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M24256-BRDW6P

STMicroelectronics

M24256-BRDW6P by STMicroelectronics

M24256-BRDW6P by STMicroelectronics is a 32Kx8 EEPROM with a synchronous operating mode, ideal for industrial applications. It operates b/w 1.8V and 5.5V, supports I2C communication, and endures up to 1M write/erase cycles. Its compact design features an 8-terminal gull-wing package for efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 212,484 parts In-Stock

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Vyrian

USA . 6,773 parts In-Stock

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6,773

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Digiode

USA . 3,309 parts In-Stock

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3,309

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Anansix

USA . 1,788 parts In-Stock

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IDEA Electronic Components Group

UK . 1,701 parts In-Stock

1+ parts

$2.957

100+ parts

-

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$2.661

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1,701

$2.957

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$2.661

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MKK Technologies

India . 1,711 parts In-Stock

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$5.560

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1,711

$5.560

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DigiPath Technology Company

USA . 1,711 parts In-Stock

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$5.560

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1,711

$5.560

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AZTECH Wire

Italy . 574 parts In-Stock

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$8.800

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574

$8.800

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Microchip USA

USA . 4,173 parts In-Stock

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$19.228

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4,173

$19.228

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A-Z Elektronik GmbH

Germany . 5,415 parts In-Stock

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5,415

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Alle Elektronik GmbH

Germany . 3,610 parts In-Stock

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3,610

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Corphita

USA . 1,973 parts In-Stock

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Parana Technologies

USA . 1,458 parts In-Stock

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$3.535

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$3.535

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Unlock unparalleled reliability and performance with the M24256-BRDW6P EEPROM from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers this compact solution ideal for industrial applications, ensuring efficient data storage in demanding environments. With robust endurance and low power consumption, this EEPROM empowers your designs while providing peace of mind through its hardware write protection—perfect for applications needing durability and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and facilitates automated assembly.

Package Shape: RECTANGULAR

The rectangular package shape is standard, making it easy to integrate into PCB layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances performance by allowing for efficient data transfers.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V is suitable for low-power applications.

Power Supplies (V): 2/5

Supports a range of supply voltages, providing flexibility in design.

No. of Terminals: 8

The 8-terminal configuration is standard and allows for easy connectivity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style minimizes space requirements on PCBs, making it ideal for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this EEPROM suitable for industrial applications.

Organization: 32KX8

Organization of 32Kx8 allows for efficient storage and retrieval of data.

Minimum Operating Temperature: -40 °C

A wide operating temperature range enables the EEPROM to function in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish enhances solderability and increases contact reliability.

I2C Control Byte: 1010DDDR

I2C interface allows for easy integration into multiple devices with minimal complexity.

Terminal Position: DUAL

Dual terminal positioning provides versatile mounting options for various applications.

Write Protection: HARDWARE

Hardware write protection safeguards critical data against unintended alterations.

Maximum Seated Height: 1.2 mm

The low height profile is advantageous in space-constrained applications.

Maximum Clock Frequency (fCLK): 0.4 MHz

The clock frequency is sufficient for moderate-speed operations without overwhelming power consumption.

Width: 3 mm

Compact width allows for denser component placements on PCBs.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8 V is suitable for battery-operated devices.

Peak Reflow Temperature °C: 260

High reflow temperature rating ensures compatibility with modern lead-free soldering processes.

Length: 4.4 mm

Short length contributes to the versatility of placement options on printed circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliable performance in demanding environments.

Technology: CMOS

CMOS technology provides low power consumption and high-density integration.

Parallel or Serial: SERIAL

Serial interface simplifies the connection in designs where pin count is a concern.

Terminal Form: GULL WING

Gull wing terminals enhance mechanical stability and reliability in mounting.

Maximum Supply Current: 5 mA

Low supply current keeps power requirements minimal, extending battery life.

No. of Words: 32768 words

Large storage capacity provides ample space for data storage needs.

Memory Width: 8

8-bit memory width aligns with modern data bus standards for ease of integration.

Minimum Data Retention Time: 40

With a minimum retention time of 40 years, reliability in data storage is assured.

Terminal Pitch: 0.65 mm

Standard terminal pitch facilitates compatibility with common PCB designs.

No. of Words Code: 32K

The clear organization into 32K words allows for efficient memory management.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum voltage rating provides significant headroom for power stability.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures long-term reliability and suitability for frequent data updates.

Serial Bus Type: I2C

I2C bus support allows for easy communication in multi-device configurations.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time ensures quick data updates, enhancing overall performance.

Memory Density: 262144 bit

High memory density maximizes storage in minimal physical space.

Memory IC Type: EEPROM

As an EEPROM type, it provides non-volatile storage ideal for critical data retention.

Maximum Standby Current: 0.000001 Amp

Minimal standby current helps preserve battery life in portable applications.

Technical Specifications

EEPROM M24256-BRDW6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24256-BRDW6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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