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M24C16-FMB5TG

STMicroelectronics

M24C16-FMB5TG by STMicroelectronics

M24C16-FMB5TG from STMicroelectronics is a 2Kx8 EEPROM with a synchronous operating mode and I2C interface. It operates b/w 1.8V to 5.5V, features hardware write protection, and supports up to 1M write/erase cycles. Ideal for compact applications requiring reliable data storage in a small footprint.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,618 parts In-Stock

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12,618

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Digiode

USA . 2,362 parts In-Stock

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2,362

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Anansix

USA . 1,587 parts In-Stock

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1,587

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 563 parts In-Stock

1+ parts

$3.092

100+ parts

-

1k+ parts

$2.783

10k+ parts

-

563

$3.092

-

$2.783

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MKK Technologies

India . 206 parts In-Stock

1+ parts

$5.815

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-

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206

$5.815

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DigiPath Technology Company

USA . 206 parts In-Stock

1+ parts

$5.815

100+ parts

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206

$5.815

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Microchip USA

USA . 473 parts In-Stock

1+ parts

$16.308

100+ parts

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473

$16.308

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AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$20.130

100+ parts

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752

$20.130

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Corphita

USA . 3,184 parts In-Stock

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3,184

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Parana Technologies

USA . 344 parts In-Stock

1+ parts

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$3.697

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344

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$3.697

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Overview

Unlock innovation with the M24C16-FMB5TG EEPROM from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This ultra-compact component ensures reliable data storage and retrieval, making it perfect for a range of applications including consumer electronics, automotive systems, and smart devices. With its robust performance, low power consumption, and proven durability, this EEPROM elevates your designs while enhancing efficiency and reliability—empowering you to bring your ideas to life!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides protection against environmental factors, ensuring reliability in different applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuit boards, enhancing manufacturability.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on PCBs, making it suitable for varied applications.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances speed and efficiency in data transfer, ideal for high-performance applications.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V optimizes power consumption, making it suitable for battery-operated devices.

Power Supplies (V): 1.8/5 V

Supports a wide range of power supply options, allowing for increased compatibility with various systems.

No. of Terminals: 8

With 8 terminals, it provides sufficient connections for efficient integration, ensuring versatility in PCB layout.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The slim profile and small outline optimize space on PCBs and enhance thermal management for heat-sensitive applications.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures ensures reliability in varied environmental conditions.

Organization: 2KX8

An organized configuration facilitates efficient data storage and retrieval, optimizing performance in applications.

Minimum Operating Temperature: -20 °C

Withstanding low temperatures makes this EEPROM suitable for outdoor and industrial applications.

I2C Control Byte: 1010MMMR

The I2C control capability allows for straightforward interfacing with microcontrollers, simplifying design processes.

Terminal Position: DUAL

Dual terminal positioning enhances mounting flexibility and ensures secure connections during operation.

Write Protection: HARDWARE

Hardware write protection mitigates the risk of accidental data loss, ensuring data integrity in critical applications.

Maximum Seated Height: 0.6 mm

A low profile height allows for compact device designs, fitting well in space-constrained environments.

Maximum Clock Frequency (fCLK): 0.4 MHz

Operating at a maximum clock frequency of 0.4 MHz is adequate for many low-speed applications, balancing performance and energy use.

Width: 2 mm

The compact width aids in efficient board layout and enhances design flexibility.

Minimum Supply Voltage (Vsup): 1.7 V

Operational at a low minimum supply voltage helps in energy conservation, beneficial for battery-powered devices.

Length: 3 mm

The compact length contributes to minimizing the overall footprint of devices, enabling tighter design specifications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient and reliable performance.

Parallel or Serial: SERIAL

Serial communication reduces pin count and simplifies connections, making it easier to integrate into compact circuit designs.

Terminal Form: NO LEAD

No-lead terminals improve solderability and enable mounting in space-limited applications.

Maximum Supply Current: 0.8 mA

Low maximum supply current reduces overall power consumption, making this product ideal for energy-efficient designs.

No. of Words: 2048 words

With 2048 words of memory, it offers sufficient space for a wide range of data storage applications.

Memory Width: 8

An 8-bit memory width supports compact data storage, providing efficient space utilization in memory-intensive applications.

Minimum Data Retention Time: 40 years

Exceptional data retention time ensures long-term preservation of critical information, reducing maintenance needs.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high density in PCB layouts, enabling smaller devices and better functionality.

No. of Words Code: 2K

The 2K word capacity is suitable for various applications, including embedded systems and configuration memory.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle up to 5.5 V supply voltage enhances flexibility in diverse application environments.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating ensures long-term reliability and durability in applications requiring frequent data updates.

Serial Bus Type: I2C

I2C compatibility simplifies multi-device communication, making it ideal for complex systems with various components.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time allows for quick data updates, enhancing performance in real-time applications.

Memory Density: 16,384 bit

High memory density offers ample space for data storage, meeting extensive requirements for modern electronics.

Memory IC Type: EEPROM

As an EEPROM type, it provides non-volatile storage, maintaining data without power, essential for critical applications.

Maximum Standby Current: 0.000001 Amp

Ultra-low standby current optimizes power efficiency, making it suitable for battery-operated applications.

Technical Specifications

EEPROM M24C16-FMB5TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010MMMR

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C16-FMB5TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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