$16.793

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Corphita

USA . 3,062 parts In-Stock

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Parana Technologies

USA . 416 parts In-Stock

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$2.193

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416

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$2.193

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Overview

Unlock the power of innovation with the SGT120R65AL by STMicroelectronics, a top-tier manufacturer in the field of Power Field Effect Transistors (FET). This N-CHANNEL transistor offers unparalleled quality and reliability for switching applications, making it a must-have for your projects. With a high operating temperature and maximum drain current, this transistor delivers exceptional performance in a compact package. Trust STMicroelectronics to provide cutting-edge technology that exceeds expectations and propels your designs to new heights. Elevate your work with the SGT120R65AL and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage of 650V allows this FET to be used in high-voltage applications where reliability and robustness are essential.

Maximum Pulsed Drain Current (IDM): 36 A

With a high pulsed drain current of 36A, this FET can handle sudden spikes in current, making it suitable for applications with demanding power requirements.

Maximum Power Dissipation (Abs): 192 W

The high power dissipation capability of 192W ensures that this FET can operate at high power levels without overheating, making it ideal for power-hungry applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows this FET to withstand high temperatures, making it suitable for industrial and automotive applications where heat dissipation is a concern.

Field Effect Transistor Technology: HIGH ELECTRON MOBILITY

High electron mobility technology allows for faster switching speeds and lower on-resistance, making this FET an efficient choice for high-frequency switching applications.

Maximum Drain Current (ID): 15 A

The high drain current rating of 15A indicates that this FET can handle high current loads, making it suitable for power amplification and switching applications.

Maximum Drain-Source On Resistance: 0.12 ohm

The low on-resistance of 0.12 ohms minimizes power loss and heat generation in the FET, improving overall efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) SGT120R65AL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

BULK: 3000

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

HIGH ELECTRON MOBILITY

Maximum Feedback Capacitance (Crss):

.9 pF

JESD-30 Code:

R-PDSO-F8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

GALLIUM NITRIDE

Trade Compliance

SGT120R65AL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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