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M24C04-MN6T

STMicroelectronics

M24C04-MN6T by STMicroelectronics

STMicroelectronics' M24C04-MN6T is an EEPROM with 512x8 organization, operating at 5V. It features I2C control byte 1010DDMR and offers 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage with a small footprint.

Median Price

-

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Prism Electronics

USA . 4,925 parts In-Stock

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4,925

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Vyrian

USA . 2,333 parts In-Stock

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2,333

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Anansix

USA . 2,217 parts In-Stock

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2,217

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Q Components

USA . 2,200 parts In-Stock

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2,200

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LIBRA Elektronik GmbH

Germany . 2,134 parts In-Stock

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2,134

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Mil-Aero Solutions, Inc.

USA . 1,975 parts In-Stock

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1,975

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R&J Components

USA . 1,975 parts In-Stock

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1,975

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Cyclops Electronics Ltd

UK . 1,600 parts In-Stock

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1,600

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Digiode

USA . 1,594 parts In-Stock

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1,594

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Pegasus Components GmbH

Germany . 784 parts In-Stock

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784

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Microfarads

USA . 729 parts In-Stock

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729

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PC Components Company LLC

USA . 552 parts In-Stock

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552

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Bristol Electronics

USA . 542 parts In-Stock

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542

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Atlantic Semiconductor

USA . 92 parts In-Stock

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92

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Distributors (Availability)

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Microchip USA

USA . 305 parts In-Stock

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$1.892

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305

$1.892

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IDEA Electronic Components Group

UK . 1,166 parts In-Stock

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$2.943

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$2.649

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$2.943

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$2.649

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MKK Technologies

India . 710 parts In-Stock

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$5.534

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710

$5.534

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DigiPath Technology Company

USA . 710 parts In-Stock

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$5.534

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710

$5.534

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AZTECH Wire

Italy . 1,182 parts In-Stock

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$21.310

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Perfect Parts

USA . 72,744 parts In-Stock

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Kepictronics

USA . 5,647 parts In-Stock

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Assy Fe

Spain . 4,954 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,750 parts In-Stock

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3,750

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Parana Technologies

USA . 1,214 parts In-Stock

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$3.519

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$3.519

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Corphita

USA . 453 parts In-Stock

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453

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Overview

Enhance your electronic designs with the reliable M24C04-MN6T EEPROM by STMicroelectronics. This small outline memory chip offers a high endurance of 1,000,000 write/erase cycles, ensuring long-lasting performance. Ideal for industrial applications, this EEPROM operates at a wide temperature range, from -40 °C to 85°C. Trust in STMicroelectronics' reputation for quality and innovation to bring value to your projects. Unlock the potential of your designs with the M24C04-MN6T EEPROM today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying production processes.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise and efficient data transfer, making the EEPROM reliable and accurate in its performance.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is common and compatible with many electronic systems, making integration easier.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options while keeping the overall design compact and efficient.

Parallel or Serial: SERIAL

The serial interface simplifies communication with the device and allows for easy integration into various systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the EEPROM can withstand harsh environmental conditions, ensuring reliable operation in various applications.

Memory Density: 4096 bit

With a high memory density, the EEPROM can store a large amount of data in a compact form factor, making it suitable for diverse applications.

Endurance: 1000000 Write/Erase Cycles

The high endurance level ensures long-term reliability and durability, making the EEPROM a cost-effective solution for frequent read/write operations.

Serial Bus Type: I2C

The I2C serial bus type offers a simple and efficient way to communicate with the EEPROM, enabling seamless integration into various digital systems.

Technical Specifications

EEPROM M24C04-MN6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C04-MN6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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