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M24C32-RMB6TG

STMicroelectronics

M24C32-RMB6TG by STMicroelectronics

M24C32-RMB6TG by STMicroelectronics is a 32Kb EEPROM with I2C interface, ideal for automotive applications due to its AEC-Q100 screening. It operates at 1.8V-5.5V and supports up to 1M write/erase cycles, ensuring reliability in harsh environments. Its compact size (3mm x 2mm) and low power consumption make it suitable for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 4,999 parts In-Stock

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4,999

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Digiode

USA . 3,801 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,120 parts In-Stock

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Anansix

USA . 895 parts In-Stock

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895

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Velocity Electronics

USA . 739 parts In-Stock

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Sunrise Surplus Inc.

USA . 92 parts In-Stock

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IDEA Electronic Components Group

UK . 2,204 parts In-Stock

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$5.110

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$4.599

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2,204

$5.110

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$4.599

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AZTECH Wire

Italy . 1,143 parts In-Stock

1+ parts

$8.250

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1,143

$8.250

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MKK Technologies

India . 1,891 parts In-Stock

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$9.608

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$9.608

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DigiPath Technology Company

USA . 1,891 parts In-Stock

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$9.608

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1,891

$9.608

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Microchip USA

USA . 263 parts In-Stock

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$15.969

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GreenTree Electronics

Israel . 36,525 parts In-Stock

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Kepictronics

USA . 12,495 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,983 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,322 parts In-Stock

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3,322

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Parana Technologies

USA . 2,378 parts In-Stock

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$6.109

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$6.109

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 727 parts In-Stock

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727

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Overview

Unlock the power of reliable data storage with the M24C32-RMB6TG EEPROM from STMicroelectronics, a leader in semiconductor innovation. This compact, high-performance memory solution thrives in harsh environments, offering impressive endurance and low power consumption, making it perfect for automotive and industrial applications. With superior quality backed by AEC-Q100 certification, experience seamless integration and enhanced functionality—boosting your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making the EEPROM suitable for a variety of applications.

Surface Mount: YES

Being surface mount allows for a compact design and easier integration into modern PCB layouts, making it ideal for space-constrained applications.

Screening Level: AEC-Q100

Compliant with AEC-Q100 screening ensures reliability for automotive and industrial applications.

Package Shape: RECTANGULAR

The rectangular shape promotes efficient use of PCB space and easier alignment during manufacturing.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates and improved system performance.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a nominal voltage of 2.5 V supports energy-efficient designs, essential for battery-powered applications.

Power Supplies (V): 2/5

Wide voltage range supports versatile applications, allowing for flexibility in system designs.

No. of Terminals: 8

Eight terminals enable a straightforward connection to other components and ease assembly.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and very thin profile allow for efficient use of space in compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderately high-temperature environments.

Organization: 4KX8

This organization indicates the memory is structured for efficient access, suitable for a variety of data storage needs.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures makes this EEPROM ideal for outdoor and harsh environment applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent durability and resistance to corrosion, enhancing long-term reliability.

I2C Control Byte: 1010DDDR

The specified I2C control byte enables standardized communication, simplifying integration into existing systems.

Terminal Position: DUAL

Dual terminal positions allow for better connection options and layout flexibility on the PCB.

Write Protection: HARDWARE

Hardware write protection offers increased data integrity and security against accidental overwrite.

Maximum Seated Height: 0.6 mm

Slim profile facilitates the design of low-profile devices and ensures compatibility with compact designs.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz provides sufficient speed for many low-speed applications, optimizing performance.

Width: 2 mm

Compact width allows for use in dense circuit layouts, fitting into small devices without sacrificing performance.

Minimum Supply Voltage (Vsup): 1.8 V

The minimum supply voltage of 1.8 V further enhances energy efficiency in low-power designs.

Length: 3 mm

The small length contributes to making this EEPROM a versatile choice for various space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial grade temperature classification guarantees reliability in demanding environments, suitable for a wide range of applications.

Technology: CMOS

CMOS technology ensures low power consumption, contributing to longer battery life in portable devices.

Parallel or Serial: SERIAL

Serial communication minimizes the number of pins needed for connection, optimizing design and manufacturing processes.

Terminal Form: NO LEAD

The no-lead terminal form enhances reliability during mounting processes and reduces board space.

Maximum Supply Current: 0.8 mA

A low maximum supply current enables power savings, making it suitable for energy-sensitive applications.

No. of Words: 4096 words

With 4096 words of memory, this EEPROM provides ample storage for various applications requiring data retention.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and aligns with common microcontroller architectures.

Minimum Data Retention Time: 40 years

Long data retention time ensures that critical information remains intact even without power, enhancing reliability.

Terminal Pitch: 0.5 mm

A standard terminal pitch of 0.5 mm facilitates compatibility with various PCB designs and assembly processes.

No. of Words Code: 4K

The 4K memory code gives a clear understanding of capacity, suitable for diverse applications requiring EEPROM functionality.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows flexibility in power supply options, accommodating various system requirements.

Endurance: 1,000,000 Write/Erase Cycles

High endurance ratings ensure longevity and reliability, suitable for applications requiring frequent data updates.

Serial Bus Type: I2C

Utilizing the widely adopted I2C protocol ensures compatibility with a range of devices and simplifies integration.

Maximum Write Cycle Time (tWC): 5 ms

Rapid write cycle time enhances efficiency in systems that require frequent data updates, improving overall performance.

Memory Density: 32768 bit

With a memory density of 32768 bits, this EEPROM provides effective storage capacity for a wide range of applications.

Memory IC Type: EEPROM

Being an EEPROM type facilitates non-volatile storage, essential for applications needing to retain data during power loss.

Maximum Standby Current: 0.0000002 Amp

Extremely low standby current ensures minimal power drain, making this EEPROM an excellent choice for energy-efficient designs.

Technical Specifications

EEPROM M24C32-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C32-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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