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M24C64-FDW5TP

STMicroelectronics

M24C64-FDW5TP by STMicroelectronics

M24C64-FDW5TP by STMicroelectronics is a 64Kb EEPROM with I2C interface, ideal for low-power applications. It operates at 1.8-5.5V, features a max clock frequency of 400kHz, and supports up to 1M write/erase cycles. Its compact design suits space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,795 parts In-Stock

1+ parts

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10,795

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Digiode

USA . 3,348 parts In-Stock

1+ parts

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3,348

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Anansix

USA . 1,833 parts In-Stock

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1,833

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 741 parts In-Stock

1+ parts

$4.604

100+ parts

-

1k+ parts

$4.143

10k+ parts

-

741

$4.604

-

$4.143

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MKK Technologies

India . 955 parts In-Stock

1+ parts

$8.657

100+ parts

-

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955

$8.657

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DigiPath Technology Company

USA . 955 parts In-Stock

1+ parts

$8.657

100+ parts

-

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955

$8.657

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AZTECH Wire

Italy . 1,009 parts In-Stock

1+ parts

$10.800

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1,009

$10.800

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Component Stockers USA

USA . 336 parts In-Stock

1+ parts

$99.990

100+ parts

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336

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 24,570 parts In-Stock

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24,570

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Microchip USA

USA . 7,739 parts In-Stock

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7,739

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Parana Technologies

USA . 2,225 parts In-Stock

1+ parts

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100+ parts

$5.504

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2,225

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$5.504

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Corphita

USA . 1,949 parts In-Stock

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1,949

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Overview

Unlock the potential of your designs with the M24C64-FDW5TP EEPROM from STMicroelectronics—a leader in innovation and reliability. This compact solution combines exceptional data retention and endurance, ensuring your applications run smoothly in various environments. Ideal for consumer electronics, automotive systems, and industrial controls, it offers remarkable performance and low power consumption, empowering you to create smarter, energy-efficient products that stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and is suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on PCBs.

Package Shape: RECTANGULAR

The rectangular shape is common and compatible with standard PCB layouts, making it easy to integrate.

Operating Mode: SYNCHRONOUS

Synchronous operation improves speed and data transfer efficiency compared to asynchronous designs.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage makes this EEPROM ideal for battery-operated devices, enhancing power efficiency.

Power Supplies (V): 1.8/5

Dual voltage supply capability allows flexibility in various applications and system designs.

No. of Terminals: 8

With 8 terminals, this device is compact and simplifies integration with microcontrollers.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline save space and make it suitable for dense circuit boards.

Maximum Operating Temperature: 85 °C

Operating at high temperatures makes this EEPROM reliable in demanding applications.

Organization: 8KX8

With 8 Kilobits organized in 8-bit words, it is suitable for moderate data storage needs.

Minimum Operating Temperature: -20 °C

This wide temperature range allows it to function in various environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish ensures excellent solderability and reliability in connections.

I2C Control Byte: 1010DDDR

This standard control byte simplifies communication in I2C-based systems.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility on the PCB.

Write Protection: HARDWARE

Hardware write protection ensures data integrity and prevents accidental overwrites.

Maximum Seated Height: 1.2 mm

A low seated height helps maintain a slim profile in electronic designs.

Maximum Clock Frequency (fCLK): 0.4 MHz

The clock frequency is suitable for moderate-speed applications, providing a balance of performance and power consumption.

Width: 3 mm

Compact width contributes to saving board space and facilitating designs in small devices.

Minimum Supply Voltage (Vsup): 1.7 V

A minimum supply voltage of 1.7 V allows operation with lower power sources.

Length: 4.4 mm

Short length helps minimize board space while providing necessary functionality.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-operated applications.

Parallel or Serial: SERIAL

Serial communication reduces pin count, simplifying the interface with microcontrollers.

Terminal Form: GULL WING

Gull wing terminals ensure good mechanical stability and reliable solder connections.

Maximum Supply Current: 3 mA

Low supply current signifies energy efficiency, extending battery life in portable devices.

No. of Words: 8192 words

With the capacity of 8192 words, it's suitable for applications requiring moderate data storage.

Memory Width: 8

An 8-bit memory width allows efficient data handling and aligns well with most microcontroller architectures.

Minimum Data Retention Time: 40

A minimum data retention time of 40 years ensures long-term data stability and reliability.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch supports compatibility with many existing designs and makes soldering easier.

No. of Words Code: 8K

An 8K word capacity meets the requirements of many embedded applications.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a higher supply voltage enhances versatility in different electronic designs.

Endurance: 1000000 Write/Erase Cycles

High endurance of 1,000,000 cycles ensures long service life, making it suitable for frequently updated data.

Serial Bus Type: I2C

The I2C bus type increases versatility in communication with various microcontrollers and devices.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms provides effective speed for data updates.

Memory Density: 65536 bit

The memory density of 65536 bits supports a variety of applications from simple to moderately complex.

Memory IC Type: EEPROM

As an EEPROM type, it allows for non-volatile storage that retains data without power.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current enhances energy efficiency, essential for battery-powered products.

Technical Specifications

EEPROM M24C64-FDW5TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.4 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C64-FDW5TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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