Loading...

M24C04-RMB6TG

STMicroelectronics

M24C04-RMB6TG by STMicroelectronics

M24C04-RMB6TG from STMicroelectronics is a 4096-bit EEPROM with a synchronous operating mode and I2C interface. It operates b/w 1.8V to 5.5V, features a max temp of 85 °C, and offers hardware write protection for reliable data storage in industrial applications.

Median Price

$0.339

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.339

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.339

-

-

-

Vyrian

USA . 8,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,232

-

-

-

-

Digiode

USA . 1,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

-

-

-

-

Anansix

USA . 849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

849

-

-

-

-

Cyclops Electronics Ltd

UK . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 727 parts In-Stock

1+ parts

$3.898

100+ parts

-

1k+ parts

$3.508

10k+ parts

-

727

$3.898

-

$3.508

-

MKK Technologies

India . 579 parts In-Stock

1+ parts

$7.330

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$7.330

-

-

-

DigiPath Technology Company

USA . 579 parts In-Stock

1+ parts

$7.330

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$7.330

-

-

-

Microchip USA

USA . 211 parts In-Stock

1+ parts

$10.374

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$10.374

-

-

-

AZTECH Wire

Italy . 55 parts In-Stock

1+ parts

$16.510

100+ parts

-

1k+ parts

-

10k+ parts

-

55

$16.510

-

-

-

Corphita

USA . 4,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,961

-

-

-

-

Parana Technologies

USA . 1,435 parts In-Stock

1+ parts

-

100+ parts

$4.661

1k+ parts

-

10k+ parts

-

1,435

-

$4.661

-

-

Overview

Unlock the power of reliable data storage with the M24C04-RMB6TG EEPROM from STMicroelectronics. Renowned for its cutting-edge technology and unwavering quality, this compact memory solution excels in diverse applications, from industrial automation to consumer electronics. With robust endurance and low power consumption, it ensures unparalleled performance while safeguarding your critical data. Elevate your designs with a trusted partner that guarantees innovation and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enhances the product's ease of integration into compact designs, allowing for efficient use of space on PCBs.

Package Shape: RECTANGULAR

A rectangular shape facilitates straightforward placement and alignment within electronic devices, contributing to design flexibility.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for higher data transfer rates, improving overall system performance.

Nominal Supply Voltage / Vsup: 2.5 V

The nominal supply voltage of 2.5 V is energy-efficient, allowing for reduced power consumption in battery-operated devices.

Power Supplies (V): 2/5

Compatible with a variety of power supply voltages, ensuring versatility in different applications.

No. of Terminals: 8

Having 8 terminals provides sufficient I/O options for seamless connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

A very thin profile design aids in compact integration, ideal for space-limited applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can operate reliably in a variety of demanding environments.

Organization: 512X8

This organization provides an efficient way to store and retrieve data, optimizing memory usage.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this EEPROM suitable for industrial and automotive applications commonly faced with extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances connectivity and reduces corrosion, enhancing long-term reliability.

I2C Control Byte: 1010DDMR

This specific I2C control byte allows for easy communication with microcontrollers, simplifying system integration.

Terminal Position: DUAL

Dual terminal position enhances flexibility in layout design, enabling more adaptable configurations in circuit boards.

Write Protection: HARDWARE

Hardware write protection ensures data integrity and security, safeguarding information against unintended modifications.

Maximum Seated Height: 0.6 mm

A low seated height allows for compact placement on PCBs, critical in modern, densely packed electronic devices.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz provides a sufficient speed for many applications, balancing performance and energy consumption.

Width: 2 mm

Compact width makes this EEPROM suitable for space-constrained applications, preserving board space.

Minimum Supply Voltage (Vsup): 1.8 V

Supported minimum supply voltage of 1.8 V enhances compatibility with low-power systems.

Length: 3 mm

Short length enhances compactness, making it ideal for small electronic devices or systems.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in harsh conditions, suitable for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high-speed operation, an excellent choice for battery-powered devices.

Parallel or Serial: SERIAL

Serial communication minimizes the number of pins required, simplifying design and reducing space on the PCB.

Terminal Form: NO LEAD

A no lead design eliminates potential lead fatigue issues, allowing for more reliable connections.

Maximum Supply Current: 0.8 mA

Low maximum supply current contributes to energy efficiency, extending the life of battery-operated devices.

No. of Words: 512 words

With 512 words, it provides adequate memory capacity for many applications while ensuring easy management of data storage.

Memory Width: 8

An 8-bit memory width enables efficient data processing, suitable for a variety of applications.

Minimum Data Retention Time: 40 years

A minimum data retention time of 40 years guarantees long-term storage reliability for critical data.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher density layouts, making it easier to design compact electronic devices.

No. of Words Code: 512

Consistency in design structure with 512 words of code ensures straightforward data handling and accessibility.

Maximum Supply Voltage (Vsup): 5.5 V

Flexible supply voltage range up to 5.5 V enhances compatibility with a variety of circuit designs.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating of 1,000,000 cycles ensures durability, making it suitable for applications requiring frequent data updates.

Serial Bus Type: I2C

The use of I2C as a serial bus type simplifies communication with microcontrollers, enhancing interoperability.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms ensures quick data writing capabilities, important for real-time applications.

Memory Density: 4096 bit

With a memory density of 4096 bits, it provides sufficient storage for various applications without compromising on speed.

Memory IC Type: EEPROM

As an EEPROM, it retains memory without power, making it ideal for applications requiring non-volatile storage.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current enhances energy efficiency, making it suitable for low-power applications.

Technical Specifications

EEPROM M24C04-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C04-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20