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RHFL7913SCA1

STMicroelectronics

RHFL7913SCA1 by STMicroelectronics

RHFL7913SCA1 by STMicroelectronics is an adjustable negative LDO regulator with a max output current of 3A and a dropout voltage of 0.8V. It operates in extreme temps from -55 °C to 150°C, making it ideal for harsh environments. Its compact design ensures efficient surface mounting in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,747 parts In-Stock

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4,747

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Vyrian

USA . 2,655 parts In-Stock

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2,655

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Anansix

USA . 667 parts In-Stock

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667

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 483 parts In-Stock

1+ parts

$4.341

100+ parts

-

1k+ parts

$3.907

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483

$4.341

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$3.907

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MKK Technologies

India . 428 parts In-Stock

1+ parts

$8.162

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428

$8.162

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DigiPath Technology Company

USA . 428 parts In-Stock

1+ parts

$8.162

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428

$8.162

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Corphita

USA . 2,963 parts In-Stock

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2,963

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Parana Technologies

USA . 823 parts In-Stock

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$5.190

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823

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$5.190

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Overview

Boost your project’s performance with the RHFL7913SCA1 from STMicroelectronics, a leader in semiconductor innovation. This adjustable negative LDO regulator delivers reliability and efficiency, making it ideal for demanding applications in aerospace, medical devices, and industrial equipment. With exceptional temperature resilience and low dropout voltage, this robust component ensures stable power supply while minimizing space requirements, providing unmatched value and peace of mind for your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable ceramic and metal-sealed packaging ensures reliable performance in harsh environments.

Total Dose: 300k Rad(Si)

High total dose tolerance makes this LDO suitable for use in radiation-rich environments, such as space applications.

Maximum Dropout Voltage: 1.8 V

A low maximum dropout voltage allows for more efficient operation, enabling the device to maintain regulation even with a small voltage difference between input and output.

Surface Mount: YES

Surface mount technology allows for compact design and ease of assembly, making it suitable for modern electronic circuits.

Operating Temperature (TJ-Max): 150 °C

The high maximum operating temperature supports reliable performance in demanding thermal conditions, enhancing system robustness.

Screening Level: 38535V; 38534K; 883S

Robust screening levels ensure high reliability and performance in critical applications, making it a trusted choice for defense and aerospace.

Technology: BIPOLAR

Bipolar technology offers better performance characteristics, such as lower noise and improved transient response.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient use of PCB space, allowing for more flexible product design.

Terminal Form: NO LEAD

No lead design optimizes space and can improve manufacturability by reducing the risk of lead-related issues.

Operating Temperature (TJ-Min): -55 °C

Ability to operate at extremely low temperatures enhances versatility for use in diverse, cold-temperature environments.

Packing Method: TR

Tape and reel packing provides efficient handling and manufacturing processes, making it ideal for automated assembly lines.

Minimum Output Voltage: 1.2 V

The minimum output voltage allows for versatility in various applications requiring low voltage levels.

No. of Terminals: 5

With five terminals, this LDO provides flexibility for design configurations, accommodating various circuit topologies.

Maximum Line Regulation: 0.046%/V

Excellent line regulation ensures stable output voltage despite variations in input voltage, improving overall performance.

Package Style (Meter): CHIP CARRIER

Chip carrier package style aids in optimized thermal management and electrical performance.

Adjustability: ADJUSTABLE

Being adjustable allows designers to customize output voltage precisely to match application requirements, enhancing design flexibility.

Maximum Load Regulation: 0.6%

Tight load regulation ensures consistent output voltage under varying load conditions, which is critical for sensitive applications.

Regulator Type: ADJUSTABLE NEGATIVE SINGLE OUTPUT LDO REGULATOR

The adjustable negative output capability is perfect for applications needing a negative voltage supply.

Terminal Finish: GOLD

Gold terminal finish provides excellent electrical conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient connections to PCB, reducing signal path length and enhancing performance.

Maximum Output Voltage: 9.5 V

A maximum output voltage of 9.5 V allows this LDO to support a range of applications requiring moderate negative voltages.

Maximum Output Current: 3 A

With a maximum output current of 3 A, this LDO is capable of supporting power-intensive applications.

Maximum Seated Height: 3.15 mm

A low profile design with a maximum seated height of 3.15 mm promotes space-saving in compact electronic designs.

Width: 7.5 mm

Narrow width allows for efficient layout on PCB, maximizing space for other components.

Length: 13.84 mm

The length of 13.84 mm makes this product suitable for both dense and spacious designs, providing flexibility in layout strategies.

Technical Specifications

Adjustable Regulators - Negative Single Output LDO RHFL7913SCA1 attributes and parameters. Explore more Adjustable Regulators - Negative Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.8 V

JESD-30 Code:

R-CBCC-N5

JESD-609 Code:

e4

Length:

13.84 mm

Maximum Line Regulation (%/V):

.046

Maximum Load Regulation (%):

.6 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

9.5 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BCC

Package Equivalence Code:

LCC5(UNSPEC)

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Qualification Status:

Not Qualified

Screening Level:

38535V;38534K;883S

Maximum Seated Height:

3.15 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

BOTTOM

Total Dose (V):

300k Rad(Si)

Width:

7.5 mm

Trade Compliance

RHFL7913SCA1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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