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RHFL7913KPA2

STMicroelectronics

RHFL7913KPA2 by STMicroelectronics

RHFL7913KPA2 by STMicroelectronics is an adjustable negative LDO regulator with a max output of 9.5V and current up to 3A. It operates in extreme temps from -55 °C to 150°C, featuring a dropout voltage of just 0.8V. Ideal for high-radiation environments, it ensures reliable performance in critical applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,654 parts In-Stock

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3,654

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Digiode

USA . 3,552 parts In-Stock

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3,552

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Anansix

USA . 1,869 parts In-Stock

1+ parts

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1,869

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,635 parts In-Stock

1+ parts

$5.732

100+ parts

-

1k+ parts

$5.158

10k+ parts

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1,635

$5.732

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$5.158

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MKK Technologies

India . 741 parts In-Stock

1+ parts

$10.778

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741

$10.778

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DigiPath Technology Company

USA . 741 parts In-Stock

1+ parts

$10.778

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741

$10.778

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Parana Technologies

USA . 1,684 parts In-Stock

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$6.853

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1,684

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$6.853

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Corphita

USA . 1,499 parts In-Stock

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1,499

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Overview

Elevate your designs with the RHFL7913KPA2 from STMicroelectronics, a leader in high-performance solutions. This adjustable negative LDO regulator offers exceptional reliability and thermal stability, making it ideal for demanding applications like aerospace and industrial systems. With its robust design and precise output control, you can trust it to deliver consistent performance even in extreme conditions. Empower your projects with unparalleled efficiency and quality.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic and metal-sealed package ensures high durability and excellent thermal performance, making this LDO suitable for demanding environments.

Total Dose: 300k Rad(Si)

With a total dose tolerance of 300k Rad(Si), this product is ideal for use in space and radiation-sensitive applications.

Maximum Dropout Voltage: 1.8 V

A low maximum dropout voltage enhances efficiency, especially in battery-powered applications.

Surface Mount: YES

The surface mount design simplifies the assembly process, allowing for efficient PCB layouts and saving valuable space.

Operating Temperature (TJ-Max): 150 °C

The high maximum operating temperature indicates reliability and performance under extreme conditions, making it suitable for harsh environments.

Screening Level: 38535V; 38534K; 883S

High screening levels ensure consistent quality and reliability, making this LDO a trustworthy choice for military and aerospace applications.

Technology: BIPOLAR

Bipolar technology offers reduced noise and improved transient response, enhancing the performance of the regulator.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient heat dissipation, which is crucial for maintaining performance during operation.

Terminal Form: FLAT

Flat terminals ensure a stable connection, minimizing the risk of mechanical failure and improving electrical conductivity.

Operating Temperature (TJ-Min): -55 °C

A wide operating temperature range from -55 °C to 150 °C ensures functionality in extreme climates, making it suitable for various applications.

Minimum Output Voltage: 1.2 V

The ability to output a minimum of 1.2 V caters to low-voltage applications, enhancing versatility.

No. of Terminals: 16

With 16 terminals, this LDO provides flexible connections for various configurations, facilitating complex circuit designs.

Maximum Line Regulation: 0.046 %/V

Excellent line regulation ensures consistent output voltage with minimal variations despite changes in input voltage, providing stability.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile, making it suitable for compact electronic designs.

Adjustability: ADJUSTABLE

The adjustable feature allows for precise output voltage settings, catering to diverse application requirements.

Maximum Load Regulation: 0.6 %

Low load regulation guarantees a stable output current, which is essential for maintaining device performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm accommodates a variety of board layouts, promoting compatibility with numerous designs.

Regulator Type: ADJUSTABLE NEGATIVE SINGLE OUTPUT LDO REGULATOR

This type is ideal for applications requiring a stable negative voltage, offering flexibility in design.

Terminal Finish: Gold (Au)

Gold terminal finish enhances conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout, allowing for efficient use of space and enhanced design options.

Maximum Output Voltage: 9.5 V

The capability to deliver up to 9.5 V makes this LDO versatile for a wide range of applications.

Maximum Output Current: 3 A

With a maximum output current of 3 A, this LDO can handle power-hungry devices, ensuring reliability in high-demand situations.

Maximum Seated Height: 2.72 mm

The low seated height allows for space-saving designs, making it ideal for compact applications.

Width: 6.91 mm

A compact width enables easy integration into various electronic devices without taking up excessive board space.

Length: 9.91 mm

The moderate length ensures compatibility with standard layouts while fitting into tight spaces.

Technical Specifications

Adjustable Regulators - Negative Single Output LDO RHFL7913KPA2 attributes and parameters. Explore more Adjustable Regulators - Negative Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.8 V

JESD-30 Code:

R-CDFP-F16

JESD-609 Code:

e4

Length:

9.91 mm

Maximum Line Regulation (%/V):

.046

Maximum Load Regulation (%):

.6 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

16

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

9.5 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Qualification Status:

Not Qualified

Screening Level:

38535V;38534K;883S

Maximum Seated Height:

2.72 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Gold (Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

6.91 mm

Trade Compliance

RHFL7913KPA2 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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