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M24C04-WBN6

STMicroelectronics

M24C04-WBN6 by STMicroelectronics

The STMicroelectronics M24C04-WBN6 is an EEPROM with 512x8 organization, operating at 5V. It features a max clock frequency of 0.4 MHz and endurance of 1M write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,850

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-

-

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Digiode

USA . 3,920 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,920

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-

-

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Anansix

USA . 2,838 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,838

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-

-

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Bristol Electronics

USA . 373 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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373

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Dan-Mar Components

USA . 373 parts In-Stock

1+ parts

-

100+ parts

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373

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Component Sense

UK . 69 parts In-Stock

1+ parts

-

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-

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69

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Manotoh

Italy . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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50

-

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Semi Source

USA . 50 parts In-Stock

1+ parts

-

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-

1k+ parts

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50

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-

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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40

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-

-

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Corel Iberica Componentes, S.L.

Spain . 12 parts In-Stock

1+ parts

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 272 parts In-Stock

1+ parts

$2.323

100+ parts

-

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-

10k+ parts

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272

$2.323

-

-

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IDEA Electronic Components Group

UK . 1,397 parts In-Stock

1+ parts

$3.619

100+ parts

-

1k+ parts

$3.257

10k+ parts

-

1,397

$3.619

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$3.257

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MKK Technologies

India . 997 parts In-Stock

1+ parts

$6.806

100+ parts

-

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997

$6.806

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DigiPath Technology Company

USA . 997 parts In-Stock

1+ parts

$6.806

100+ parts

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997

$6.806

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AZTECH Wire

Italy . 38 parts In-Stock

1+ parts

$13.720

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38

$13.720

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Kepictronics

USA . 26,941 parts In-Stock

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26,941

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RC Electronics

USA . 13,050 parts In-Stock

1+ parts

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$0.220

1k+ parts

$0.210

10k+ parts

$0.200

13,050

-

$0.220

$0.210

$0.200

A-Z Elektronik GmbH

Germany . 10,650 parts In-Stock

1+ parts

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10,650

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Corphita

USA . 2,626 parts In-Stock

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2,626

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Parana Technologies

USA . 644 parts In-Stock

1+ parts

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100+ parts

$4.327

1k+ parts

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644

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$4.327

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Perfect Parts

USA . 56 parts In-Stock

1+ parts

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56

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Overview

Unlock endless possibilities with the M24C04-WBN6 by STMicroelectronics. This top-of-the-line EEPROM is built with precision and expertise, ensuring reliable performance in a variety of applications. Whether you're looking to store critical data or streamline your processes, this product offers unmatched value, benefits, and advantages. Trust STMicroelectronics to deliver quality products that meet your needs and exceed your expectations. Elevate your projects with the M24C04-WBN6 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the EEPROM durable and resistant to external elements, ensuring a longer lifespan.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for precise timing control and coordination with other components in the system, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides stable and reliable power to the EEPROM, ensuring consistent performance.

No. of Terminals: 8

Having 8 terminals enables easy integration and connection of the EEPROM within a circuit, simplifying the installation process.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics allow for flexible and versatile interfacing with other components, providing compatibility with various systems.

Memory Density: 4096 bit

With a high memory density of 4096 bits, this EEPROM can store a large amount of data, making it suitable for applications requiring extensive memory storage.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1,000,000 write/erase cycles ensures reliable and long-lasting performance, making the EEPROM a durable choice for frequent data read/write operations.

Technical Specifications

EEPROM M24C04-WBN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.27 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C04-WBN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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