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M95160-DWDW4TP/K

STMicroelectronics

M95160-DWDW4TP/K by STMicroelectronics

STMicroelectronics M95160-DWDW4TP/K is an AEC-Q100 EEPROM with 2KX8 organization, SPI serial bus type, and 16384-bit memory density. Operating at -40 to 145 °C, it's ideal for automotive applications requiring reliable data storage with 4000000 write/erase cycles endurance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,452 parts In-Stock

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4,452

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Flip Electronics

USA . 4,100 parts In-Stock

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4,100

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Vyrian

USA . 3,974 parts In-Stock

1+ parts

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3,974

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Anansix

USA . 2,076 parts In-Stock

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2,076

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,396 parts In-Stock

1+ parts

$2.855

100+ parts

-

1k+ parts

$2.569

10k+ parts

-

1,396

$2.855

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$2.569

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Microchip USA

USA . 5,246 parts In-Stock

1+ parts

$4.804

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-

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5,246

$4.804

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MKK Technologies

India . 1,223 parts In-Stock

1+ parts

$5.368

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1,223

$5.368

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DigiPath Technology Company

USA . 1,223 parts In-Stock

1+ parts

$5.368

100+ parts

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1,223

$5.368

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AZTECH Wire

Italy . 401 parts In-Stock

1+ parts

$19.150

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401

$19.150

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Perfect Parts

USA . 13,440 parts In-Stock

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13,440

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,515 parts In-Stock

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4,515

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 1,996 parts In-Stock

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$3.413

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1,996

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$3.413

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Overview

Unlock the power of innovation with the M95160-DWDW4TP/K EEPROM by STMicroelectronics. Known for their superior quality and cutting-edge technology, STMicroelectronics delivers a reliable and high-performance product that is perfect for automotive applications. This small outline, thin profile memory device offers 2Kx8 organization, 4000000 write/erase cycles, and a wide temperature range from -40 to 145 °C. With its hardware/software write protection and serial bus type, this EEPROM provides unmatched durability and versatility for your project needs. Experience the value and benefits of STMicroelectronics with the M95160-DWDW4TP/K.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Operating Mode: SYNCHRONOUS

Offers synchronous operation for efficient data transfer and processing.

Power Supplies (V): 3/5

Compatible with both 3V and 5V systems, increasing flexibility in various applications.

No. of Terminals: 8

Provides sufficient connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and design make it suitable for space-constrained environments.

Maximum Operating Temperature: 145 °C

Can withstand high temperature environments, making it suitable for automotive and industrial applications.

Organization: 2KX8

Organized in 2Kx8 configuration, offering a balance between memory capacity and speed.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable connections for long-term use.

Terminal Position: DUAL

Two terminal positions ensure secure placement and reliable connections.

Write Protection: HARDWARE/SOFTWARE

Offers multiple levels of write protection for data security and integrity.

Maximum Seated Height: 1.2 mm

Low profile design saves space and allows for compact device designs.

Maximum Clock Frequency (fCLK): 10 MHz

Supports high-speed data transfer for efficient performance.

Width: 3 mm

Compact width allows for versatile placement on circuit boards.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement for compatibility with various systems.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes.

Length: 4.4 mm

Compact length for space-efficient designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and durability.

Technology: CMOS

Uses CMOS technology for low power consumption and high performance.

Parallel or Serial: SERIAL

Serial interface for efficient data transfer and communication.

Terminal Form: GULL WING

Gull wing terminal form for secure placement and reliable connections.

Maximum Supply Current: 4 mA

Low supply current requirement for energy-efficient operation.

No. of Words: 2048 words

2048 words storage capacity for storing data and information.

Memory Width: 8

8-bit memory width for efficient data storage and retrieval.

Minimum Data Retention Time: 40

Long data retention time ensures data integrity and reliability.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise connections and secure placement.

No. of Words Code: 2K

2K words code for addressing and accessing specific memory locations.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage for compatibility with various systems.

Endurance: 4000000 Write/Erase Cycles

High endurance for reliable and long-lasting performance.

Serial Bus Type: SPI

SPI serial bus type for fast and efficient data transfer.

Maximum Write Cycle Time (tWC): 4 ms

Fast write cycle time for quick data storage and retrieval.

Memory Density: 16384 bit

High memory density for storing a large amount of data in a compact device.

Memory IC Type: EEPROM

Specifically designed EEPROM memory IC for reliable data storage and retrieval.

Maximum Standby Current: 0.000002 Amp

Ultra-low standby current for energy-efficient operation in standby mode.

Technical Specifications

EEPROM M95160-DWDW4TP/K attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

40

Endurance:

4000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

145 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

4 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95160-DWDW4TP/K Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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