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M40SZ100YMH6E

STMicroelectronics

M40SZ100YMH6E by STMicroelectronics

M40SZ100YMH6E by STMicroelectronics is a CMOS power management IC designed for industrial applications. It operates within a supply voltage range of 4.5V to 5.5V, features a compact 28-terminal SO package, and withstands temperatures from -40 °C to 85 °C. Ideal for efficient power supply support in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,882 parts In-Stock

1+ parts

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3,882

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Vyrian

USA . 3,799 parts In-Stock

1+ parts

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3,799

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Anansix

USA . 2,351 parts In-Stock

1+ parts

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2,351

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,085 parts In-Stock

1+ parts

$3.387

100+ parts

-

1k+ parts

$3.048

10k+ parts

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2,085

$3.387

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$3.048

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MKK Technologies

India . 641 parts In-Stock

1+ parts

$6.368

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641

$6.368

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DigiPath Technology Company

USA . 641 parts In-Stock

1+ parts

$6.368

100+ parts

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641

$6.368

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Corphita

USA . 4,059 parts In-Stock

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4,059

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Parana Technologies

USA . 717 parts In-Stock

1+ parts

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$4.049

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717

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$4.049

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Overview

Unlock unrivaled performance and reliability with the M40SZ100YMH6E Power Management IC from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics ensures this compact, dual-terminal solution thrives in diverse industrial applications, enhancing efficiency and longevity even in extreme environments. With a robust design and low power consumption, the M40SZ100YMH6E is your go-to choice for seamless integration and superior performance, empowering your projects to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight construction and excellent mechanical stability, making it ideal for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and simpler automated assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout on PCBs, facilitating better integration into compact designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard nominal voltage of 5V makes it compatible with a wide range of electronic devices.

Power Supplies (V): 5

Supports a fixed supply of 5V, providing reliability and consistency in performance for power-intensive applications.

No. of Terminals: 28

A higher number of terminals allows for greater functionality and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline design minimizes footprint while maximizing functionality, making it suitable for space-constrained environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for reliable operation in industrial environments.

Minimum Operating Temperature: -40 °C

A wide operating temperature range from -40 °C ensures functionality in diverse and extreme conditions.

Terminal Position: DUAL

Dual terminal positioning enhances soldering efficiency and provides better stability for the component on the PCB.

Maximum Seated Height: 3.05 mm

A low seated height ensures compatibility with low-profile designs and helps in maintaining a compact structure.

Width: 8.56 mm

The moderate width allows it to fit within standard board layouts while providing sufficient contact area for connectivity.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Its designation as a power supply support circuit highlights its specialized capability in managing power effectively.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V provides a broad operating range, enhancing versatility in power supply configurations.

Length: 18.1 mm

The standard length ensures ease of integration with existing components while maintaining design efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades ensures reliability and performance in harsh environments.

Maximum Supply Current (Isup): 1 mA

Low maximum supply current of 1 mA indicates efficient power management, contributing to energy savings in applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high performance, making it suitable for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and enhance the mechanical stability of the IC on the printed circuit board.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances ease of handling with compact layout opportunities on PCB.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum voltage of 5.5V provides design flexibility while ensuring safety margins against over-voltage.

Technical Specifications

Power Management ICs M40SZ100YMH6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO OPERATE ON 3V SUPPLY

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.56 mm

Trade Compliance

M40SZ100YMH6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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