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LSM9DS1

STMicroelectronics

LSM9DS1 by STMicroelectronics

LSM9DS1 by STMicroelectronics is a 24-terminal IC with a supply voltage range of 1.9V to 3.6V, operating b/w -40°C to 85°C. It features a compact rectangular package suitable for industrial applications, offering precise analog circuit functionality in a surface-mount grid array design.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 35,470 parts In-Stock

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35,470

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Digiode

USA . 4,089 parts In-Stock

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4,089

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Bristol Electronics

USA . 3,050 parts In-Stock

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3,050

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Anansix

USA . 1,193 parts In-Stock

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1,193

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Vyrian

USA . 510 parts In-Stock

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510

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Nova Conductors

Japan . 48 parts In-Stock

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 898 parts In-Stock

1+ parts

$1.500

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898

$1.500

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IDEA Electronic Components Group

UK . 1,910 parts In-Stock

1+ parts

$6.829

100+ parts

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$6.146

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1,910

$6.829

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$6.146

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AZTECH Wire

Italy . 731 parts In-Stock

1+ parts

$10.728

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731

$10.728

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MKK Technologies

India . 1,386 parts In-Stock

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$12.842

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1,386

$12.842

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DigiPath Technology Company

USA . 1,386 parts In-Stock

1+ parts

$12.842

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1,386

$12.842

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Corphita

USA . 3,040 parts In-Stock

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3,040

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Lixinc

USA . 2,419 parts In-Stock

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2,419

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Parana Technologies

USA . 398 parts In-Stock

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$8.165

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398

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$8.165

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Overview

Elevate your projects with the cutting-edge LSM9DS1 by STMicroelectronics, a top-tier manufacturer known for high-quality products. This versatile sensor offers unparalleled precision and reliability, making it ideal for a wide range of applications in the semiconductor industry. With its advanced technology and innovative design, the LSM9DS1 provides unmatched value and performance, giving customers a competitive edge in their projects. Experience the benefits of this exceptional product and take your creations to new heights with the LSM9DS1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good mechanical strength and thermal conductivity, making the product durable and reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 2.2 V

The 2.2V supply voltage ensures efficient power usage and compatibility with a wide range of voltage requirements in different devices.

Maximum Operating Temperature: 85 °C

The product can operate at high temperatures, making it suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

The product can withstand low temperatures, enabling reliable performance in cold environments or during temperature fluctuations.

Width (mm): 3 mm

The slim width of 3mm allows for compact design and efficient placement of the product on circuit boards with limited space.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures that the product can perform reliably in harsh operating conditions typically found in industrial settings.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V enables compatibility with devices that require higher voltage inputs, expanding the product's versatility.

Technical Specifications

Other Function Semiconductors LSM9DS1 attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B24

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.027 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.9 V

Nominal Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.43 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LSM9DS1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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