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M24C64-FMB6TG

STMicroelectronics

M24C64-FMB6TG by STMicroelectronics

M24C64-FMB6TG from STMicroelectronics is a compact 64Kb EEPROM with I2C interface, ideal for industrial applications. It operates at 1.8-5.5V, features a max clock frequency of 400kHz, and offers 1M write/erase cycles. Its small outline design ensures efficient space utilization in devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,494 parts In-Stock

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Digiode

USA . 4,356 parts In-Stock

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4,356

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Anansix

USA . 1,268 parts In-Stock

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Prism Electronics

USA . 255 parts In-Stock

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SPM Sales

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IDEA Electronic Components Group

UK . 1,963 parts In-Stock

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$4.760

100+ parts

-

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$4.284

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$4.760

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$4.284

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MKK Technologies

India . 445 parts In-Stock

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$8.951

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445

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DigiPath Technology Company

USA . 445 parts In-Stock

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$8.951

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445

$8.951

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AZTECH Wire

Italy . 786 parts In-Stock

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$9.530

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786

$9.530

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Kepictronics

USA . 8,198 parts In-Stock

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Microchip USA

USA . 5,702 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,262 parts In-Stock

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Corphita

USA . 4,195 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,508 parts In-Stock

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Parana Technologies

USA . 1,751 parts In-Stock

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$5.691

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Perfect Parts

USA . 286 parts In-Stock

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Overview

Unlock the potential of your designs with the M24C64-FMB6TG EEPROM from STMicroelectronics, a trusted leader in innovation. With its robust performance across a wide temperature range and minimal power consumption, this compact memory solution is perfect for industrial applications requiring reliability and longevity. Experience seamless integration and enhanced data storage capabilities that empower your projects while ensuring quality backed by ST's excellence in semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and component placement on boards, enhancing design flexibility.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates and overall system performance, making it ideal for high-speed applications.

Nominal Supply Voltage / Vsup: 1.8 V

Low operating voltage of 1.8V reduces power consumption, making it energy-efficient for battery-operated devices.

Power Supplies: 1.8/5 V

Dual voltage options provide versatility in design, allowing compatibility with various systems.

No. of Terminals: 8

With 8 terminals, it supports multiple functions while maintaining a simple and manageable layout.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

A thin profile with heat sink capability enhances thermal performance, ensuring reliable operation in compact spaces.

Maximum Operating Temperature: 85 °C

An extended operational temperature range ensures reliability and performance in demanding industrial environments.

Organization: 8Kx8

The organization of 8K x 8 provides sufficient data storage for a wide array of applications while maximizing efficiency.

Minimum Operating Temperature: -40 °C

Operational capability in extreme low temperatures ensures robust performance in challenging conditions.

I2C Control Byte: 1010DDDR

Utilizing I2C for control simplifies communication and integration with various microcontrollers.

Terminal Position: DUAL

Dual terminal positioning enables flexible mounting options, accommodating different PCB designs.

Write Protection: HARDWARE

Hardware write protection offers enhanced data security against unintended modifications, critical for crucial applications.

Maximum Seated Height: 0.6 mm

A low seated height allows for space-saving designs while ensuring compatibility with low-profile applications.

Maximum Clock Frequency (fCLK): 0.4 MHz

A clock frequency of 0.4 MHz strikes a balance between performance and power consumption for standard applications.

Width: 2 mm

Compact width facilitates easy integration into devices with limited space.

Minimum Supply Voltage (Vsup): 1.7 V

Lower minimum supply voltage enhances versatility in various applications while maintaining stability.

Length: 3 mm

Short length contributes to space-efficient designs, making it ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this EEPROM can withstand harsh conditions, ensuring long service life.

Technology: CMOS

CMOS technology enhances reliability, performance, and reduced power consumption in comparison to other technologies.

Parallel or Serial: SERIAL

Serial communication simplifies interfacing and reduces pin count, increasing design flexibility.

Terminal Form: NO LEAD

No-lead design minimizes board space usage and enhances thermal performance.

Maximum Supply Current: 3 mA

Low supply current contributes to overall system energy efficiency, making it suitable for battery-powered devices.

No. of Words: 8192 words

A capacity of 8192 words provides ample storage for a wide range of applications without compromising performance.

Memory Width: 8

An 8-bit memory width is a standard in applications, balancing storage capacity and performance.

Minimum Data Retention Time: 40 years

Long data retention capability ensures reliability over extended periods, critical for important data storage.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for compact designs while maintaining accessibility for soldering.

No. of Words Code: 8K

The 8K words are optimal for various applications, providing a balance of storage size to complexity.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum voltage of 5.5V ensures compatibility with a wide range of devices while providing a safety margin.

Endurance: 1000000 Write/Erase Cycles

High endurance rating allows for extensive use in write-intensive applications, ensuring long-term reliability.

Serial Bus Type: I2C

Utilizing the I2C protocol allows for efficient communication with various peripheral devices, enhancing scalability.

Maximum Write Cycle Time (tWC): 5 ms

Short write cycle time increases throughput for applications requiring rapid data updates.

Memory Density: 65536 bit

High memory density allows for significant data storage in a compact form factor, suitable for modern applications.

Memory IC Type: EEPROM

As an EEPROM, it provides non-volatile memory, retaining information without power, essential for critical data storage.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current ensures minimal power consumption, making it ideal for low-power applications.

Technical Specifications

EEPROM M24C64-FMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C64-FMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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