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M24C08-WBN6

STMicroelectronics

M24C08-WBN6 by STMicroelectronics

M24C08-WBN6 by STMicroelectronics is an EEPROM with 1KX8 organization, 8192 bit memory density, and 1000000 Write/Erase cycles endurance. It operates in synchronous mode with a max clock frequency of 0.4 MHz. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$0.593

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.593

100+ parts

-

1k+ parts

-

10k+ parts

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50

$0.593

-

-

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Vyrian

USA . 12,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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12,271

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-

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Euro-Tech

UK . 1,488 parts In-Stock

1+ parts

-

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1,488

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-

-

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Digiode

USA . 889 parts In-Stock

1+ parts

-

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-

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889

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-

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Anansix

USA . 655 parts In-Stock

1+ parts

-

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655

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Sogenti Electronics

Canada . 300 parts In-Stock

1+ parts

-

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300

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Prism Electronics

USA . 79 parts In-Stock

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79

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,595 parts In-Stock

1+ parts

$0.593

100+ parts

-

1k+ parts

-

10k+ parts

$0.581

4,595

$0.593

-

-

$0.581

Argo Parts USA

USA . 1,732 parts In-Stock

1+ parts

$0.593

100+ parts

-

1k+ parts

-

10k+ parts

$0.575

1,732

$0.593

-

-

$0.575

Microchip USA

USA . 346 parts In-Stock

1+ parts

$1.406

100+ parts

-

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346

$1.406

-

-

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IDEA Electronic Components Group

UK . 283 parts In-Stock

1+ parts

$1.940

100+ parts

-

1k+ parts

$1.746

10k+ parts

-

283

$1.940

-

$1.746

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Aztec Data Supply Inc.

USA . 3,723 parts In-Stock

1+ parts

$2.800

100+ parts

-

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3,723

$2.800

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MKK Technologies

India . 1,923 parts In-Stock

1+ parts

$3.649

100+ parts

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1,923

$3.649

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DigiPath Technology Company

USA . 1,923 parts In-Stock

1+ parts

$3.649

100+ parts

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1,923

$3.649

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Corohmni

South Africa . 88 parts In-Stock

1+ parts

$4.810

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88

$4.810

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AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$11.411

100+ parts

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221

$11.411

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Semicontronic

India . 568 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

10k+ parts

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568

$19.000

$18.525

$18.430

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Ampacity Inc.

Singapore . 574 parts In-Stock

1+ parts

$21.000

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574

$21.000

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RC Electronics

USA . 14,203 parts In-Stock

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14,203

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Perfect Parts

USA . 2,788 parts In-Stock

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2,788

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Corphita

USA . 2,436 parts In-Stock

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2,436

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.581

1k+ parts

$0.563

10k+ parts

$0.551

1,000

-

$0.581

$0.563

$0.551

Parana Technologies

USA . 688 parts In-Stock

1+ parts

-

100+ parts

$2.320

1k+ parts

-

10k+ parts

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688

-

$2.320

-

-

Overview

Unlock endless possibilities with the M24C08-WBN6 by STMicroelectronics. This top-notch EEPROM is designed to provide reliable performance and durability, making it a standout choice in its category. With a wide range of applications, this product offers unparalleled value and benefits to customers. Trust in the quality and expertise of STMicroelectronics to deliver a superior solution for your memory needs. Elevate your projects with the M24C08-WBN6 and experience the advantages it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the EEPROM, making it suitable for various environments.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and coordinated communication with the device, enhancing reliability and performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage allows for compatibility with a wide range of systems and applications.

Organization: 1KX8

The organization of 1KX8 allows for efficient storage and retrieval of data in a structured manner.

Memory IC Type: EEPROM

Being an EEPROM, the memory IC type offers non-volatile storage capabilities, retaining data even when power is removed.

Technical Specifications

EEPROM M24C08-WBN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DMMR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.27 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C08-WBN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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