Loading...

M24512-HRMN6P

STMicroelectronics

M24512-HRMN6P by STMicroelectronics

M24512-HRMN6P by STMicroelectronics is a 64Kx8 EEPROM with a synchronous operating mode, ideal for industrial applications. It operates at 2.5V nominal and supports I2C communication, ensuring efficient data transfer. With a max temp of 85 °C and 1M write/erase cycles, it’s reliable for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,631

-

-

-

-

Digiode

USA . 1,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,050

-

-

-

-

Anansix

USA . 933 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

933

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,091 parts In-Stock

1+ parts

$3.186

100+ parts

-

1k+ parts

$2.867

10k+ parts

-

1,091

$3.186

-

$2.867

-

MKK Technologies

India . 909 parts In-Stock

1+ parts

$5.991

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$5.991

-

-

-

DigiPath Technology Company

USA . 909 parts In-Stock

1+ parts

$5.991

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$5.991

-

-

-

Microchip USA

USA . 151 parts In-Stock

1+ parts

$6.038

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$6.038

-

-

-

AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$9.070

100+ parts

-

1k+ parts

-

10k+ parts

-

587

$9.070

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,681 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,681

-

-

-

-

Corphita

USA . 2,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,272

-

-

-

-

Parana Technologies

USA . 776 parts In-Stock

1+ parts

-

100+ parts

$3.809

1k+ parts

-

10k+ parts

-

776

-

$3.809

-

-

Overview

Unlock unparalleled performance and reliability with the M24512-HRMN6P EEPROM from STMicroelectronics. Built to thrive in industrial environments, this advanced memory solution offers exceptional endurance and low power consumption, making it ideal for a wide range of applications—from automotive to smart devices. Trust in STMicroelectronics' legacy of innovation and quality to enhance your designs with durability and efficiency that stand the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight characteristics, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables efficient use of space on PCBs, supporting high-density designs.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into compact electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for efficient data transfer speeds, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 2.5V

Low nominal supply voltage promotes energy efficiency, making it ideal for battery-powered applications.

Power Supplies (V): 2/5

Flexible voltage supply options accommodate a wide range of systems and applications.

No. of Terminals: 8

Having 8 terminals helps in maintaining a compact package while providing sufficient connectivity.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes PCB space requirements, contributing to compact designs.

Maximum Operating Temperature: 85 °C

An extended maximum operating temperature makes it suitable for industrial applications.

Organization: 64KX8

The memory organization (64K x 8) provides ample storage capacity for various applications.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures ensures reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures good connectivity and long-term reliability.

I2C Control Byte: 1010DDDR

The I2C control byte offers flexibility for communication with multiple devices on the same bus.

Terminal Position: DUAL

Dual terminal position facilitates easy integration into various circuit designs.

Write Protection: HARDWARE

Hardware write protection ensures data integrity by preventing unintentional writes.

Maximum Seated Height: 1.75 mm

Low height allows for integration into space-constrained designs without compromising performance.

Maximum Clock Frequency (fCLK): 1 MHz

A 1 MHz clock frequency provides adequate speed for most common EEPROM applications.

Width: 3.9 mm

A compact width enhances the product's suitability for small form factor designs.

Minimum Supply Voltage (Vsup): 1.8V

The ability to operate at lower supply voltages contributes to overall energy efficiency.

Length: 4.9 mm

A short length contributes to a smaller footprint, perfect for densely packed circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grading means reliability in a wider range of environmental conditions.

Technology: CMOS

CMOS technology supports low power consumption and good performance, ideal for modern applications.

Parallel or Serial: SERIAL

Serial communication reduces pin count and simplifies PCB layout compared to parallel interfaces.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and improved mechanical strength.

Maximum Supply Current: 5 mA

Low maximum supply current ensures less heat generation and extends battery life in portable devices.

No. of Words: 65536 words

The ability to store 65536 words enhances the product's utility in various memory applications.

Memory Width: 8

8-bit memory width optimizes space for typical data storage requirements.

Minimum Data Retention Time: 40 years

A minimum data retention time of 40 years ensures long-lasting data preservation.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB layout and component placement.

No. of Words Code: 64K

This well-regarded memory size optimally fits various embedded applications.

Maximum Supply Voltage (Vsup): 5.5V

A generous maximum supply voltage supports a variety of system power needs.

Endurance: 1000000 Write/Erase Cycles

With high endurance, this EEPROM is suitable for applications requiring frequent updates.

Serial Bus Type: I2C

I2C support allows for easy integration with a variety of devices in a multi-device environment.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances responsiveness and performance in real-time applications.

Memory Density: 524288 bit

High memory density aligns with more demanding applications requiring substantial storage.

Memory IC Type: EEPROM

As an EEPROM, it combines data retention with the ability to be electrically erased and rewritten.

Maximum Standby Current: 0.000001 Amp

Ultra-low standby current maintains energy efficiency, ideal for battery-operated systems.

Technical Specifications

EEPROM M24512-HRMN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24512-HRMN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20