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M40SZ100YMH6F

STMicroelectronics

M40SZ100YMH6F by STMicroelectronics

M40SZ100YMH6F by STMicroelectronics is a CMOS power management IC designed for industrial applications. It operates within a supply voltage range of 4.5V to 5.5V, features a compact 28-terminal SO package, and withstands temperatures from -40 °C to 85 °C. Ideal for efficient power supply support in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,645 parts In-Stock

1+ parts

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2,645

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Digiode

USA . 2,505 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,505

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Vyrian

USA . 1,093 parts In-Stock

1+ parts

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1,093

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,148 parts In-Stock

1+ parts

$14.897

100+ parts

-

1k+ parts

$13.407

10k+ parts

-

2,148

$14.897

-

$13.407

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MKK Technologies

India . 940 parts In-Stock

1+ parts

$28.012

100+ parts

-

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940

$28.012

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DigiPath Technology Company

USA . 940 parts In-Stock

1+ parts

$28.012

100+ parts

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940

$28.012

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Corphita

USA . 2,722 parts In-Stock

1+ parts

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2,722

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Parana Technologies

USA . 708 parts In-Stock

1+ parts

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100+ parts

$17.811

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708

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$17.811

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Overview

Elevate your power management solutions with the M40SZ100YMH6F from STMicroelectronics, a trusted leader in innovative technology. Designed for efficiency and reliability, this compact IC excels in industrial applications, ensuring optimal performance even in extreme temperatures. With its superior build quality and low power consumption, it guarantees long-lasting durability while providing exceptional value for your projects. Choose STMicroelectronics for unmatched expertise and transformative results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making this product reliable for various applications.

Surface Mount: YES

Surface-mount technology allows for compact design and easier integration into modern electronic devices, enhancing overall efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on printed circuit boards (PCBs), optimizing layout and design.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is standard for many digital circuits, making this IC versatile and widely compatible.

Power Supplies (V): 5

This specification indicates that the IC operates with a standard 5 V power supply, simplifying design requirements for developers.

No. of Terminals: 28

28 terminals provide ample connectivity options for diverse functionalities, allowing for complex configurations and integrations.

Package Style (Meter): SMALL OUTLINE

The small outline package design allows for higher density of components on PCBs, aiding in the design of compact devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this IC suitable for industrial applications where high temperatures are a factor.

Minimum Operating Temperature: -40 °C

The ability to function in temperatures as low as -40 °C ensures this product is ideal for harsh environments, adding to its robustness.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility, making it easier to design effective and space-efficient circuitry.

Maximum Seated Height: 3.05 mm

A low seated height of 3.05 mm facilitates the design of slim profile devices, catering to modern consumer demands for compactness.

Width: 8.56 mm

A modest width of 8.56 mm allows for easier integration into narrow spaces without compromising other design elements.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being part of the power supply support circuit category makes this IC crucial for stable power management in various electronics.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5 V, this IC accommodates applications with slightly lower voltage requirements, adding flexibility.

Length: 18.1 mm

Its length of 18.1 mm balances space-saving design while offering sufficient pin configurations for extensive connectivity.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC is designed for use in demanding environments, ensuring reliability over a wide range of conditions.

Maximum Supply Current (Isup): 1 mA

A low maximum supply current of 1 mA indicates high efficiency, essential for battery-operated and low-power applications.

Technology: CMOS

Using CMOS technology allows for reduced power consumption and increased performance, making the product suitable for modern low-power designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and reliability in mounting, ensuring a solid connection on PCBs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for standard PCB layout and component placement, facilitating easier assembly and manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to operate up to 5.5 V enhances compatibility with a wider range of power supplies, making it versatile for various applications.

Technical Specifications

Power Management ICs M40SZ100YMH6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO OPERATE ON 3V SUPPLY

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.56 mm

Trade Compliance

M40SZ100YMH6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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