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M24C64-WBN6P

STMicroelectronics

M24C64-WBN6P by STMicroelectronics

M24C64-WBN6P by STMicroelectronics is an 8Kx8 EEPROM with a memory density of 65536 bits. It operates at a max clock frequency of 0.4 MHz and has an endurance of 1,000,000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$0.490

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$0.490

100+ parts

-

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30

$0.490

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Vyrian

USA . 5,522 parts In-Stock

1+ parts

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5,522

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Digiode

USA . 2,273 parts In-Stock

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2,273

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ACDS - Activité Composants Distribution Service

France . 1,300 parts In-Stock

1+ parts

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1,300

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Goldney Electronics S.L.

Spain . 450 parts In-Stock

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450

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Chip Stock

USA . 314 parts In-Stock

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314

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Greenchips

USA . 116 parts In-Stock

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116

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SIE Connect GmbH - GreenChips

Germany . 116 parts In-Stock

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116

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Anansix

USA . 108 parts In-Stock

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108

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Halfin

Belgium . 30 parts In-Stock

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30

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SPM Sales

USA . 20 parts In-Stock

1+ parts

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20

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Avant Electronics Limited

UK . 16 parts In-Stock

1+ parts

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16

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,312 parts In-Stock

1+ parts

$0.490

100+ parts

-

1k+ parts

-

10k+ parts

$0.480

3,312

$0.490

-

-

$0.480

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.490

100+ parts

-

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1,000

$0.490

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Argo Parts USA

USA . 597 parts In-Stock

1+ parts

$0.490

100+ parts

-

1k+ parts

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10k+ parts

$0.475

597

$0.490

-

-

$0.475

Corohmni

South Africa . 466 parts In-Stock

1+ parts

$2.632

100+ parts

-

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466

$2.632

-

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IDEA Electronic Components Group

UK . 406 parts In-Stock

1+ parts

$2.998

100+ parts

-

1k+ parts

$2.698

10k+ parts

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406

$2.998

-

$2.698

-

Aztec Data Supply Inc.

USA . 4,861 parts In-Stock

1+ parts

$3.870

100+ parts

-

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4,861

$3.870

-

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Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$4.586

100+ parts

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1k+ parts

$4.403

10k+ parts

$4.403

50

$4.586

-

$4.403

$4.403

MKK Technologies

India . 321 parts In-Stock

1+ parts

$5.638

100+ parts

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321

$5.638

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DigiPath Technology Company

USA . 321 parts In-Stock

1+ parts

$5.638

100+ parts

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321

$5.638

-

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Ampacity Inc.

Singapore . 1,540 parts In-Stock

1+ parts

$6.000

100+ parts

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1,540

$6.000

-

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AZTECH Wire

Italy . 868 parts In-Stock

1+ parts

$8.391

100+ parts

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868

$8.391

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Microchip USA

USA . 177 parts In-Stock

1+ parts

$12.116

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177

$12.116

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Lixinc

USA . 11,634 parts In-Stock

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11,634

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Perfect Parts

USA . 4,545 parts In-Stock

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4,545

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Eliminating Global Boundries, Inc

USA . 2,000 parts In-Stock

1+ parts

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2,000

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A-Z Elektronik GmbH

Germany . 1,910 parts In-Stock

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1,910

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Parana Technologies

USA . 1,467 parts In-Stock

1+ parts

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100+ parts

$3.585

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1,467

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$3.585

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Alle Elektronik GmbH

Germany . 961 parts In-Stock

1+ parts

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961

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Corphita

USA . 954 parts In-Stock

1+ parts

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954

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Overview

Unlock the power of reliable memory storage with the M24C64-WBN6P EEPROM by STMicroelectronics. As a trusted manufacturer, STMicroelectronics delivers top-quality products suitable for a wide range of applications. The M24C64-WBN6P offers unparalleled value with its durable construction and high performance, providing customers with a dependable solution for their memory storage needs. Experience the benefits of seamless data retrieval and secure write protection in a compact and efficient package. Trust STMicroelectronics to deliver excellence in every byte.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM, ensuring reliable performance over time.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply allows for compatibility with various systems and applications.

Organization: 8KX8

Offers a high storage capacity of 8K words, suitable for storing a significant amount of data.

Parallel or Serial: SERIAL

Serial communication allows for easy integration with other digital systems and devices.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures longevity and reliability in write and erase operations, making it a cost-effective choice for frequent data updates.

Maximum Clock Frequency (fCLK): 0.4 MHz

Good clock frequency enables efficient data transfer and operation speed.

No. of Words: 8192 words

The high number of words provides ample storage capacity for data-intensive applications.

Memory Density: 65536 bit

High memory density allows for storing a large amount of data in a compact space.

Serial Bus Type: I2C

I2C protocol support ensures compatibility with a wide range of devices and systems.

Maximum Standby Current: 0.000002 Amp

Low standby current consumption helps in conserving power and prolonging battery life.

Technical Specifications

EEPROM M24C64-WBN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C64-WBN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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