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M24C08-WMN6

STMicroelectronics

M24C08-WMN6 by STMicroelectronics

STMicroelectronics M24C08-WMN6 is an EEPROM with 1KX8 organization, operating at 5V. It offers 1000000 Write/Erase cycles, I2C serial bus type, and a max clock frequency of 0.4 MHz. Ideal for industrial applications requiring reliable non-volatile memory storage in a small outline package.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 166 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

1k+ parts

$0.750

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166

$1.150

$0.870

$0.750

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Vyrian

USA . 11,306 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,248 parts In-Stock

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Digiode

USA . 2,027 parts In-Stock

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2,027

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Microfarads

USA . 1,937 parts In-Stock

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Bristol Electronics

USA . 431 parts In-Stock

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431

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Anansix

USA . 411 parts In-Stock

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411

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ACDS - Activité Composants Distribution Service

France . 385 parts In-Stock

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385

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R&J Components

USA . 200 parts In-Stock

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200

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LIBRA Elektronik GmbH

Germany . 182 parts In-Stock

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182

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Prism Electronics

USA . 154 parts In-Stock

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154

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Fibra_Brandt Electronic GMBH

Germany . 67 parts In-Stock

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67

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Resion

USA . 39 parts In-Stock

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39

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ComSIT Distribution GmbH

Germany . 38 parts In-Stock

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LittleDiode

UK . 33 parts In-Stock

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33

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LWI Electronics Inc

India . 22 parts In-Stock

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22

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Donberg Electronics Ltd

Ireland . 1 parts In-Stock

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1

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,347 parts In-Stock

1+ parts

$5.481

100+ parts

-

1k+ parts

$4.933

10k+ parts

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2,347

$5.481

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$4.933

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MKK Technologies

India . 283 parts In-Stock

1+ parts

$10.307

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283

$10.307

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DigiPath Technology Company

USA . 283 parts In-Stock

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$10.307

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283

$10.307

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AZTECH Wire

Italy . 967 parts In-Stock

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$17.110

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967

$17.110

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Microchip USA

USA . 214 parts In-Stock

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$340.104

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214

$340.104

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RC Electronics

USA . 500,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,102 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,068 parts In-Stock

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Corphita

USA . 2,712 parts In-Stock

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Perfect Parts

USA . 1,033 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 595 parts In-Stock

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595

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Parana Technologies

USA . 515 parts In-Stock

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$6.554

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515

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$6.554

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Kepictronics

USA . 370 parts In-Stock

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370

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Glotronic Ltd.

UK . 308 parts In-Stock

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Assy Fe

Spain . 140 parts In-Stock

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Overview

Unlock the power of reliable data storage with the M24C08-WMN6 EEPROM by STMicroelectronics. Crafted with precision and quality, this small yet mighty package offers endless possibilities for applications in industrial settings. With a nominal supply voltage of 5V and a maximum clock frequency of 0.4 MHz, this EEPROM provides high performance with minimal power consumption. Say goodbye to data loss worries with a memory density of 8192 bits and an endurance of 1 million write/erase cycles. Trust in STMicroelectronics to deliver top-notch technology that exceeds your expectations. Elevate your projects with the M24C08-WMN6 and experience unparalleled efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying the overall design.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures reliable and precise data transfer, making the EEPROM suitable for applications requiring synchronized communication.

Nominal Supply Voltage / Vsup (V): 5

Having a nominal supply voltage of 5V enables compatibility with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 8

Having only 8 terminals simplifies the connection process and reduces the chances of errors during installation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the EEPROM can function reliably in harsh industrial environments without the risk of overheating.

Memory Density: 8192 bit

The high memory density allows for storing a large amount of data in a compact form, making the EEPROM suitable for applications requiring extensive data storage.

Endurance: 1000000 Write/Erase Cycles

The high endurance level ensures that the EEPROM can withstand frequent write and erase operations, extending its lifespan and reliability.

Technical Specifications

EEPROM M24C08-WMN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DMMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C08-WMN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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