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M24C01-RDS6G

STMicroelectronics

M24C01-RDS6G by STMicroelectronics

M24C01-RDS6G from STMicroelectronics is a 1024-bit EEPROM with I2C interface, ideal for industrial applications. It operates at a supply voltage of 1.8V to 5.5V and features a max clock frequency of 400 kHz. With a temperature range of -40 °C to 85 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,209 parts In-Stock

1+ parts

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8,209

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Digiode

USA . 3,609 parts In-Stock

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3,609

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Anansix

USA . 1,380 parts In-Stock

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1,380

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,508 parts In-Stock

1+ parts

$2.998

100+ parts

-

1k+ parts

$2.698

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1,508

$2.998

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$2.698

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MKK Technologies

India . 1,523 parts In-Stock

1+ parts

$5.638

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1,523

$5.638

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DigiPath Technology Company

USA . 1,523 parts In-Stock

1+ parts

$5.638

100+ parts

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1,523

$5.638

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Microchip USA

USA . 488 parts In-Stock

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$6.969

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488

$6.969

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AZTECH Wire

Italy . 70 parts In-Stock

1+ parts

$10.360

100+ parts

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70

$10.360

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Parana Technologies

USA . 1,611 parts In-Stock

1+ parts

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$3.585

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1,611

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$3.585

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Corphita

USA . 1,072 parts In-Stock

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1,072

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Overview

Unlock a world of reliability and performance with the M24C01-RDS6G EEPROM from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics delivers an exceptional solution that boasts low power consumption, robust data retention, and impressive endurance—ideal for industrial applications. With its compact design and seamless I2C connectivity, this versatile memory chip empowers your projects, ensuring longevity and peace of mind in every byte!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling better utilization of space on circuit boards.

Package Shape: SQUARE

The square package shape facilitates easier placement and soldering on PCB, contributing to manufacturing efficiency.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, improving the overall performance of the memory device.

Nominal Supply Voltage / Vsup: 5V

Operating at a nominal voltage of 5V provides compatibility with a wide range of systems and ensures stable performance.

Power Supplies (V): 2/5

Supports multiple voltage levels (2V to 5V), making it versatile for different applications and systems.

No. of Terminals: 8

An 8-terminal configuration makes it easy to connect in various circuit designs while offering sufficient functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for space-efficient designs, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this EEPROM can function reliably in moderate thermal conditions.

Organization: 128X8

This organization allows for a clear structure in memory addressing, facilitating easy access to stored data.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C ensures that this EEPROM is suitable for industrial and extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and oxidation resistance, ensuring reliable electrical connections.

I2C Control Byte: 1010DDDR

The I2C control format allows for easy communication with microcontrollers, simplifying system integration.

Terminal Position: DUAL

Dual terminal positioning aids in securing the component firmly on the PCB, ensuring stability.

Write Protection: HARDWARE

Hardware write protection adds an extra layer of security against unintentional data modification or corruption.

Maximum Seated Height: 1.1 mm

A low seated height enables more options for compact designs and keeps the overall profile of the device slim.

Maximum Clock Frequency (fCLK): 0.4 MHz

The maximum clock frequency supports adequate speed for many applications, balancing performance and power consumption.

Width: 3 mm

A compact width of 3 mm makes it ideal for space-constrained applications while maintaining efficiency.

Minimum Supply Voltage (Vsup): 1.8 V

Supports low voltage operation starting at 1.8V, making it suitable for battery-powered devices.

Length: 3 mm

The small length keeps the overall size manageable for tight spaces, facilitating integration into small devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade qualifies this EEPROM for use in rigorous and demanding environments.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high performance levels, making it efficient for use.

Parallel or Serial: SERIAL

Serial communication minimizes pin count while maintaining flexibility, simplifying designs while keeping costs down.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and make assembly processes more straightforward.

Maximum Supply Current: 0.8 mA

Low supply current leads to reduced power consumption, which is critical for battery-operated and energy-efficient applications.

No. of Words: 128 words

A count of 128 words provides adequate storage capacity for many small data logging and memory applications.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and aligns well with most microcontroller architectures.

Minimum Data Retention Time: 40 years

Long data retention time ensures reliability in long-term storage applications, reducing risk of data loss.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is compatible with various PCB designs, allowing for flexibility in layout.

No. of Words Code: 128

This code provides straightforward addressing for accessing stored information, streamlining programming efforts.

Maximum Supply Voltage (Vsup): 5.5 V

The upper limit of 5.5V allows operation with a variety of supply configurations while ensuring robust performance.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating indicates this EEPROM can handle extensive write/erase cycles, ideal for demanding applications.

Serial Bus Type: I2C

I2C interface simplifies connections and reduces the number of required pins, enhancing design efficiency.

Maximum Write Cycle Time (tWC): 5 ms

Short write cycle time enables quicker data updates, making it suitable for real-time or near-real-time applications.

Memory Density: 1024 bits

An adequate memory density for many applications allows for compact data storage without compromising space.

Memory IC Type: EEPROM

Being an EEPROM type provides non-volatile storage, ensuring data integrity even after power loss.

Maximum Standby Current: 0.000001 Amps

Very low standby current makes it suitable for low-power applications, enhancing battery life in portable devices.

Technical Specifications

EEPROM M24C01-RDS6G attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C01-RDS6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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